Bouwe W Leenstra

6448169, Sep 10, 2002

Dec 21, 1995

08/576185

William Brearley - Poughkeepsie NY
Laertis Economikos - Wappingers Falls NY
Paul F. Findeis - Glenham NY
Kimberley A. Kelly - Poughkeepsie NY
Bouwe W. Leenstra - Walden NY
Arthur Gilman Merryman - Hopewell Junction NY
Eric Daniel Perfecto - Poughkeepsie NY
Chandrika Prasad - Wappingers Falls NY
James Patrick Wood - Beacon NY
Roy Yu - Wappingers Falls NY

International Business Machines Corporation - Armonk NY

H01L 2144

438612, 438613, 438614, 438615, 438616, 22818022

An apparatus for use in manufacturing a semiconductor device includes an input-output (IO) face having a plurality of IO lands, and is situated in an operating position in abutting relation with a depositor. The apparatus includes a first holding member holding the depositor in a first position; a second holding member holding the semiconductor device in the operating position. The depositor and the semiconductor device cooperate in the operating position to deposit solder ball connection structures to the IO lands. The apparatus further includes a separating member for moving at least one of the depositor and the semiconductor device from the operating position to an interim orientation. The interim orientation establishes a separation distance intermediate the depositor and the semiconductor device appropriate to disengage the solder ball connecting structures from the depositor.

6678949, Jan 20, 2004

Jun 21, 2001

09/886326

Chandrika Prasad - Wappingers Falls NY
Roy Yu - Poughkeepsie NY
Richard L. Canull - Pleasant Valley NY
Giulio DiGiacomo - Hopewell Junction NY
Ajay P. Giri - Poughkeepsie NY
Lewis S. Goldmann - Bedford NY
Kimberley A. Kelly - Poughkeepsie NY
Bouwe W. Leenstra - Walden NY
Voya R. Markovich - Broome NY
Eric D. Perfecto - Poughkeepsie NY
Sampath Purushothaman - Yorktown Heights NY
Joseph M. Sullivan - Wappingers Falls NY

International Business Machines Corporation - Armonk NY

H05K 334

29840, 29843, 29854, 29857, 29878, 29879, 174262, 174260, 174263

A structure for mounting electronic devices. The structure uses a non-conductive, compliant spacer interposed between an underlying carrier and an overlying thin film. The spacer includes a pattern of through-vias which matches opposing interconnects on opposing surfaces of the carrier and the thin film. In this way, solder connections can extend in the through-vias to electrically connect the thin film to the carrier and smooth out topography. In a related process for forming the structure, the thin film is built on a first sacrificial carrier and then further processed on a second sacrificial carrier to keep it from distorting, expanding, or otherwise suffering adversely during its processing. The solder connections between the thin film and the carrier are formed using a closed solder joining process. The spacer is used with laminate cards to create thermal stress release structures on portions of the cards carrying a thin film.

7401637, Jul 22, 2008

Jul 28, 2006

11/495966

Glen N. Biggs - Wappingers Falls NY, US
John J. Garant - Poughkeepsie NY, US
Peter A. Gruber - Mohegan Lake NY, US
Bouwe W. Leenstra - Walden NY, US
Christopher L. Tessler - Poughquag NY, US
Thomas Weiss - Poughkeepsie NY, US

International Business Machines Corporation - Armonk NY

B22D 18/00

164119, 164306, 228 33

A new pressure-only molten metal valving apparatus and method is provided. This novel approach to controlling the flow of liquids eliminates the need for active, moving valve components. Using the natural surface tension properties of liquids, the gas pressure either activates liquid flow when a threshold is overcome or retains the liquid in a head, even when lifted.

20090242614, Oct 1, 2009

Mar 27, 2008

12/056573

GLEN N. BIGGS - WAPPINGERS FALLS NY, US
RUSSELL A. BUDD - NORTH SALEM NY, US
JOHN J. GARANT - POUGHKEEPSIE NY, US
PETER A. GRUBER - MOHEGAN LAKE NY, US
BOUWE W. LEENSTRA - WALDEN NY, US
PHILLIP W. PALMATIER - HOPEWELL JUNCTION NY, US
CHRISTOPHER L. TESSLER - POUGHQUAG NY, US
THOMAS WEISS - POUGHKEEPSIE NY, US

INTERNATIONAL BUSINESS MACHINES CORPORATION - ARMONK NY

B23K 1/20
B23K 3/06

228176, 228 33

A tool and method is provided for repositioning a solder injection head. The tool includes a first moveable platform positioned on a first side of a workpiece chuck and a second moveable platform positioned on a second side of the workpiece chuck. A solder injection head has a seal configured to seal molten solder within the solder injection head when contacting a surface of the first moveable platform or the second moveable platform. The method includes moving a workpiece chuck and a starting platform to a position such that the starting platform is at a finishing position and a finishing platform is in a starting position.

20110049759, Mar 3, 2011

Sep 1, 2009

12/551755

John J. Garant - Hopewell Junction NY, US
Robert G. Haas - Hopewell Junction NY, US
Bouwe W. Leenstra - Hopewell Junction NY, US
Phillip W. Palmatier - Hopewell Junction NY, US

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

B29C 45/14
B29C 45/77

264259, 425563

A bond metal injection tool can include a fill head having a sealed chamber for containing a molten bond metal (e.g., solder) and a gas, and a nozzle for directing a flow of the molten bond metal into cavities in a major surface of a mold. A pressure control device can controllably apply pressure within the chamber to eject the bond metal from the nozzle into the cavities. The pressure control device may also controllably reduce a pressure within the chamber to inhibit the bond metal from being ejected from the nozzle, such as when the fill head is being moved onto the mold surface from a parking location or when the fill head is being moved off the mold surface onto a parking location.

57225796, Mar 3, 1998

Apr 26, 1996

8/638415

Roy Yu - Wappingers Falls NY
James Patrick Wood - Beacon NY
Thomas Michael Biruk - Staatsburg NY
Gregory Scott Boettcher - Hopewell Junction NY
William Harrington Brearley - Poughkeepsie NY
Kimberley Ann Kelly - Poughkeepsie NY
Bouwe William Leenstra - Walden NY
Arthur Gilman Merryman - Hopewell Junction NY

International Business Machines Corporation - Armonk NY

B23K 1018
B23K 3102

228119

Multi-chip modules provided with a pin array may, under close scrutiny, display certain defects that may cause reliability problems. The presence of even one such defect necessitates the scrapping of the module. A method of salvaging the module is described, wherein the module is reworked by the method comprising the steps of applying a shearing force against the pins. During which the module is exposed to a temperature at or above that which is necessary for softening the braze material to remove the pins; polishing the surface of the module including the pads; evaporating the new pads; and attaching new pins to the pads.

60999357, Aug 8, 2000

Dec 15, 1995

8/573469

William Brearley - Poughkeepsie NY
Laertis Economikos - Wappingers Falls NY
Paul F. Findeis - Glenham NY
Kimberley A. Kelly - Poughkeepsie NY
Bouwe W. Leenstra - Walden NY
Arthur Gilman Merryman - Hopewell Juction NY
Eric Daniel Perfecto - Poughkeepsie NY
Chandrika Prasad - Wappingers Falls NY
James Patrick Wood - Beacon NY
Roy Yu - Wappingers Falls NY

International Business Machines Corporation - Armonk NY

B23K 3102

428119

An apparatus for use in manufacturing a semiconductor device having input-output (IO) lands arranged in an IO array on an IO face includes a body having a plurality of cavities extending from an operating face into the body; the cavities are arranged in a cavity loci array which is in registeration with the IO lands when the apparatus is in a manufacturing position with the operating face generally adjacent the IO face. Each cavity has a depth and a lateral expanse which cooperate to establish a volume defined by a cavity bottom and at least one cavity wall. The volume accommodates an appropriate amount of solder material to establish a measure of the solder material on a facing IO land when the apparatus is in the manufacturing position. The depth is appropriate to facilitate wettingly attracting the solder material to the facing IO land when the apparatus is in the manufacturing position and the semiconductor device and the apparatus are exposed to appropriate ambient conditions to effect reflow of the solder material. The invention also includes a method for using the apparatus in manufacturing a semiconductor device.

62814524, Aug 28, 2001

Dec 3, 1998

9/204851

Chandrika Prasad - Wappingers Falls NY
Roy Yu - Poughkeepsie NY
Richard L. Canull - Pleasant Valley NY
Giulio DiGiacomo - Hopewell Junction NY
Ajay P. Giri - Poughkeepsie NY
Lewis S. Goldmann - Bedford NY
Kimberley A. Kelly - Poughkeepsie NY
Bouwe W. Leenstra - Walden NY
Voya R. Markovich - Broome NY
Eric D. Perfecto - Poughkeepsie NY
Sampath Purushothaman - Yorktown Heights NY
Joseph M. Sullivan - Wappingers Falls NY

International Business Machines Corporation - Armonk NY

H01R 1204
H05K 1111

174262

A structure for mounting electronic devices which uses a non-conductive, compliant spacer interposed between an underlying carrier and an overlying thin film. The spacer includes a pattern of through-vias which matches opposing interconnects on opposing surfaces of the carrier and the thin film. In this way, solder connections can extend in the through-vias to electrically connect the thin film to the carrier and smooth out topography. In a related process for forming the structure, the thin film is built on a first sacrificial carrier and then further processed on a second sacrificial carrier to keep it from distorting, expanding, or otherwise suffering adversely during its processing. The solder connections between the thin film and the carrier are formed using a closed solder joining process. The spacer is used with laminate cards to create thermal stress release structures on portions of the cards carrying a thin film.