Yun K Kim

20190069788, Mar 7, 2019

Mar 13, 2017

16/083868

- Oakland CA, US
Amr HAJ-OMAR - La Jolla CA, US
Yun Soung KIM - San Diego CA, US

A61B 5/0402
A61B 5/00
A61B 5/01
A61B 5/0476
A61B 5/0488

Disclosed are flexible and stretchable antenna devices, systems and methods of use and manufacture. In some aspects, a flexible and stretchable antenna device includes an adhesive substrate having flexible and stretchable material properties and capable of adhering to a surface of an object; and an antenna attached on or at least partially embedded within the adhesive substrate, the antenna including a radiating element and a ground element, in which one or both of the radiating element and the ground element include a mesh structure allowing the antenna device to transmit or receive wireless communication signals at a predetermined operating frequency while being stretched.

20170079144, Mar 16, 2017

May 18, 2015

15/311125

- Oakland CA, US
Dae Kang - Los Angeles CA, US
Yun Soung Kim - San Diego CA, US
Mridu Sinha - La Jolla CA, US

H05K 3/00
H05K 3/46
H05K 3/02
H05K 3/06
H05K 1/02
H05K 1/11

Disclosed are methods for fabrication of flexible circuits and electronic devices in cost effective manner that can include integration of submicron structures directly onto target substrates compatible with industrial microfabrication techniques. In one aspect, a method to fabricate an electronic device, includes depositing an electrically conductive layer on a processing substrate including a weakly-adhesive interface layer on a support substrate; depositing an insulating layer on the conductive layer to attach to the conductive layer; forming a circuit on the processing substrate by etching selected portions of the conductive layer based on a circuit design; and producing a flexible electronic device by attaching a flexible substrate to the formed circuit on the processing substrate and detaching the circuit and the flexible substrate from the interface layer, in which the flexible electronic device includes the circuit attached to the flexible substrate.

20170046501, Feb 16, 2017

Apr 28, 2015

15/307283

- Oakland CA, US
Robert N. WEINREB - Rancho Santa Fe CA, US
Yun Soung KIM - San Diego CA, US
Michael BAJEMA - San Diego CA, US
Dae KANG - Los Angeles CA, US
Amr Haj OMAR - San Diego CA, US

G06F 19/00
A61J 7/04
A61J 1/03

Methods, systems, and devices are disclosed for monitoring the dispensing of a fluid from a container. In one aspect, a system includes a conformal substrate including a mechanically flexible and an electrically insulative material, the substrate attached and conformed to a container containing a fluid; a data acquisition unit including a sensor and a signal processing circuit formed on the conformal substrate, in which the sensor transduces an occurrence of the fluid dispensing from the container into an electrical signal, and the signal processing circuit amplifies the electrical signal; a data processing unit formed on the conformal substrate and in communication with the data acquisition unit to process the amplified electrical signal as data; and a communications unit formed on the conformal substrate and in communication with the data processing unit to wirelessly transmit the processed data to a remote device.

20160330837, Nov 10, 2016

Dec 19, 2014

15/105350

- Oakland CA, US
Yun Soung Kim - San Diego CA, US
Michael Bajema - San Diego CA, US
Robert N. Weinreb - Rancho Santa Fe CA, US

H05K 1/11
H01L 21/48
H01L 23/538
H05K 3/46
H05K 3/30
H01L 21/56
H05K 1/03
H01L 23/14
H05K 1/18

Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased.