US Patent:
20180358278, Dec 13, 2018
Inventors:
- Redmond WA, US
Shi LUO - Pasadena CA, US
International Classification:
H01L 23/34
H01L 23/367
H01L 23/473
H01L 23/00
F28F 13/02
Abstract:
A thermal management device is described. The thermal management device includes a housing having an upper wall, a lower wall, and a side wall. The upper wall has an outer surface and an inner surface. The lower wall has an outer surface, an inner surface and an inner height between the inner surface of the upper wall and the inner surface of the lower wall. The thermal management device includes a working fluid within the housing. The inner height of the housing is sized to form a continuous meniscus of the working fluid from the inner surface of the upper wall to the inner surface of the lower wall.