Inventors:
Barry Arsenault - Burlington MA
Jason Bundas - Merrimack NH
Mani Sundaram - Nashua NH
Rick Thompson - Amherst NH
Alan Tobey - Billerica MA
Richard Williams - Hollis NH
Assignee:
Teraconnect, Inc. - Nashua NH
International Classification:
G02B 600
US Classification:
385134, 385135, 385 14, 25022711
Abstract:
The present invention features a packaging system for two-dimensional optoelectronic arrays. In one embodiment, the packaging includes a heat spreader, a housing with embedded electrical interconnections, a substrate including electrical contacts, an application specific integrated circuit (ASIC) including a hybridized array with vertical cavity surface emitting laser (VCSEL), detectors or both. The waveguide assembly includes a plurality of individual one-dimensional waveguides formed in waveguide sheets, wherein the waveguides match the array footprint on one end and a connector footprint on the other end.