Wei Min Lu

7518396, Apr 14, 2009

Jun 25, 2007

11/823057

Venu M. Kondapalli - Sunnyvale CA, US
Wei Guang Lu - San Jose CA, US
P. Hugo Lamarche - Campbell CA, US

Xilinx, Inc. - San Jose CA

G06F 7/38
H03K 19/173
H03K 17/693

326 38, 716 16

A method and apparatus is provided to implement rapid reconfiguration during either a full, or partial, reconfiguration of a programmable logic device (PLD). Rapid reconfiguration is facilitated by a massively parallel configuration data bus that is created to simultaneously reconfigure the entire height of a reconfiguration memory space. A direct link may be provided to the configuration memory space of the PLD by utilizing interconnect and input/output resources to form the massively parallel configuration data bus. An indirect link may also be provided to the entire configuration memory space by utilizing existing random access memory (RAM) resources within the PLD as configuration bitstream buffers.

7876129, Jan 25, 2011

Sep 22, 2008

12/234922

Wei Ye Lu - Sunnyvale CA, US
Elroy Lucero - San Jose CA, US

National Semiconductor Corporation - Santa Clara CA

H03K 19/0175

326 82, 326 85, 326 68

An I/O circuit includes load sense and active noise reduction features that result in high speed output signal transitions with very low noise. Capacitive feedback control circuitry controls the point and time at which feedback capacitors are applied to the gate drive of the I/O circuit output stage. Active device feedback control controls the output stage gate drive.

8066552, Nov 29, 2011

Jan 26, 2005

11/043361

Alain Duboust - Sunnyvale CA, US
Wei Lu - Fremont CA, US
Siew Neo - Santa Clara CA, US
Yan Wang - Sunnyvale CA, US
Antoine P. Manens - Mountain View CA, US
Yongsik Moon - Sunnyvale CA, US

Applied Materials, Inc. - Santa Clara CA

B24B 29/00

451288, 451290, 451527, 451533, 451540

A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing layer has a second thickness and has a second compressibility greater than the first compressibility. The first thickness, first compressibility, second thickness and second compressibility are such that the polishing surface deflects more than the thickness non-uniformity of the polishing layer under an applied pressure of 1. 5 psi or less.

8441835, May 14, 2013

Jun 11, 2010

12/814410

Sung Hyun Jo - Sunnyvale CA, US
Hagop Nazarian - San Jose CA, US
Wei Lu - Ann Arbor MI, US

Crossbar, Inc. - Menlo Park CA

G11C 11/00

365148, 365158

A memory device has a crossbar array including a first array of first electrodes extending along a first direction. A second array of second electrodes extends along a second direction. A non-crystalline silicon structure provided between the first electrode and the second electrode at an intersection defined by the first array and the second array. The non-crystalline silicon structure has a first layer having a first defect density and a second layer having a second defect density different from the first defect density. Each intersection of the first array and the second array defines a two-terminal memory cell.

8498602, Jul 30, 2013

Nov 28, 2011

13/305419

Limei Xu - Mountain View CA, US
Wei Lu - Cupertino CA, US

H04B 1/10
H04B 1/26

455307, 455323

This invention relates to an open wireless architecture (OWA) radio frequency (RF) transceiver architecture including RF front-end system. Specifically, the invention relates to an OWA RF front-end utilizing non-broadband RF hardware to support wide range frequency bands and broad transmission bandwidth for future wireless communications.

20070234951, Oct 11, 2007

Mar 23, 2007

11/690621

WEI LU - Fremont CA, US
Jianshe Tang - San Jose CA, US
Alexander Ko - Santa Clara CA, US
Nelson Yee - Redwood City CA, US
Bo Xie - Sunnyvale CA, US
John Lee - San Jose CA, US
Richard Endo - San Carlos CA, US

B05C 5/00

118300000, 134172000

The present invention provides methods, apparatus, and systems for cleaning a substrate that include a controller and a nozzle coupled to the controller. The controller is adapted to direct the nozzle to dispense a uniform fluid spray pattern onto a substrate. The controller is adapted create the uniform fluid spray pattern by adjusting at least one operational parameter of the nozzle to cause a predefined percentage of droplets to be within a predetermined size range. Numerous other aspects are disclosed.

20070246081, Oct 25, 2007

Mar 23, 2007

11/690628

Wei Lu - Fremont CA, US
Jianshe Tang - San Jose CA, US
Alexander Ko - Santa Clara CA, US
Nelson Yee - Redwood City CA, US
Bo Xie - Sunnyvale CA, US
John Lee - San Jose CA, US
Rick Endo - San Carlos CA, US

B08B 3/00
B08B 7/00

134033000, 134034000, 134026000

The present invention provides methods, apparatus, and systems for cleaning a substrate that include a controller and a nozzle coupled to the controller. The controller is adapted to direct the nozzle to dispense a uniform fluid spray pattern onto a substrate. The controller is adapted create the uniform fluid spray pattern by adjusting at least one operational parameter of the nozzle to cause a predefined percentage of droplets to be within a predetermined size range. Numerous other aspects are disclosed.

20100267318, Oct 21, 2010

Jun 25, 2010

12/823872

Alain Duboust - Sunnyvale CA, US
Wei Lu - Fremont CA, US
Siew Neo - Santa Clara CA, US
Yan Wang - Sunnyvale CA, US
Antoine P. Manens - Sunnyvale CA, US
Yongsik Moon - Paramus NJ, US

B24D 11/02

451533

A polishing pad include a polishing layer having a polishing surface and a backing layer on a side of the polishing layer opposite the polishing surface. An outer edge of the polishing layer overhangs an outer edge of the backing layer.