Carlos J Ortiz

6596888, Jul 22, 2003

May 15, 2001

09/858037

Lisa McElwee-White - Gainesville FL
Timothy J. Anderson - Gainesville FL
Steven W. Johnston - San Jose CA
Carlos G. Ortiz - Houston TX
Omar J. Bchir - Gainesville FL

University of Florida - Gainesville FL

C07F 1100

556 59, 556 57, 546 2, 549206, 427255394, 427593, 106 105, 106 122, 106 125

Single imido tungsten imido precursors are described for the deposition of tungsten nitride on a substrate by processes such as metal organic chemical vapor deposition. The precursors may be employed to form diffusion barrier layers on microelectronic devices. A method for forming tungsten nitride layers includes the steps of providing a tungsten imido species having the formula L W(NR)X , where R is a carbon containing group, y is an integer between 0 and 5, n is an integer between 0 and 4 and L and X are selected from the group of non-imido ligands. The single imido tungsten imido species is flowed to a surface of a substrate where the single imido tungsten imido species decomposes to form a tungsten nitride layer.

6946531, Sep 20, 2005

Sep 18, 2003

10/664677

David D. Graf - Midland MI, US
Jerzy Klosin - Midland MI, US
Timothy A. Herzog - South Charleston WV, US
Peter N. Nickias - Midland MI, US
Carlos G. Ortiz - Houston TX, US
Jorge Soto - Midland MI, US
Ravi B. Shankar - Midland MI, US
Daniel D. VanderLende - Sugar Land TX, US

Dow Global Technologies Inc. - Midland MI

C08F004/72
B01J031/38

526160, 526161, 526943, 502117, 502152, 502155

Low molecular weight olefin polymers are prepared by a polymerization process employing titanium complexes comprising a 3-aryl-substituted cyclopentadienyl ring or substituted derivatives thereof as polymerization catalysts.

7144934, Dec 5, 2006

Oct 22, 2003

10/691163

Carlos Gilberto Ortiz - Houston TX, US
Peter Anthony Fox - Galveston TX, US
Raymond L. Laakso - St. Francisville LA, US
Gary Robert Marchand - Gonzales LA, US
Steven R. Oriani - Landenberg PA, US
Walter Werner Schmiegel - Wilmington DE, US
Michael K. Laughner - Lake Jackson TX, US
Deepak R. Parikh - Singapore, SG

Dow Global Technologies Inc. - Midland MI

C08K 5/17
H01B 7/00

524 99, 524140, 524251, 524554, 524570, 524579, 528490, 528492, 174110 SR, 174137 B

Olefinic interpolymer compositions comprising the olefinic interpolymer, residuals from a transition metal catalyst and boron containing activator package, and a charge dissipation modifier and methods for making them. The compositions have dissipation factors that are at least 50% less than the corresponding olefinic interpolymer compositions which have not been treated with charge dissipation modifiers. The compositions are useful in wire and cable applications.

7235624, Jun 26, 2007

Aug 23, 2006

11/508710

Carlos Gilberto Ortiz - Houston TX, US
Peter Anthony Fox - Galveston TX, US
Gary R. Marchand - Lake Jackson TX, US
Steven R. Oriani - Landenberg PA, US
Walter Werner Schmiegel - Wilmington DE, US
Michael K. Laughner - Lake Jackson TX, US
Deepak R. Parikh - Singapore, SG

Dow Global Technologies Inc. - Midland MI

C08F 6/00
C08K 5/17
H01B 7/00

528492, 528490, 526 65, 524 99, 524140, 524251, 524554, 524570, 524579, 174110 SR, 174137 B

Olefinic interpolymer compositions comprising the olefinic interpolymer, residuals from a transition metal catalyst and boron containing activator package, and a charge dissipation modifier and methods for making them. The compositions have dissipation factors that are at least 50% less than the corresponding olefinic interpolymer compositions which have not been treated with charge dissipation modifiers. The compositions are useful in wire and cable applications.

7384994, Jun 10, 2008

May 22, 2007

11/751906

Carlos Gilberto Ortiz - Houston TX, US
Peter Anthony Fox - Galveston TX, US
Gary R. Marchand - Lake Jackson TX, US
Steven R. Oriani - Landenberg PA, US
Walter Werner Schmiegel - Wilmington DE, US
Michael K. Laughner - Lake Jackson TX, US
Deepak R. Parikh - Singapore, SG

Dow Global Technologies Inc. - Midland MI

C08K 5/17
H01B 7/00

524 99, 524140, 524251, 524518, 524554, 524570, 524579, 528490, 528492, 174110 SR, 174137 B

Olefinic interpolymer compositions comprising the olefinic interpolymer, residuals from a transition metal catalyst and boron containing activator package, and a charge dissipation modifier and methods for making them. The compositions have dissipation factors that are at least 50% less than the corresponding olefinic interpolymer compositions which have not been treated with charge dissipation modifiers. The compositions are useful in wire and cable applications.

20160227043, Aug 4, 2016

Apr 8, 2016

15/094433

- Houston TX, US
John Abraham - Katy TX, US
David Walsh - Austin TX, US
Carlos Ortiz - Round Rock TX, US
Chris Murphy - Austin TX, US

H04M 15/00
H04M 3/42
H04M 7/00
H04M 3/22

A method of provisioning a plurality of applications from different application developer systems to a network provider system comprises establishing a plurality of service accounts for a corresponding plurality of application service provider systems, receiving a plurality of API interfaces from the plurality of application service provider systems, integrating, by the processor system, each of the plurality of API interfaces with a unified services platform API interface, receiving a provider API interfaces for a network provider system, and integrating the provider API interface with the unified services platform API interface. The plurality of application service provider systems provide services for use in association with a telephone number of a subscriber of telecommunication services. At least two of the API interfaces are different, and at least one of the plurality of API interfaces from the plurality of application service provider systems is not compatible with the provider API interface.