US Patent:
20030199638, Oct 23, 2003
Inventors:
Puwei Liu - San Diego CA, US
Stephen Dershem - San Diego CA, US
Kang Yang - San Diego CA, US
Carolyn Albino - San Diego CA, US
International Classification:
C08F002/00
Abstract:
In accordance with the present invention, there are provided film adhesive compositions comprising at least one macromonomer having at least one unit of ethylenic unsaturation, at least one thermoplastic elastomer co-curable with the macromonomer, and at least one cure initiator, and methods for use thereof. Invention compositions are useful as adhesives in the microelectronics industry. In particular, invention film adhesives may be used to produce microelectronic assemblies with very thin bond lines without compromising adhesive strength.