Resumes
Resumes
Anandaroop Bhattacharya Phones & Addresses
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451 Flamingo Dr, Chandler, AZ 85248
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Hillsboro, OR
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Gilbert, AZ
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3830 Lakewood Pkwy, Phoenix, AZ 85048 (480) 664-7172
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Boulder, CO
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3830 Lakewood Pkwy E, Phoenix, AZ 85048 (480) 241-0614
Work
Position:
Precision Production Occupations
Education
Degree:
High school graduate or higher
Publications
Us Patents
Electronic Package With Thermally-Enhanced Lid
View pageUS Patent:
7183642, Feb 27, 2007
Filed:
Sep 11, 2002
Appl. No.:
10/241994
Inventors:
Anandaroop Bhattacharya - Phoenix AZ, US
Varaprasad V. Calmidi - Vestal NY, US
Sanjeev B. Sathe - Johnson City NY, US
Varaprasad V. Calmidi - Vestal NY, US
Sanjeev B. Sathe - Johnson City NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 23/36
H01L 23/34
H01L 31/024
H01L 23/34
H01L 31/024
US Classification:
257717, 257713, 257712, 257675, 257E2308, 257E23101
Abstract:
Removing heat generated by an operating IC chip from both the chip and the electronics package containing the chip is essential for proper system operation and to increase the life of the electronics package. Using an air permeable lid with the electronic package increases the heat transfer away from the IC chip and electronics package, thereby cooling the chip and the package.
Thermal Management Arrangement For Standardized Peripherals
View pageUS Patent:
7251139, Jul 31, 2007
Filed:
Nov 26, 2003
Appl. No.:
10/723722
Inventors:
Anandaroop Bhattacharya - Phoenix AZ, US
Chia-pin Chiu - Tempe AZ, US
Sridhar V. Machiroutu - Santa Clara CA, US
Chia-pin Chiu - Tempe AZ, US
Sridhar V. Machiroutu - Santa Clara CA, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 7/20
H05K 1/14
H05K 1/14
US Classification:
361719, 361692, 361694, 361720, 361737, 165 803, 16510433
Abstract:
Embodiments of the present invention include an apparatus, method and system for a thermal management arrangement in a standardized peripheral device.
Enhanced Heat Exchanger
View pageUS Patent:
20050103480, May 19, 2005
Filed:
Nov 18, 2003
Appl. No.:
10/716734
Inventors:
Himanshu Pokharna - San Jose CA, US
Anandaroop Bhattacharya - Phoenix AZ, US
Anandaroop Bhattacharya - Phoenix AZ, US
International Classification:
H05K007/20
US Classification:
165122000, 361697000, 361701000, 415178000
Abstract:
According to some embodiments, an enhanced heat exchanger may be used to dissipate heat.
Thermal Management Device For An Integrated Circuit
View pageUS Patent:
20050111188, May 26, 2005
Filed:
Nov 26, 2003
Appl. No.:
10/723533
Inventors:
Anandaroop Bhattacharya - Phoenix AZ, US
Ravi Prasher - Tempe AZ, US
Jerome Garcia - Chandler AZ, US
Suzana Prstic - Chandler AZ, US
Ravi Prasher - Tempe AZ, US
Jerome Garcia - Chandler AZ, US
Suzana Prstic - Chandler AZ, US
International Classification:
H05K007/20
US Classification:
361699000, 361708000, 165080200, 165080500
Abstract:
Embodiments of the present invention include an apparatus, method, and system for an electronic assembly with a thermal management device including a porous medium.
Aerodynamic Memory Module Cover
View pageUS Patent:
20050196904, Sep 8, 2005
Filed:
Mar 5, 2004
Appl. No.:
10/794129
Inventors:
Anandaroop Bhattacharya - Phoenix AZ, US
Chia-Pin Chiu - Tempe AZ, US
Chia-Pin Chiu - Tempe AZ, US
International Classification:
H01L023/12
H01L021/48
H01L021/48
US Classification:
438125000, 257704000
Abstract:
Adjacent integrated circuit chips in processor-based systems may be covered with a metal foil cover. The cover may make air flow over the chips more aerodynamic, improving thermal heat transfer and cooling. This may improve performance and reduce power consumption, all without significantly increasing the size of the components.