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Tony Tai Luong

from San Jose, CA
Age ~51
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Also known as:
Tony T Luong, Tai N Luong, Daisy Luong, Tai N Lwong, Tony To, Tony Llong
Phone and address:
3791 Kauai Dr, San Jose, CA 95111
(408) 281-4625
Related to:
Teo V Huynh, 83Steven L To, 50My H Huynh, 53Son N Luong, 77Henry Kuynh, 66Jo LaiUyen T LaiThi My Huynh, 59Truc T Luong, 48Quyen L Luong, 69Myphuong T Huynh, 49Phuong HuynhJuan Q Huynh, 46Uyen T Lai, 55Khanh Q Huynh, 51Hiep H Huynh, 44
Connected to:
Alison Luong, 31Anhhoa T Luong, 62Anthony P Luong, 62April Luong, 53Be V Luong, 77Betty T Luong, 39Bob T Luong, 82Can Q Luong, 55Chu K Luong, 69Dang Q Luong, 55

Tony Luong Phones & Addresses

  • 3791 Kauai Dr, San Jose, CA 95111 (408) 281-4625
  • 2580 Senter Rd, San Jose, CA 95111 (408) 998-4722
  • 612 12Th St, San Jose, CA 95112 (408) 998-4722
  • 3967 7 Trees Blvd, San Jose, CA 95111 (408) 281-4625
  • Santa Clara, CA

Professional Records

License Records

Tony Luong

License #:
E095078 - Active
Category:
Emergency medical services
Issued Date:
Jun 12, 2012
Expiration Date:
Dec 31, 2017
Type:
San Diego County EMS Agency

Business Records

Name / Title
Company / Classification
Phones & Addresses
Mr. Tony Luong
Owner
Zoom Auto Service Ltd
Auto Repair & Service
10531 116 St, Edmonton, AB T5H 3L8
(780) 496-7711
Tony Luong
Owner
Zoom Auto Service Ltd
Auto Repair & Service
(780) 496-7711

Publications

Us Patents

Method And Apparatus For Applying Downward Force On Wafer During Cmp

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US Patent:
6712670, Mar 30, 2004
Filed:
Dec 27, 2001
Appl. No.:
10/033671
Inventors:
Anthony de la Llera - Union City CA
Xuyen Pham - Fremont CA
Andrew Siu - Union City CA
Tuan A. Nguyen - San Jose CA
Tony Luong - San Jose CA
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B24B 4900
US Classification:
451 11, 451 19, 451 24, 451307
Abstract:
An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A load cell is positioned between the linear force generator and the upper end of the spindle. A controller is coupled to the load cell for controlling the force applied by the linear force generator. A method for applying downward force on a wafer during CMP also is described.

Air Platen For Leading Edge And Trailing Edge Control

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US Patent:
6761626, Jul 13, 2004
Filed:
Dec 20, 2001
Appl. No.:
10/037452
Inventors:
Anthony de la Llera - Union City CA
Xuyen Pham - Fremont CA
David Wei - Fremont CA
Tony Luong - San Jose CA
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B24B 722
US Classification:
451303, 451307
Abstract:
An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.

Method And Apparatus For Heating Polishing Pad

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US Patent:
6896586, May 24, 2005
Filed:
Mar 29, 2002
Appl. No.:
10/112628
Inventors:
Xuyen Pham - Fremont CA, US
Tuan Nguyen - San Jose CA, US
Ren Zhou - Fremont CA, US
David Wei - Fremont CA, US
Linda Jiang - Milpitas CA, US
Joseph P. Simon - Newark CA, US
Tony Luong - San Jose CA, US
Sridharan Srivatsan - Sunnyvale CA, US
Anjun Jerry Jin - Milpitas CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B24B049/00
US Classification:
451 7, 451 8, 451 53
Abstract:
A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.

Liquid Dispense Manifold For Chemical-Mechanical Polisher

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US Patent:
6896600, May 24, 2005
Filed:
Mar 29, 2002
Appl. No.:
10/112421
Inventors:
Patrick P. H. Wu - Sunnyvale CA, US
Xuyen Pham - Fremont CA, US
Tony Luong - San Jose CA, US
Assignee:
LAM Research Corporation - Fremont CA
International Classification:
B24B057/00
US Classification:
451307, 451 60, 451446, 222420, 222568, 239550
Abstract:
A liquid dispense manifold having drip nozzles configured to form controlled droplets is provided for use in chemical-mechanical polisher (CMP) systems. The liquid dispense manifold includes a plurality of drip nozzles that are secured to the side of the liquid dispense manifold. Each of the plurality of drip nozzles has a passage defined between a first end and a second end. A bend is defined within the drip nozzle passage such that droplets are directed downward toward a polishing surface. The nozzles are configured with respect to the manifold to provide an even flow rate of substantially uniform drops onto the polishing surface.

Air Platen For Leading Edge And Trailing Edge Control

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US Patent:
7018276, Mar 28, 2006
Filed:
Jun 25, 2004
Appl. No.:
10/876415
Inventors:
Anthony de la Llera - Union City CA, US
Xuyen Pham - Fremont CA, US
David Wei - Fremont CA, US
Tony Luong - San Jose CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B24B 7/22
B24B 21/08
US Classification:
451303, 451307
Abstract:
An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.

Method And Apparatus For Applying Downward Force On Wafer During Cmp

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US Patent:
20040161939, Aug 19, 2004
Filed:
Feb 10, 2004
Appl. No.:
10/776477
Inventors:
Anthony Llera - Union City CA, US
Xuyen Pham - Fremont CA, US
Andrew Siu - Union City CA, US
Tuan Nguyen - San Jose CA, US
Tony Luong - San Jose CA, US
Assignee:
Lam Research Corporation
International Classification:
H01L021/302
H01L021/461
US Classification:
438/692000, 438/691000
Abstract:
An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A load cell is positioned between the linear force generator and the upper end of the spindle. A controller is coupled to the load cell for controlling the force applied by the linear force generator. A method for applying downward force on a wafer during CMP also is described.

Belt Wiper For A Chemical Mechanical Planarization System

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US Patent:
6666755, Dec 23, 2003
Filed:
Jun 26, 2002
Appl. No.:
10/184163
Inventors:
Travis R. Taylor - Fremont CA
Christian DiPietro - Sunnyvale CA
Stephen Jew - Santa Clara CA
Philip Ngoon - San Jose CA
Tony Luong - San Jose CA
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B24B 100
US Classification:
451 56, 451288, 451285, 451296, 451533
Abstract:
A belt wiper that can be used in a linear belt-type chemical mechanical planarization (CMP) system to maintain a belt pad is provided. The belt wiper mitigates disturbances within a detection region important to a belt pad steering system. Also, the belt wiper mitigates the obscuring of optical components important to operation of an endpoint detection system. Thus, the belt wiper, by wiping the underside of the belt pad will preserve the functionality of both the belt pad steering system and the endpoint detection system.
Control profile
Tony Tai Luong from San Jose, CA, age ~51 Get Report