Paul G Lin

6369451, Apr 9, 2002

Jan 12, 1999

09/229139

Paul T. Lin - Fremont CA, 94539

H01L 2348

257779, 257737, 257738, 257778

The present invention discloses an improved method for carry out a flip chip packaging process for attaching a semiconductor integrated circuit (IC) wafer having a plurality of input/output terminals, to a substrate. The method includes the steps of: 1) securely placing a plurality of solder balls on the substrate with each of said solder balls corresponding to a location of one of the input/output terminals on the integrated circuit wafer; 2) flipping the integrated circuit wafer for aligning each of the input/output terminals of the IC wafer to one of the solder balls; and 3) mounting the IC wafer onto the substrate for placing the I/O terminals on a corresponding solder ball and applying a reflow temperature for soldering the IC wafer to the substrate.

6658031, Dec 2, 2003

Jul 6, 2001

09/900443

Alexander V. Tuganov - Redwood City CA
Mark S. Rice - San Jose CA
Mark McDonald - Milpitas CA
Brad V. Johnson - Santa Clara CA
Paul Chi-Hwa Lin - San Jose CA

Intel Corporation - Santa Clara CA

H01S 304

372 34, 372 20, 372 33, 372 99

A laser apparatus and method that uses active thermalization of a reflective element to minimize losses and provide wavelength stability. The laser comprises first and second reflectors defining an external cavity, and a compensating member coupled to at least one of the reflectors and configured to thermally position one reflector with respect to the other reflector. The compensating member may be coupled directly to the first reflector and configured to position first reflector with respect to said second reflector. The thermal positioning may be carried out by a thermoelectric controller operatively coupled to the compensating member and configured to thermally adjust the compensating member by heating or cooling thereof. The laser apparatus may comprise a gain medium having first and second output facets and emitting a coherent beam from the first output facet along an optical path. The first reflector is positioned in the optical path, with the second output facet and first reflector defining an external cavity.

6677668, Jan 13, 2004

Nov 28, 2000

09/727913

Paul T. Lin - Fremont CA, 94539

H01L 2348

257685, 257684, 257723, 257777, 257724, 257778, 257738, 428209

The present invention discloses a method for mounting multiple integrated circuit (IC) chips on a top surface of a substrate. The method includes a step forming a first footprint to include a plurality of electrical contacts on the top surface for mounting a first IC chip thereon. The method further includes a step of forming a set of substrate testing footprints to include a plurality of package mounting and testing electrical contacts for temporarily mounting a plurality of testing packages to conduct a functional MCM test. The functional MCM test is to test the substrate mounted with the first IC chip and the testing packages.

6724790, Apr 20, 2004

Dec 31, 2002

10/335775

Andrew Daiber - Redwood City CA
Paul Chi-Hwa Lin - San Jose CA

Intel Corporation - Santa Clara CA

H01S 304

372 34, 372 20, 37229023, 372 32, 372107, 372108

A tunable external cavity laser apparatus and method of laser operation. The apparatus includes a gain medium having first and second facets defining a facet laser cavity in which a first portion of light is internally reflected to produce a first lasing condition having a first reflection phase. A reflective element is positioned opposite the second facet of the gain medium, forming an external laser cavity defined by the first facet and reflective element. A second portion of light is internally reflected within the external cavity to produce a second lasing condition having a second reflection phase. A phase adjustment means is employed to adjust the first reflection phase relative to the second reflection phase so as to control a characteristic of the output beam emitted from the apparatus, such as the power output level of the beam. In one aspect, the relative phase is adjusted by controlling the temperature of the gain medium.

6784556, Aug 31, 2004

Apr 19, 2002

10/126328

Paul T. Lin - Fremont CA

Kulicke Soffa Investments, Inc. - Wilmington DE

H01L 2348

257784

The present invention provides a solution to the problem of weakening bond integrity in integrated circuit devices due in part to test probes galling and weakening the interconnect pads during functional and reliability test probing. In doing so, the invention enables a lowering of the chance a bond wire or interconnect pad will be lifted during a wire bonding process or in normal operation of an integrated circuit device.

6992001, Jan 31, 2006

May 8, 2003

10/434984

Paul T. Lin - Fremont CA, US

Kulicke and Soffa Industries, Inc. - Willow Grove PA

H01L 21/44

438612, 438613, 257737, 257738, 257781, 257786

A method for forming an integrated circuit interconnect pad is described. In one embodiment a method of forming an integrated circuit comprises screen printing a conductive paste onto a terminal metalization pad and curing the conductive paste in an inert or reducing atmosphere at an elevated temperature to form an under-bump metalization layer of an interconnect pad. The elevated temperature is below a melting temperature of the terminal metalization pad.

7042917, May 9, 2006

Jul 22, 2003

10/625913

Alexander V. Tuganov - Redwood City CA, US
Mark S. Rice - San Jose CA, US
Mark McDonald - Milpitas CA, US
Brad V. Johnson - Santa Clara CA, US
Paul Chi-Hwa Lin - San Jose CA, US

Intel Corporation - Santa Clara CA

H01S 3/10

372 20, 372 36

A laser apparatus and method that uses active thermalization of a reflective element to minimize losses and provide wavelength stability. The laser comprises first and second reflectors defining an external cavity, and a compensating member coupled to at least one of the reflectors and configured to thermally position one reflector with respect to the other reflector. The compensating member may be coupled directly to the first reflector and configured to position first reflector with respect to said second reflector. The thermal positioning may be carried out by a thermoelectric controller operatively coupled to the compensating member and configured to thermally adjust the compensating member by heating or cooling thereof. The laser apparatus may comprise a gain medium having first and second output facets and emitting a coherent beam from the first output facet along an optical path. The first reflector is positioned in the optical path, with the second output facet and first reflector defining an external cavity.

7191344, Mar 13, 2007

Aug 8, 2002

10/215981

Paul Lin - Fremont CA, US
Henry Hon - Berkeley CA, US

Authenex, Inc. - Oakland CA

G06F 11/30
H04L 9/32

713193, 713165, 713172, 713189, 380 44, 380262, 380277, 380281, 726 9

A system and method of data encryption and decryption for controlling access to a data storage device such as a hard disk drive or optical drive is provided. The invented method utilizes data encryption and decryption techniques, combined with a token device, to control access to data stored on the data storage device.