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Amitesh Saha Phones & Addresses

  • Phoenix, AZ
  • Milwaukee, WI
  • Kingston, RI

Work

Company: Intel corporation Mar 31, 2017 Position: Technology development quality and reliability r and d engineer - thermals

Education

Degree: Doctorates, Doctor of Philosophy School / High School: University of Rhode Island 2010 to 2015 Specialities: Chemical Engineering, Philosophy

Skills

Nanotechnology • Chemical Engineering • Characterization • Materials Science • Tem • Powder X Ray Diffraction • Catalysis • Mass Spectrometry • Polymers • Tga • Scanning Electron Microscopy • Gas Chromatography • Ftir • High Performance Liquid Chromatography • Colloids • Analytical Chemistry • Optical Microscopy • Transmission Electron Microscopy • Eds • Design of Experiments • Transport Phenomena • Emulsions • Crude Oil • Surfactants • Membranes • Crystallization • Fluorescence Microscopy • Xrd • Microfluidics • Hplc • Differential Scanning Calorimetry • Karl Fisher • Spray Drying • Dvs • Formulation • Nanomaterials • Surface Chemistry • Microscopy • Experimentation • Membrane • Petroleum • Matlab • Dls • Gc Ms

Languages

English • Bengali • German • Hindi

Ranks

Certificate: Radiation Worker Training

Interests

Children • Education • Environment • Science and Technology • Disaster and Humanitarian Relief

Industries

Research

Resumes

Resumes

Amitesh Saha Photo 1

Technology Development Quality And Reliability R And D Engineer - Thermals

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Location:
Phoenix, AZ
Industry:
Research
Work:
Intel Corporation
Technology Development Quality and Reliability R and D Engineer - Thermals

Brady Corporation Jun 2015 - Feb 2017
Senior Chemist and Materials Scientist - R and D Leadership Development Program

University of Rhode Island Jan 1, 2009 - May 16, 2015
Graduate Research Assistant

Vertex Pharmaceuticals Jun 1, 2013 - Aug 31, 2013
Formulation Development Intern

University of Rhode Island Jan 2009 - May 2009
Graduate Teaching Assistant
Education:
University of Rhode Island 2010 - 2015
Doctorates, Doctor of Philosophy, Chemical Engineering, Philosophy
University of Rhode Island 2014
University of Rhode 2013
University of Rhode Island 2009 - 2010
Master of Science, Masters, Chemical Engineering
West Bengal University of Technology, Kolkata Aug 2008
Bachelors
Heritage Institute of Technology 2004 - 2008
Bachelors, Bachelor of Technology, Chemical Engineering
West Bengal University of Technology, Kolkata 2004 - 2008
Bachelors, Bachelor of Technology
Skills:
Nanotechnology
Chemical Engineering
Characterization
Materials Science
Tem
Powder X Ray Diffraction
Catalysis
Mass Spectrometry
Polymers
Tga
Scanning Electron Microscopy
Gas Chromatography
Ftir
High Performance Liquid Chromatography
Colloids
Analytical Chemistry
Optical Microscopy
Transmission Electron Microscopy
Eds
Design of Experiments
Transport Phenomena
Emulsions
Crude Oil
Surfactants
Membranes
Crystallization
Fluorescence Microscopy
Xrd
Microfluidics
Hplc
Differential Scanning Calorimetry
Karl Fisher
Spray Drying
Dvs
Formulation
Nanomaterials
Surface Chemistry
Microscopy
Experimentation
Membrane
Petroleum
Matlab
Dls
Gc Ms
Interests:
Children
Education
Environment
Science and Technology
Disaster and Humanitarian Relief
Languages:
English
Bengali
German
Hindi
Certifications:
Radiation Worker Training
Rhode Island Nuclear Science Center ,Radiation Safety Office - University of Rhode Island
Amitesh Saha Photo 2

Amitesh Saha Kingston, RI

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Work:
Department of Chemical Engineering, University of Rhode Island
Kingston, RI
Jun 2009 to Jun 2009
Graduate Research Assistant

Department of Chemical Engineering, University of Rhode Island
Kingston, RI
Jan 2009 to May 2009
Graduate Teaching Assistant

Indian Institute of Technology

Jun 2007 to Jul 2007
Undergraduate Summer Intern

Education:
University of Rhode Island
Kingston, RI
2010 to 2014
Doctor of Philosophy in Chemical Engineering

University of Rhode Island
Kingston, RI
2009 to 2010
Master of Science in Chemical Engineering

West Bengal University of Technology
Aug 2008
Bachelor of Technology in Chemical Engineering

Amitesh Saha Photo 3

Amitesh Saha Kingston, RI

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Work:
Department of Chemical Engineering, University of Rhode Island

Jun 2009 to 2000
Graduate Research Assistant

Vertex Pharmaceuticals Inc.
Cambridge, MA
Jun 2013 to Aug 2013
Formulation Development Intern

Department of Chemical Engineering, University of Rhode Island
Kingston, RI
Jan 2009 to May 2009
Graduate Teaching Assistant

Indian Institute of Technology

Jun 2007 to Jul 2007
Undergraduate Summer Intern

Education:
University of Rhode Island
Kingston, RI
2010 to 2014
Doctor of Philosophy in Chemical Engineering

University of Rhode Island
Kingston, RI
2009 to 2010
Master of Science in Chemical Engineering

West Bengal University of Technology
Aug 2008
Bachelor of Technology in Chemical Engineering

Skills:
Material Characterization: Microscopy-Optical; Fluorescence; Normal and Cryogenic Electron Microscopy (SEM and TEM), X-Ray Diffraction (XRD), Energy Dispersive X-Ray Spectroscopy (EDS), Contact angle goniometer Analytical Characterization: GC-MS, HPLC, FTIR, Karl Fischer Coulometry, Thermogravimetric Analysis (TGA), Differential Scanning Calorimetry (DSC), Dynamic Light Scattering (DLS), Electrophoretic techniques Other: Spray Drying, USP dissolution apparatus, Microfluidics, Glove box, System fabrication

Publications

Us Patents

Lids For Integrated Circuit Packages With Solder Thermal Interface Materials

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US Patent:
20200388554, Dec 10, 2020
Filed:
Jun 7, 2019
Appl. No.:
16/435355
Inventors:
- Santa Clara CA, US
Sergio Antonio Chan Arguedas - Chandler AZ, US
Peng Li - Chandler AZ, US
Amitesh Saha - Phoenix AZ, US
Assignee:
INTEL CORPORATION - Santa Clara CA
International Classification:
H01L 23/42
H01L 23/367
H01L 23/373
H01L 25/065
H01L 23/522
Abstract:
Disclosed herein are lids for integrated circuit (IC) packages with solder thermal interface materials (STIMs), as well as related methods and devices. For example, in some embodiments, an IC package may include a STIM between a die of the IC package and a lid of the IC package. The lid of the IC package may include nickel, the IC package may include an intermetallic compound (IMC) between the STIM and the nickel, and the lid may include an intermediate material between the nickel and the IMC.

Integrated Circuit Packages With Thermal Interface Materials With Different Material Compositions

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US Patent:
20200373220, Nov 26, 2020
Filed:
May 22, 2019
Appl. No.:
16/419827
Inventors:
- Santa Clara CA, US
Amitesh Saha - Phoenix AZ, US
Marco Aurelio Cartas - Chandler AZ, US
Ken Hackenberg - Plano TX, US
Emilio Tarango Valles - Chandler AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 23/42
H01L 23/373
Abstract:
Disclosed herein are integrated circuit (IC) packages with thermal interface materials (TIMs) with different material compositions, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a die, and TIM, wherein the die is between the TIM and the package substrate along a vertical axis. The TIM may include a first TIM having a first material composition and a second TIM having a second material composition; the first material composition may be different than the second material composition, and the first TIM and the second TIM may be in different locations along a lateral axis perpendicular to the vertical axis.

Solder Thermal Interface Material (Stim) With Dopant

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US Patent:
20200357764, Nov 12, 2020
Filed:
May 8, 2019
Appl. No.:
16/406593
Inventors:
- Santa Clara CA, US
Bamidele Daniel Falola - Chandler AZ, US
Amitesh Saha - Phoenix AZ, US
Peng Li - Chandler AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 23/00
Abstract:
Embodiments may relate to a microelectronic package comprising that includes a solder thermal interface material (STIM). The STIM may include indium and a dopant material which may provide a number of benefits to the STIM. The STIM may physically and thermally couple a die and an integrated heat spreader (IHS). Other embodiments may be described or claimed.
Amitesh Saha from Phoenix, AZ, age ~39 Get Report