Ting Yu Zhu

7756115, Jul 13, 2010

Sep 29, 2006

11/529804

Alexandre Chatilov - San Jose CA, US
Jeffrey Blohm - Cupertino CA, US
Ting Zhu - San Jose CA, US
Jagjiwan Virk - Milpitas CA, US

Siemens Enterprise Communications, Inc. - Boca Raton FL

H04L 12/66

370352, 370230, 370235

A method for providing a stateless Session Interface Protocol (SIP) back to back user agent (B2BUA) comprising receiving a SIP message and determining if the SIP message is a SIP request. The SIP request further comprises a request to create an original SIP dialog or a request for an existing SIP dialog. Method further comprises determining if the SIP message is a SIP response. The SIP response may further comprise a provisional SIP response or a final SIP response. Method is suitable for transforming the SIP request, transforming the SIP response, transmitting the transformed SIP request to a new destination, and transmitting the transformed SIP response to a request originator.

20190304956, Oct 3, 2019

Feb 5, 2019

16/268097

- San Jose CA, US
Frederic Stephane Diana - Santa Clara CA, US
Ting Zhu - Fremont CA, US
Gregory Guth - San Jose CA, US

Lumileds LLC - San Jose CA

H01L 25/075
H01L 33/50
H01L 33/60

A mounting substrate has a patterned metal layer defining a plurality of top metal bond pads for bonding to bottom metal bond pads of LED dies. A solder mask layer is formed over the mounting substrate, where the mask has openings that expose the top metal bond pads and protects metal traces on the substrate. The mask layer is a highly reflective white paint. The exposed top metal bond pads are then wetted with solder. The LED dies' bottom metal bond pads are then soldered to the exposed top metal bond pads, such that the mask layer surrounds each LED die to reflect light. A reflective ring is affixed to the substrate to surround the LED dies. A viscous phosphor material then partially fills the ring and is cured. All downward light by the LED dies and phosphor is reflected upward by the ring and solder mask layer.

20160315069, Oct 27, 2016

Nov 26, 2014

15/103474

- Eindhoven, NL
Frederic Stephane Diana - Santa Clara CA, US
Ting Zhu - San Jose CA, US
Gregory Guth - San Jose CA, US

H01L 25/075
H01L 33/62
H01L 33/50
H01L 33/60

A mounting substrate () has a patterned metal layer defining a plurality of top metal bond pads for bonding to bottom metal bond pads of LED dies. A solder mask layer () is formed over the mounting substrate, where the mask has openings that expose the top metal bond pads and protects metal traces on the substrate. The mask layer is a highly reflective white paint. The exposed top metal bond pads are then wetted with solder. The LED dies' bottom metal bond pads are then soldered to the exposed top metal bond pads, such that the mask layer surrounds each LED die to reflect light. A reflective ring () is affixed to the substrate to surround the LED dies. A viscous phosphor material () then partially fills the ring and is cured. All downward light by the LED dies and phosphor is reflected upward by the ring and solder mask layer.