Blanquita Morange

6478076, Nov 12, 2002

Jul 24, 2001

09/912842

Blanquita Ortega Morange - Poway CA

Unisys Corporation - Blue Bell PA

F28F 700

165 804, 165133

A mechanical assembly is comprised of a heat exchanger for an integrated circuit. In the assembly, a retainer for a liquid has a bottom with an opening thru which the heat exchanger extends such that a face of the heat exchanger is surrounded by the retainer. Also in the assembly, a compliant member forms a seal for the liquid between the heat exchanger and the retainer. This mechanical assembly is useful in fabricating an alloy film on the heat exchangers face.

6513239, Feb 4, 2003

Jul 24, 2001

09/912836

Blanquita Ortega Morange - Poway CA

Unisys Corporation - Blue Bell PA

B23P 1526

2989003, 29460, 427 96, 427310, 427290

An alloy film is fabricated, on the face of a heat exchanger for an integrated circuit, by a process that dispenses various liquids onto the heat exchangers face. To prevent those liquids from falling off of the heat exchangers face onto other components which hold the heat exchanger on a frame, the process begins by combining the heat exchanger into an assembly that includes a retainer and a compliant member. The retainer catches any liquids that fall off the heat exchangers face, and the compliant member forms a seal between the heat exchanger and the retainer which prevents the liquids from leaking onto the other components.

6658736, Dec 9, 2003

Aug 9, 2002

10/215992

James Wittman Babcock - Escondido CA
Jerry Ihor Tustaniwskyj - Mission Viejo CA
Blanquita Ortega Morange - Poway CA

Unisys Corporation - Blue Bell PA

B23P 1526

2989003, 29458, 165 803, 165185

A heat exchanger, for regulating the temperature of multiple integrated circuit modules, is fabricated by constructing a face on a hollow jacket such that the face consists essentially of a malleable metal with a coating of a release agent. In one embodiment, the malleable metal is fabricated as a foil which is attached to the jacket by an adhesive, and the coating is fabricated as a powder of the release agent which is rubbed into the surface of the foil.

6822465, Nov 23, 2004

Aug 9, 2002

10/215993

James Wittman Babcock - Escondido CA
Jerry Ihor Tustaniwskyj - Mission Viejo CA
Blanquita Ortega Morange - Poway CA

Unisys Corporation - Blue Bell PA

G01R 3102

324760, 165 802, 361705, 361718

The temperature of multiple integrated circuit modules is regulated by a heat exchanger which is sequentially squeezed against, and separated from, a respective uneven contact surface on each of the modules. The heat exchanger has a face of a malleable metal that stays in a solid state and deforms while the squeezing occurs. The surface of the malleable metal has a coating of a release agent that prevents the malleable metal from sticking to the contact surface.

7004243, Feb 28, 2006

Jul 22, 2003

10/625051

James Wittman Babcock - Escondido CA, US
Jerry Ihor Tustaniwskyj - Mission Viejo CA, US
Blanquita Ortega Morange - Poway CA, US
Lorraine Lo-Lan Wing - Escondido CA, US

Unisys Corporation - Blue Bell PA

F28F 7/00

165185, 165 803, 361688, 257706

A heat-exchanger in a chip tester includes an electric heater and a heatsink which are joined together with a layer of an attach material. The operational period of this heat-exchanger is extended by a method which includes the steps of: 1) testing chips in the chip tester in a manner that puts the heat-exchanger through multiple temperature changes which keep the layer in a solid state and which induce stress-cracks in the layer; 2) subjecting the layer to a crack-healing temperature cycle in which the layer is melted at least partially and re-solidified; and thereafter, 3) repeating the testing step.

53232941, Jun 21, 1994

Mar 31, 1993

8/040732

Wilbur T. Layton - San Diego CA
Blanquita O. Morange - San Diego CA
Angela M. Torres - Vista CA

Unisys Corporation - Blue Bell PA

H05K 720

361699

An integrated circuit package has an integrated circuit chip, a substrate which holds the chip, and a novel heat conduction mechanism which is coupled to the chip and which provides a path for conducting heat from the chip to a fluid medium. This heat conduction mechanism is characterized as including a) a compliant body, having microscopic voids throughout, which is disposed in and fills a gap in the heat conducting path, and b) a liquid metal alloy that is absorbed by and partially fills the microscopic voids of the compliant body. Due to the presence of the liquid metal alloy, the thermal conductivity through the body is high. Also, due to the voids in the body being only partially filled with the liquid metal alloy, the body can be compressed by dimensional variations within the integrated circuit package without squeezing out any of the liquid metal alloy that is held therein.

56588313, Aug 19, 1997

Jun 6, 1995

8/471470

Wilber Terry Layton - San Diego CA
Blanquita Ortega Morange - San Diego CA
Angela Marie Torres - Vista CA
James Andrew Roecker - Escondido CA

Unisys Corporation - Blue Bell PA

H01L 2160

29832

An integrated circuit package includes an integrated circuit chip, a substrate which holds the chip, and a heat conduction mechanism which provides a path for conducting heat from the chip to a fluid medium; wherein the heat conduction mechanism is characterized as having a pressed joint which is comprised of: 1) a member that is made primarily of aluminum or copper, having a solid polysiloxane coating of less than 200. ANG. thickness, and 2) a liquid metal alloy in contact with the coating. This solid coating, on the aluminum or copper member, is fabricated without any expensive equipment by the steps of: 1) forming a liquid coating of a polysiloxane solution on the aluminum or copper member; and 2) baking that member with its liquid coating at temperatures of 100. degree. C. -300. degree. C. for 0. 5 hours-3. 0 hours. Thereafter the integrated circuit package is completed by placing the member with its solid coat in the heat conducting path such that a liquid metal alloy is in contact with the solid coat.

54593522, Oct 17, 1995

May 10, 1994

8/240543

Wilber T. Layton - San Diego CA
Blanquita O. Morange - San Diego CA
Angela M. Torres - Vista CA
James A. Roecker - Escondido CA

Unisys Corporation - Blue Bell PA

H01L 3902
H01L 2302

257724

An integrated circuit package includes an integrated circuit chip, a substrate which holds the chip, and a heat conduction mechanism which provides a path for conducting heat from the chip to a fluid medium; wherein the heat conduction mechanism is characterized as having a pressed joint which is comprised of: 1) a member that is made primarily of aluminum or copper, having a solid polysiloxane coating of less than 200. ANG. thickness, and 2) a liquid metal alloy in contact with the coating. This solid coating, on the aluminum or copper member, is fabricated without any expensive equipment by the steps of: 1) forming a liquid coating of a polysiloxane solution on the aluminum or copper member; and 2) baking that member with its liquid coating at temperatures of 100. degree. C. -300. degree. C. for 0. 5 hours-3. 0 hours. Thereafter the integrated circuit package is completed by placing the member with its solid coat in the heat conducting path such that a liquid metal alloy is in contact with the solid coat.