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Van Q Le

from Glendale, AZ
Age ~56
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Related to:
Regina A Jutz, 50Daniel C Ly, 44Hien Le, 61Quang X Le, 56C LetruyenPhuc X Le, 60Tan V NguyenDung D Le, 67Cuc T Le, 74Thanh Q Le, 54Hue X Le, 59Anh T Le, 55Ngoc LeHong X Le, 78Lee N Vu, 72
Connected to:
Ai Le, 52Alphonse A Le, 51Amie Le, 46Angela M Le, 48Angeline H Le, 45Anhvu X Le, 56Annette M Le, 88Anson H Le, 39Antoine Le, 43Ar Le, 37

Van Le Phones & Addresses

  • 5634 W Puget Ave, Glendale, AZ 85302 (623) 523-3762
  • Phoenix, AZ
  • Chandler, AZ
  • Maricopa, AZ

Professional Records

License Records

Van M. Le

License #:
CPT.010091 - Active
Issued Date:
Feb 23, 2011
Expiration Date:
Jun 30, 2017
Type:
Certified Pharmacy Technician

Van M. Le

License #:
PTC.015457 - Expired
Issued Date:
Aug 18, 2009
Expiration Date:
Feb 17, 2011
Type:
Pharmacy Technician Candidate

Van Duc Le

License #:
1200007166
Category:
Cosmetologist Temporary Permit

Medicine Doctors

Van Le Photo 1

Van T. Le

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Specialties:
Internal Medicine
Work:
East Jefferson Internal Medicine
4315 Houma Blvd STE 501, Metairie, LA 70006
(504) 889-5249 (phone), (504) 889-5469 (fax)
Education:
Medical School
Med & Pharm Univ, Ho Chi Minh City, Vietnam (942 01 Eff 1/83)
Graduated: 1978
Procedures:
Electrocardiogram (EKG or ECG)
Vaccine Administration
Conditions:
Acute Upper Respiratory Tract Infections
Bronchial Asthma
Chronic Renal Disease
Disorders of Lipoid Metabolism
Hypertension (HTN)
Languages:
English
Vietnamese
Description:
Dr. Le graduated from the Med & Pharm Univ, Ho Chi Minh City, Vietnam (942 01 Eff 1/83) in 1978. He works in Metairie, LA and specializes in Internal Medicine.

Publications

Us Patents

Composite Ic Chips Including A Chiplet Embedded Within Metallization Layers Of A Host Ic Chip

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US Patent:
20210375830, Dec 2, 2021
Filed:
Aug 11, 2021
Appl. No.:
17/399185
Inventors:
- Santa Clara CA, US
Johanna Swan - Scottsdale AZ, US
Shawna Liff - Scottsdale AZ, US
Patrick Morrow - Portland OR, US
Gerald Pasdast - San Jose CA, US
Van Le - Beaverton OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 25/065
H01L 23/538
H01L 23/522
H01L 23/00
H01L 25/00
Abstract:
Composite IC chip including a chiplet embedded within metallization levels of a host IC chip. The chiplet may include a device layer and one or more metallization layers interconnecting passive and/or active devices into chiplet circuitry. The host IC may include a device layer and one or more metallization layers interconnecting passive and/or active devices into host chip circuitry. Features of one of the chiplet metallization layers may be directly bonded to features of one of the host IC metallization layers, interconnecting the two circuitries into a composite circuitry. A dielectric material may be applied over the chiplet. The dielectric and chiplet may be thinned with a planarization process, and additional metallization layers fabricated over the chiplet and host chip, for example to form first level interconnect interfaces. The composite IC chip structure may be assembled into a package substantially as a monolithic IC chip.

Composite Ic Chips Including A Chiplet Embedded Within Metallization Layers Of A Host Ic Chip

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US Patent:
20210098422, Apr 1, 2021
Filed:
Sep 27, 2019
Appl. No.:
16/586145
Inventors:
- Santa Clara CA, US
Johanna Swan - Scottsdale AZ, US
Shawna Liff - Scottsdale AZ, US
Patrick Morrow - Portland OR, US
Gerald Pasdast - San Jose CA, US
Van Le - Beaverton OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 25/065
H01L 23/538
H01L 23/522
H01L 23/00
H01L 25/00
Abstract:
Composite IC chip including a chiplet embedded within metallization levels of a host IC chip. The chiplet may include a device layer and one or more metallization layers interconnecting passive and/or active devices into chiplet circuitry. The host IC may include a device layer and one or more metallization layers interconnecting passive and/or active devices into host chip circuitry. Features of one of the chiplet metallization layers may be directly bonded to features of one of the host IC metallization layers, interconnecting the two circuitries into a composite circuitry. A dielectric material may be applied over the chiplet. The dielectric and chiplet may be thinned with a planarization process, and additional metallization layers fabricated over the chiplet and host chip, for example to form first level interconnect interfaces. The composite IC chip structure may be assembled into a package substantially as a monolithic IC chip.

Isbn (Books And Publications)

Graph-Theoretic Concepts in Computer Science: 27th International Workshop, Wg 2001 Boltenhagen, Germany, June 14-16, 2001 Proceedings

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Author

Van Bang Le

ISBN #

3540427074

L'economie Vietnamienne En Transition: Les Facteurs De La Reussite

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Author

Van Cuong Le

ISBN #

2738468551

Control profile
Van Q Le from Glendale, AZ, age ~56 Get Report