Bruce Todd Block

7251389, Jul 31, 2007

Sep 26, 2005

11/234930

Daoqiang Lu - Chandler AZ, US
Bruce A. Block - Portland OR, US
Dongming He - Gilbert AZ, US

Intel Corporation - Santa Clara CA

G02B 6/12

385 14

An apparatus and method for embedding a laser source on a semiconductor substrate and an optical interconnect to couple the laser source to internal components of the semiconductor substrate. An on-die waveguide is integrated on the semiconductor substrate. A package waveguide is disposed on the semiconductor substrate and evanescently coupled to the on-die waveguide. The laser source is embedded within the packaged waveguide to provide an optical signal to the on-die waveguide via the package waveguide.

20170131469, May 11, 2017

Nov 15, 2016

15/352520

- Santa Clara CA, US
Henning Braunisch - Chandler AZ, US
Shawna M. Liff - Gilbert AZ, US
Peter L. Chang - Portland OR, US
Bruce A. Block - Portland OR, US
Johanna M. Swan - Scottsdale AZ, US

G02B 6/12
H01L 25/16
H04B 10/25
H01L 23/498
G02B 6/42
H04B 10/40

Photonic components are placed on the processor package to bring the optical signal close to the processor die. The processor package includes a substrate to which the processor die is coupled, and which allows the processor die to connect to a printed circuit board. The processor package also includes transceiver logic, electrical-optical conversion circuits, and an optical coupler. The electrical-optical conversion circuits can include laser(s), modulator(s), and photodetector(s) to transmit and receive and optical signal. The coupler interfaces to a fiber that extends off the processor package. Multiple fibers can be brought to the processor package allowing for a scalable high-speed, high-bandwidth interconnection to the processor.