Inventors:
Clifford Fishley - San Jose CA, US
Abiola Awujoola - Pleasanton CA, US
Leonard Mora - San Jose CA, US
Amar Amin - Milpitas CA, US
Maurice Othieno - Union City CA, US
Chok J. Chia - Cupertino CA, US
Assignee:
LSI Logic Corporation - Milpitas CA
International Classification:
H01L 23/528
H01L 21/768
US Classification:
257691, 257786, 257692, 257784, 257782, 257E23079, 257E23153, 257E21575, 438666, 438612, 438622
Abstract:
An integrated circuit package includes a package substrate, a die attach pad formed on the package substrate for securing a die to the package substrate, a ground bonding ring formed on the package substrate for attaching core and I/O ground bond wires between the die and the package substrate, and a first plurality of bond fingers formed immediately adjacent to the ground bonding ring for attaching a first set of I/O signal bond wires between the package substrate and the die.