US Patent:
20080042501, Feb 21, 2008
Inventors:
Robert Malanga - Lake Mary FL, US
John Lasek - Port Orange FL, US
An Nguyen - Orlando FL, US
Toan Mai - Orlando FL, US
Frank Oropeza - Apopka FL, US
International Classification:
H02K 11/04
Abstract:
A thermal transfer container is disclosed for a semiconductor component to transfer heat to a heat sink such as used in rectifiers for alternators. The thermal transfer container includes an outer cylindrical surface having threads that engage threads defined in the heat sink bore for electrically and thermally connecting the metallic cylindrical container to the heat sink.
