US Patent:
20190085225, Mar 21, 2019
Inventors:
Bright ZHANG - Morris Plains NJ, US
Wei Jun WANG - Morris Plains NJ, US
Ya Qun LIU - Morris Plains NJ, US
Hong Min HUANG - Morris Plains NJ, US
- Marris Plains NJ, US
International Classification:
C09K 5/06
H01L 23/367
H01L 23/00
H01L 23/373
Abstract:
A thermal interface material includes, in one exemplary embodiment, at least one polymer, at least one phase change material, at least one crosslinker, and at least one thermally conductive filler. The at least one thermally conductive includes a first plurality of particles having a particle diameter of about 1 micron or less. The at least one thermally conductive filler comprises at least 80 wt. % of the total weight of the thermal interface material. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.