Sam Nam Kim

6825447, Nov 30, 2004

Dec 17, 2002

10/321289

Sam H. Kim - Fremont CA
Akihiro Hosokawa - Cupertino CA
Dong Choon Suh - Santa Clara CA

Applied Materials, Inc. - Santa Clara CA

F27B 514

219390, 219411, 219405, 118724, 118725, 118 501, 392416, 392418

Embodiments of the invention generally provides an apparatus and method for heating substrates, comprising a heater disposed within a chamber, a plurality of heated supports movably disposed within the chamber to support at least two substrates thereon and a contamination collector disposed in communication with the chamber.

7007919, Mar 7, 2006

Apr 17, 2003

10/418682

Wendell Blonigan - Union City CA, US
Emanuel Beer - San Jose CA, US
Dongchoon Suh - Santa Clara CA, US
Jaime Munoz - Los Gatos CA, US
Sam H. Kim - Fremont CA, US

Applied Materials, Inc. - Santa Clara CA

F16K 3/16

251113, 251193

An actuator assembly for a slit valve door is configured to maintain a slit valve in a closed condition notwithstanding a high pressure differential between adjacent chambers that the slit valve isolates from each other. The slit valve door actuator assembly includes an actuator which moves the slit valve door between open and closed positions, and a locking mechanism to keep the slit valve door in a position to seal the slit valve in resistance to high gas pressure against the slit valve door. The locking mechanism may include a hard stop which is selectively movable into position to block retracting movement of the slit valve door.

7440091, Oct 21, 2008

Oct 26, 2004

10/973116

William A. Bagley - Tokyo, JP
Paohuei Lee - San Jose CA, US
Kyung-Tae Kim - Suwon, KR
Sam-Kyung Kim - Kumi, KR
Toshio Kiyotake - Hyogo, JP
Sam Kim - Fremont CA, US
Takayuki Matsumoto - Santa Clara CA, US
Jonathan Erik Larson - East Palo Alto CA, US
Makoto Inagawa - Palo Alto CA, US
James Hoffman - San Jose CA, US
Billy C. Leung - Sunnyvale CA, US

Applied Materials, Inc. - Santa Clara CA

G01N 21/00

3562372

An apparatus and method incorporating at least two sensors that detect the presence of substrate defects, such as breakage or misalignment, along the lengths of at least two parallel edges of a moving substrate. In one embodiment, an apparatus for detecting substrate defects includes a sensor arrangement including at least two sensors that continuously sense a substrate near at least two parallel edges of the substrate as the substrate passes the sensors. In another embodiment, an apparatus for detecting substrate defects includes a robot having a substrate support surface, and a sensor arrangement including at least two sensors that continuously sense a substrate near at least two parallel edges of the substrate during substrate transfer on the substrate support surface. In another embodiment, a method of continuously detecting substrate defects includes positioning at least two sensors to continuously sense a substrate near at least two parallel edges of the substrate as the substrate passes the sensors, and transmitting a signal from each of the at least two sensors to a controller that continuously monitors the signals from the at least two sensors to detect the presence of a substrate defect.

7834994, Nov 16, 2010

Oct 21, 2008

12/255629

William A. Bagley - Tokyo, JP
Paohuei Lee - San Jose CA, US
Kyung-Tae Kim - Suwon, KR
Sam-Kyung Kim - Kumi, KR
Toshio Kiyotake - Hyogo, JP
Sam Kim - San Ramon CA, US
Takayuki Matsumoto - Santa Clara CA, US
Jonathan Erik Larson - East Palo Alto CA, US
Makoto Inagawa - Palo Alto CA, US
James Hoffman - San Jose CA, US
Billy C. Leung - Fremont CA, US

Applied Materials, Inc. - Santa Clara CA

G01N 21/00

3562372

An apparatus and method incorporating at least two sensors that detect the presence of a substrate is provided. In one embodiment, a method for transferring a substrate in a processing system is described. The method includes positioning a substrate on an end effector in a first chamber, moving the substrate through an opening between the first chamber and a second chamber along a substrate travel path, and sensing opposing sides of the substrate travel path using at least two sensors positioned proximate to the opening, each of the at least two sensors defining a beam path that is directed through opposing edge regions of the substrate when at least a portion of an edge region traverses the beam path.

8430961, Apr 30, 2013

Sep 5, 2008

12/205363

Beom Soo Park - San Jose CA, US
Young Jin Choi - Santa Clara CA, US
Robin L. Tiner - Santa Cruz CA, US
Sam H. Kim - San Ramon CA, US
Soo Young Choi - Fremont CA, US
John M. White - Hayward CA, US
Dong-Kil Yim - Seongnam-si, KR

Applied Materials, Inc. - Santa Clara CA

C23C 16/00
H01L 21/306

118715, 15634531, 15634532

The present invention generally comprises a method and an apparatus for guiding the flow of processing gases away from chamber walls and slit valve opening. By controlling the flow path of the process gases within a processing chamber, undesirable deposition upon chamber walls and within slit valve openings may be reduced. By reducing deposition in slit valve openings, flaking may be reduced. By reducing deposition on chamber walls, the time between chamber cleaning may be increased. Thus, guiding the flow of processing gases within the processing chamber may increase substrate throughput.

20110126405, Jun 2, 2011

Sep 28, 2010

12/892892

Jonghoon Baek - San Jose CA, US
Beom Soo Park - San Jose CA, US
Sam Hyungsam Kim - San Ramon CA, US

H01R 43/00
H01L 21/02

29825, 15634534, 118723 E

An electrical ground () of an RF impedance matching network () is connected to a connection area () on the grounded chamber cover () of a plasma chamber. The connection area is offset away from the center of the chamber cover toward a workpiece passageway (). Alternatively, an RF power supply () has an electrically grounded output () that is connected to a connection area () on the chamber cover having such offset. Alternatively, an RF transmission line () has an electrically grounded conductor () that is connected between a grounded output of an RF power supply and a connection area () on the chamber cover having such offset.

20110185972, Aug 4, 2011

Jan 26, 2011

13/014113

Jonghoon Baek - San Jose CA, US
Sam H. Kim - San Ramon CA, US
Beom Soo Park - San Jose CA, US

APPLIED MATERIALS, INC. - SANTA CLARA CA

C23C 16/505
C23C 16/455

118723 R

Embodiments disclosed herein generally relate to a PECVD apparatus. When the RF power source is coupled to the electrode at multiple locations, the current and voltage may be different at the multiple locations. In order to ensure that both the current and voltage are substantially identical at the multiple locations, an RF bridge assembly may be coupled between the multiple locations at a location just before connection to the electrode. The RF bridge assembly substantially equalizes the voltage distribution and current distribution between multiple locations. Therefore, a substantially identical current and voltage is applied to the electrode at the multiple locations.

20120009347, Jan 12, 2012

Jul 7, 2010

12/831731

Weijie Wang - Cupertino CA, US
William N. Sterling - Santa Clara CA, US
Sam H. Kim - San Ramon CA, US
Soo Young Choi - Fremont CA, US
Beom Soo Park - San Jose CA, US
Beom Soo Kim - Cupertino CA, US
Qunhua Wang - San Jose CA, US

APPLIED MATERIALS, INC. - Santa Clara CA

C23C 16/52
B01F 15/06
C23C 16/00
B01F 15/02

4272481, 3661771, 366144, 118724

Embodiments of the invention generally provide a mixing block for mixing precursors and/or cleaning agent which has the advantage of maintaining the temperature and improving the mixing effect of the precursors, cleaning agent or the mixture thereof to eliminate the substrate-to-substrate variation, thereby providing improved process uniformity.