Rong Liu

7679473, Mar 16, 2010

Jan 15, 2008

12/014725

Wenjiang Zeng - Sunnyvale CA, US
Rong Liu - Fremont CA, US
Yupeng Chen - Sunnyvale CA, US
Wang-Chang Albert Gu - Longwood FL, US

California Micro Devices - Milpitas CA

H03H 7/00

333176, 333167

The present invention relates to a low pass filter incorporating coupled inductors to enhance stop band attenuation. In one embodiment, the coupled inductors are provided along with various capacitors to provide for superior performance within a smaller surface area of a semiconductor or ceramic integrated device. In a further specific embodiment, the capacitors are formed on an integrated device within an area on which entirely intertwined inductors are formed. In another embodiment, at least one further pair of coupled inductors is included to create additional frequency attenuation notches, as well as a wide stop-band.

7808752, Oct 5, 2010

Aug 17, 2005

11/206667

Dominick Richiuso - Saratoga CA, US
William N. Buchele - Los Gatos CA, US
Anguel Brankov - San Jose CA, US
Rong Liu - Fremont CA, US
John M. Jorgensen - Los Gatos CA, US

Semiconductor Components Industries, LLC - Phoenix AZ

H02H 9/00

361 56, 361 911, 361111, 361119

A method for implementing an inductor-capacitor filter in an integrated circuit. Embodiments of the invention implement a 5-pole LC low-pass filter suitable for incorporation in wireless applications necessitating compact layouts. Inductors are formed in an IC as concentric coils on metallization layers, the concentric coils providing a negative coupling coefficient between the inductors. The invention provides programmable frequency response characteristics, enabling the transmission of high-frequency base band information while attenuating carrier RF frequencies.

20090002669, Jan 1, 2009

Jun 27, 2008

12/163645

Rong Liu - Pleasanton CA, US
Evan Palmer - Mountain View CA, US

Optical Associates, Inc. - San Jose CA

G03B 27/32
G03B 27/54

355 67, 355 77

An exposure apparatus for use in optical lithography can include a holder and a plurality of UV-LED modules carried by the holder and disposed in an array. A respective plurality of collimating lenses can be disposed in an array corresponding to the array of UV-LED modules. The plurality of UV-LED modules and the respective plurality of collimating lenses can provide a respective plurality of distinct beams of UV light. The plurality of collimating lenses may be spaced from the plurality of UV-LED modules and spaced from the exposure plane and have an optical configuration providing a composite beam of UV light formed from the plurality of distinct beams of UV light in which each beam inside the periphery of the array overlaps each adjacent beam by at least 70% at the exposure plane. A method for directing light onto an exposure plane in an optical lithography procedure is provided.

20110291231, Dec 1, 2011

May 27, 2010

12/788297

Li Jiang - Laveen AZ, US
Ryan J. Hurley - Gilbert AZ, US
Sudhama C. Shastri - Phoenix AZ, US
Yenting Wen - Chandler AZ, US
Wang-Chang Albert Gu - Livermore CA, US
Phillip Holland - Los Gatos CA, US
Der Min Liou - San Jose CA, US
Rong Liu - Fremont CA, US
Wenjiang Zeng - Sunnyvale CA, US

H01L 23/538
H01L 21/98

257531, 438108, 257528, 257778, 438107, 257E21705, 257E23169

A semiconductor component and methods for manufacturing the semiconductor component that includes a monolithically integrated common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.

20120080803, Apr 5, 2012

Oct 1, 2010

12/896416

Phillip Holland - Los Gatos CA, US
Rong Liu - San Jose CA, US
Umesh Sharma - Santa Clara CA, US
Der Min Liou - San Jose CA, US
David D. Marreiro - Chandler AZ, US
Sudhama C. Shastri - Phoenix AZ, US

H01L 23/52

257774, 257784, 438622, 257E23141, 257E21159

A semiconductor component and methods for manufacturing the semiconductor component that includes a three dimensional helically shaped common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.

20220334431, Oct 20, 2022

Aug 23, 2021

17/409458

- Cupertino CA, US
Wei Lv - San Jose CA, US
Pee Khiam So - San Jose CA, US
Wenyong Zhu - Saratoga CA, US
Rong Liu - Sunnyvale CA, US
Victor H. Yin - Cupertino CA, US
Mookyung Son - Cupertino CA, US
Jun Qi - San Jose CA, US
Yufeng Yan - Santa Clara CA, US
Shaofeng Liu - San Jose CA, US
Thomas O. Henry - San Francisco CA, US
Suraj P. Gorkhali - San Jose CA, US

G02F 1/13357

A display may have a pixel array such as a liquid crystal pixel array. The pixel array may be illuminated with backlight illumination from a direct-lit backlight unit. The backlight unit may include an array of light-emitting diodes on a printed circuit board. The backlight unit may include first, second, and third light spreading layers formed over the array of light-emitting diodes. A color conversion layer may be formed over the first, second, and third light spreading layers. First and second brightness enhancement films may be formed over the color conversion layer.

20220334432, Oct 20, 2022

Aug 23, 2021

17/409467

- Cupertino CA, US
Yufeng Yan - Santa Clara CA, US
Qingbing Wang - Campbell CA, US
Chenhua You - San Jose CA, US
Rong Liu - Sunnyvale CA, US
Jun Qi - San Jose CA, US
Zhenyue Luo - Santa Clara CA, US
Mookyung Son - Cupertino CA, US
Victor H. Yin - Cupertino CA, US

G02F 1/13357
G02F 1/1335

A display may have a pixel array such as a liquid crystal pixel array. The pixel array may be illuminated with backlight illumination from a direct-lit backlight unit. The backlight unit may include an array of light-emitting diodes on a printed circuit board. The backlight unit may include first, second, and third light spreading layers formed over the array of light-emitting diodes. A color conversion layer may be formed over the first, second, and third light spreading layers. First and second brightness enhancement films may be formed over the color conversion layer.

20230093750, Mar 23, 2023

Nov 4, 2021

17/519221

- Cupertino CA, US
Meizi Jiao - San Jose CA, US
Ling Han - Santa Clara CA, US
Chungjae Lee - San Jose CA, US
Ziruo Hong - San Jose CA, US
Wei He - Cupertino CA, US
Rong Liu - Sunnyvale CA, US
Xinyu Zhu - San Jose CA, US
Mingxia Gu - Campbell CA, US
Jun Qi - San Jose CA, US
Eric L. Benson - Hillsborough CA, US
Victor H. Yin - Cupertino CA, US

G02F 1/13357

A display may have a pixel array such as a liquid crystal pixel array. The pixel array may be illuminated with backlight illumination from a direct-lit backlight unit. The backlight unit may include an array of light-emitting diodes (LEDs) on a printed circuit board. The display may have a notch to accommodate an input-output component. Reflective layers may be included in the notch. The backlight may include a color conversion layer with a property that varies as a function of position. The light-emitting diodes may be covered by a slab of encapsulant with recesses in an upper surface.