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Yi Pan Phones & Addresses

  • China Spring, TX
  • 20526 Autumn Terrace Ln, Katy, TX 77450
  • Houston, TX
  • Sparks, NV

Professional Records

Medicine Doctors

Yi Pan Photo 1

Yi Pan

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Specialties:
Neurology
Work:
SluCare PhysiciansSlucare Neurology & Psychiatry
3660 Vis Ave STE 303, Saint Louis, MO 63110
(314) 977-6082 (phone), (314) 977-6086 (fax)
Education:
Medical School
Beijing Med Univ, Beijing City, Beijing, China
Graduated: 1982
Procedures:
Neurological Testing
Sleep and EEG Testing
Conditions:
Carpel Tunnel Syndrome
Epilepsy
Dementia
Hemorrhagic stroke
Ischemic Stroke
Languages:
Chinese
English
French
Spanish
Description:
Dr. Pan graduated from the Beijing Med Univ, Beijing City, Beijing, China in 1982. She works in Saint Louis, MO and specializes in Neurology. Dr. Pan is affiliated with SSM Cardinal Glennon Childrens Medical Center, SSM DePaul Health Center and SSM Saint Marys Hospital.

Publications

Us Patents

Earth-Boring Drill Bit Mandrel Formed By Additive Manufacturing

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US Patent:
20220228442, Jul 21, 2022
Filed:
Aug 8, 2019
Appl. No.:
17/615620
Inventors:
- Houston TX, US
Yi Pan - The Woodlands TX, US
International Classification:
E21B 10/42
E21B 10/46
Abstract:
The present disclosure provides an earth-boring drill bit including a bit head and a shank. The shank includes a blank and a mandrel. The mandrel is concurrently formed by and secured to the blank by additive manufacturing. The mandrel includes a first region including a first alloy and a second region including a second alloy. The first alloy and the second alloy have a different modulus of elasticity, yield strength, resilience, ductility, hardness, fracture toughness, wear resistance, corrosion resistance, or erosion resistance. The disclosure also provides a mandrel wherein the second region comprises a sensor region or a fluid passageway having a geometry that is not obtainable in a mandrel that is cast, machined, or both. The disclosure additionally provides method of manufacturing such bits and mandrels.

Downhole Pressure Calculation Based On Strain Gauge Measurements

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US Patent:
20230108851, Apr 6, 2023
Filed:
Oct 6, 2021
Appl. No.:
17/450140
Inventors:
- Houston TX, US
Yi Pan - The Woodlands TX, US
Paul Gerard Cairns - Houston TX, US
International Classification:
E21B 47/06
E21B 47/007
G01L 1/22
Abstract:
As a wellbore is extended into a formation, hydrostatic and hydrodynamic pressures change due to variations in drilling mud weight, fluid density, etc. Strain gauges downhole measure forces experienced by drilling equipment. During drilling, a strain gauge measures strain applied between the drill string and the formation. When off bottom, the strain gauge measures forces experienced by the drill string other than drilling forces. A pressure calculator converts off bottom strain gauge measurements into measurements of hydrostatic pressure for periods without fluid flow (i.e., when drilling motors are paused) and into measurements of hydrodynamic pressure for periods with fluid flow (i.e., when mud motors are operating). The pressure calculator correlates strain measurements (usually in voltages) to pressure based on a predetermined relationship for a given wellbore geometry (e.g., hole diameter, drill bit diameter, drill pipe diameter, etc.).

Method And System For Analyzing A Drill String Stuck Pipe Event

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US Patent:
20200173268, Jun 4, 2020
Filed:
Aug 18, 2017
Appl. No.:
16/609495
Inventors:
- Houston TX, US
Dale E. Jamison - Humble TX, US
Yi Pan - The Woodlands TX, US
International Classification:
E21B 44/00
E21B 21/08
E21B 47/00
E21B 31/00
Abstract:
A method includes receiving a plurality of drilling parameters from a drilling operation, wherein the plurality of drilling parameters. The drilling parameters include a cuttings bed height and a friction factor between a drill string and a wellbore. The method further includes applying the plurality of drilling parameters to a friction model. The friction model utilizes a function of the cuttings bed height to determine a comprehensive friction factor. The comprehensive friction factor is applied to the plurality of drilling parameters to determine a required torque or hook load of the drill string. The method further includes providing an indication of a stuck pipe event.

Methods Of Removing Shoulder Powder From Fixed Cutter Bits

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US Patent:
20190330927, Oct 31, 2019
Filed:
Jul 9, 2019
Appl. No.:
16/506994
Inventors:
- Houston TX, US
Garrett T. Olsen - The Woodlands TX, US
Daniel Brendan Voglewede - Spring TX, US
Yi Pan - The Woodlands TX, US
Assignee:
Halliburton Energy Services, Inc. - Houston TX
International Classification:
E21B 10/54
C22C 1/10
B22D 23/06
B22D 25/02
E21B 10/60
E21B 10/42
B22F 7/06
Abstract:
Tools, for example, fixed cutter drill bits, may be manufactured to include hard composite portions having reinforcing particles dispersed in a continuous binder phase and auxiliary portions that are more machinable than the hard composite portions. For example, a tool may include a hard composite portion having a machinability rating 0.2 or less; and an auxiliary portion having a machinability rating of 0.6 or greater in contact with the hard composite portion. The boundary or interface between the hard composite portion and the auxiliary portion may be designed so that upon removal of the most or all of the auxiliary portion the resultant tool has a desired geometry without having to machine the hard composite portion.

Chip Module With Stiffening Frame And Orthogonal Heat Spreader

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US Patent:
20180277396, Sep 27, 2018
Filed:
Jun 1, 2018
Appl. No.:
15/996030
Inventors:
- Armonk NY, US
Yi Pan - The Woodlands TX, US
Hilton T. Toy - Hopewell Junction NY, US
Jeffrey A. Zitz - Poughkeepsie NY, US
International Classification:
H01L 21/52
H01L 23/16
H01L 23/367
H01L 23/467
H01L 23/473
H01L 23/498
H05K 3/30
H01L 23/04
H01L 23/00
H05K 3/34
Abstract:
An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.

Chip Module With Stiffening Frame And Orthogonal Heat Spreader

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US Patent:
20180061732, Mar 1, 2018
Filed:
Nov 3, 2017
Appl. No.:
15/803345
Inventors:
- Armonk NY, US
Yi Pan - The Woodlands TX, US
Hilton T. Toy - Hopewell Junction NY, US
Jeffrey A. Zitz - Poughkeepsie NY, US
International Classification:
H01L 23/367
H01L 23/16
H05K 3/34
H01L 23/00
Abstract:
An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.

Chip Module With Stiffening Frame And Orthogonal Heat Spreader

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US Patent:
20180061733, Mar 1, 2018
Filed:
Nov 3, 2017
Appl. No.:
15/803365
Inventors:
- Armonk NY, US
Yi Pan - The Woodlands TX, US
Hilton T. Toy - Hopewell Junction NY, US
Jeffrey A. Zitz - Poughkeepsie NY, US
International Classification:
H01L 23/367
H01L 23/16
H05K 3/34
H01L 23/00
Abstract:
An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.

Methods Of Removing Shoulder Powder From Fixed Cutter Bits

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US Patent:
20170159367, Jun 8, 2017
Filed:
May 17, 2016
Appl. No.:
15/307145
Inventors:
- Houston TX, US
Garrett T. Olsen - The Woodlands TX, US
Daniel Brendan Voglewede - Spring TX, US
Yi Pan - The Woodlands TX, US
Assignee:
Halliburton Energy Services, Inc. - Houston TX
International Classification:
E21B 10/54
B22D 25/02
B22D 23/06
E21B 10/60
B22F 7/06
Abstract:
Tools, for example, fixed cutter drill bits, may be manufactured to include hard composite portions having reinforcing particles dispersed in a continuous binder phase and auxiliary portions that are more machinable than the hard composite portions. For example, a tool may include a hard composite portion having a machinability rating 0.2 or less; and an auxiliary portion having a machinability rating of 0.6 or greater in contact with the hard composite portion. The boundary or interface between the hard composite portion and the auxiliary portion may be designed so that upon removal of the most or all of the auxiliary portion the resultant tool has a desired geometry without having to machine the hard composite portion.

Isbn (Books And Publications)

Biologically Inspired Cooperative Computing: IFIP 19th World Computer Congress, TC 10, 1st IFIP International Conference on Biologically Inspired Cooperative Computing, August 21-24, 2006, Santia

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Author

Yi Pan

ISBN #

0387346325

Computational Intelligence in Bioinformatics

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Author

Yi Pan

ISBN #

0470105267

Grid And Cooperative Computing - GCC 2004: Third International Conference, Wuhan, China, October 21-24, 2004. Proceedings

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Author

Yi Pan

ISBN #

3540235647

Grid And Cooperative Computing - GCC 2004 Workshops: GCC 2004 International Workshops, IGKG, SGT, GISS, AAC-GEVO, And VVS, Wuhan, China, October 21-24, 2004, Proceedings

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Author

Yi Pan

ISBN #

3540235787

Parallel And Distributed Processing And Applications

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Author

Yi Pan

ISBN #

3540297693

Parallel And Distributed Processing And Applications - Ispa 2005 Workshops: Ispa 2005 International Workshops, Aepp, Astd, Bios, Gcic, Iads, Masn, Sgca, And Wisa, Nanjing, China, November 2-5, 2005, P

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Author

Yi Pan

ISBN #

3540297707

Transactions on Computational Systems Biology V

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Author

Yi Pan

ISBN #

3540360484

Yi Pan from China Spring, TX, age ~50 Get Report