Thuy Thanh Tran

6377464, Apr 23, 2002

Jan 29, 1999

09/239617

Hassan Hashemi - Laguna Niguel CA
Shiaw Chang - Thousand Oaks CA
Roger Forse - Santa Barbara CA
Evan McCarthy - Costa Mesa CA
Trang Trinh - Cypress CA
Thuy Tran - El Monte CA

Conexant Systems, Inc. - Newport Beach CA

H05K 702

361760, 361761, 361762, 361763, 361764, 361766, 361777, 361782, 361715, 257713, 257516

A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.

6885561, Apr 26, 2005

Oct 30, 2001

10/020380

Hassan Hashemi - Laguna Niguel CA, US
Shiaw Chang - Thousand Oaks CA, US
Roger Forse - Santa Barbara CA, US
Evan McCarthy - Costa Mesa CA, US
Trang Trinh - Cypress CA, US
Thuy Tran - El Monte CA, US

Skyworks Solutions, Inc. - Irvine CA

H05K007/02
H05K007/06
H05K007/08
H05K007/10

361760, 361761, 361763, 361803, 361816, 361818, 174 35 R, 174260, 174261

A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.