Stephanie Chen

8000905, Aug 16, 2011

Sep 14, 2007

11/855589

Stephanie Chen - Fremont CA, US
Subramanian Balakrishnan - Cupertino CA, US
Richard Wallingford - San Jose CA, US

KLA-Tencor Technologies Corp. - Milpitas CA

G01B 5/28

702 35

Computer-implemented methods, carrier media, and systems for determining sizes of defects detected on a wafer are provided. One computer-implemented method includes separating the defects into groups based on output acquired for the defects by multiple channels of an inspection system used to detect the defects on the wafer. The method also includes separating the defects in one or more of the groups into subgroups based on the output acquired for the defects by one or more of the multiple channels. In addition, the method includes determining the sizes of one or more of the defects in one or more of the subgroups separately based on the output acquired for the defects by only one of the multiple channels and a calibration parameter. The calibration parameter is different for each of the subgroups and is acquired by using another system to measure actual sizes of defects detected on other wafers.

8000922, Aug 16, 2011

May 29, 2008

12/128979

Hong Chen - San Ramon CA, US
Michael J. Van Riet - Morgan Hill CA, US
Jason Z. Lin - Saratoga CA, US
Chris Maher - Campbell CA, US
Michal Kowalski - Santa Cruz CA, US
Barry Becker - San Jose CA, US
Stephanie Chen - Fremont CA, US
Subramanian Balakrishnan - Cupertino CA, US
Suryanarayana Tummala - Andhra Pradesh, IN

KLA-Tencor Corp. - San Jose CA

H01L 21/66

702123, 702127, 702155, 702134, 378137, 3562374, 3562375

Methods and systems for generating information to be used for selecting values for parameter(s) of a detection algorithm are provided. One method includes without user intervention performing a scan of an area of a wafer using an inspection system and default values for parameter(s) of a detection algorithm to detect defects on the wafer. The method also includes selecting a portion of the defects from results of the scan based on a predetermined maximum number of total defects to be used for selecting values for the parameter(s) of the detection algorithm. The method further includes storing information, which includes values for the parameter(s) of the detection algorithm determined for the defects in the portion. The information can be used to select the values for the parameter(s) of the detection algorithm to be used for the inspection recipe without performing an additional scan of the wafer subsequent to the scan.

8049877, Nov 1, 2011

May 14, 2008

12/120577

Richard Wallingford - San Jose CA, US
Stephanie Chen - Fremont CA, US
Jason Kirkwood - Santa Clara CA, US
Tao Luo - Fremont CA, US
Yong Zhang - Cupertino CA, US
Lisheng Gao - Morgan Hill CA, US

KLA-Tencor Corp. - San Jose CA

G01N 21/00

3562372, 356364

Computer-implemented methods, carrier media, and systems for selecting polarization settings for an inspection system for inspection of a layer of a wafer are provided. One method includes detecting a population of defects on the layer of the wafer using results of each of two or more scans of the wafer performed with different combinations of polarization settings of the inspection system for illumination and collection of light scattered from the wafer. The method also includes identifying a subpopulation of the defects for each of the different combinations, each of which includes the defects that are common to at least two of the different combinations, and determining a characteristic of a measure of signal-to-noise for each of the subpopulations. The method further includes selecting the polarization settings for the illumination and the collection to be used for the inspection corresponding to the subpopulation having the best value for the characteristic.

8135204, Mar 13, 2012

Sep 21, 2007

11/859342

Barry Becker - San Jose CA, US
Hong Chen - San Ramon CA, US
Michael Van Riet - Morgan Hill CA, US
Chris Maher - Campbell CA, US
Stephanie Chen - Fremont CA, US
Suryanarayana Tummala - Tirupathi, IN
Yong Zhang - Cupertino CA, US

KLA-Tencor Technologies Corp. - Milpitas CA

G06K 9/00

382141, 3562372, 3562376, 250310, 382145

Computer-implemented methods, carrier media, and systems for creating a defect sample for use in selecting one or more parameters of an inspection recipe are provided. One method includes separating defects into bins based on regions in which the defects are located, defect types, and values of the defects for parameter(s) of a detection algorithm. The method also includes determining a number of the defects to be selected from each bin by distributing a user-specified target number of defects across the bins. In addition, the method includes selecting defects from the bins based on the determined numbers thereby creating a defect sample for use in selecting values of parameter(s) of the detection algorithm for use in the inspection recipe.

20130035876, Feb 7, 2013

Aug 2, 2011

13/196758

Junqing Huang - Fremont CA, US
Yong Zhang - Cupertino CA, US
Stephanie Chen - Fremont CA, US
Tao Luo - Fremont CA, US
Lisheng Gao - Morgan Hill CA, US
Richard Wallingford - San Jose CA, US

KLA-TENCOR CORPORATION - Milpitas CA

G01N 21/88
G06F 19/00

702 40

Methods and systems for detecting defects on a wafer are provided.

20130188859, Jul 25, 2013

Jan 15, 2013

13/742259

Yong Zhang - Cupertino CA, US
Stephanie Chen - Fremont CA, US

KLA-TENCOR CORPORATION - Milpitas CA

G06T 7/00

382149

Methods and systems for segmenting pixels for wafer inspection are provided. One method includes determining a statistic for individual pixels based on a characteristic of the individual pixels in an image acquired for a wafer by an inspection system. The method also includes assigning the individual pixels to first segments based on the statistic. In addition, the method includes detecting one or more edges between the first segments in an image of the first segments and generating an edge map by projecting the one or more edges across an area corresponding to the image for the wafer. The method further includes assigning the individual pixels to second segments by applying the first segments and the edge map to the image for the wafer thereby segmenting the image. Defect detection is performed based on the second segments to which the individual pixels are assigned.

20200258137, Aug 13, 2020

Feb 8, 2019

16/271596

- George Town, KY
Chen ZHAO - San Mateo CA, US
Stephanie CHEN - San Mateo CA, US
Jackson HUANG - San Mateo CA, US

G06Q 30/06

The present disclosure provides an apparatus for content recommendations. The apparatus includes one or more storage devices that store a set of instructions, and one or more processors configured to execute the set of instructions to cause the apparatus to receive a selection of a first item via a user interface, determine, based on a first stored relationship, scent data associated with the selected first item, determine, based on a second stored relationship, theme data corresponding to the determined scent data, select a set of second items using the determined theme data, and generate content to be displayed in the user interface. The content includes the first item and the selected set of second items and is displayed in a manner associated with the determined theme data.

20150178907, Jun 25, 2015

Dec 8, 2014

14/563845

- Milpitas CA, US
Tao Luo - Fremont CA, US
Chaohong Wu - Mountain View CA, US
Stephanie Chen - Fremont CA, US
Lisheng Gao - Morgan Hill CA, US

G06T 7/00

Methods and systems for detecting defects on a wafer are provided. One method includes altering one or more design clips based on how the one or more design clips will appear in output generated by a wafer inspection process for a wafer. The method also includes aligning the one or more altered design clips to the output generated for the wafer during the wafer inspection process. In addition, the method includes detecting defects on the wafer based on the output aligned to the one or more altered design clips.