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Lin Fu Phones & Addresses

  • Laguna Niguel, CA
  • San Jose, CA
  • Fremont, CA
  • Buena Park, CA
  • 19402 Poseidon Ave, Cerritos, CA 90703 (562) 860-1838
  • Artesia, CA

Resumes

Resumes

Lin Fu Photo 1

Senior Digital Ic Design Engineer

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Location:
San Jose, CA
Industry:
Electrical/Electronic Manufacturing
Work:
Marvell Semiconductor
Senior Digital Ic Design Engineer

Faraday Apr 2007 - Jun 2010
Soc Design Service Engineer and Asic Consultant
Education:
University of California, Los Angeles 2010 - 2012
Master of Science, Masters, Electrical Engineering
The University of British Columbia 2001 - 2006
Bachelors, Bachelor of Arts, Electrical Engineering
University of California
Skills:
Logic Synthesis
Digital Design
Static Timing Analysis
Dft
Verilog
Atpg
Soc
Asic
Lec
Vlsi
P&R
Tcl
Languages:
English
Mandarin
Lin Fu Photo 2

Validation Engineer

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Location:
San Francisco, CA
Industry:
Computer Hardware
Work:
Asus North America
Validation Engineer

Supermicro
Application Engineer

Mean Well Usa, Inc. May 2016 - Jun 2017
Application Engineer

Crystal Instruments May 1, 2014 - May 2016
Technician

Pixelberry Studios Feb 2013 - May 2014
Quality Assurance
Education:
Oregon State University
Bachelors, Bachelor of Science, Computer Engineering
Skills:
Electronics
Manufacturing
Testing
Electrical Engineering
Matlab
Languages:
Mandarin
English
Lin Fu Photo 3

Lin Fu

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Business Records

Name / Title
Company / Classification
Phones & Addresses
Lin Fu
President
Calton Trading Corp
17700 S Santa Fe Ave, Compton, CA 90221
Lin Ming Fu
President
ED MEDIA INC
10501 Vly Blvd STE 822, El Monte, CA 91731

Publications

Isbn (Books And Publications)

Poriadok Slov V Russkoi Razgovornoi Rechi: Monografiia

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Author

Lin Fu

ISBN #

5934069950

Us Patents

Polishing Pad Employing Polyamine And Cyclohexanedimethanol Curatives

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US Patent:
20210008687, Jan 14, 2021
Filed:
Jul 8, 2020
Appl. No.:
16/923688
Inventors:
- Aurora IL, US
Lin Fu - Rancho Palos Verdes CA, US
Chen-Chih Tsai - Naperville IL, US
Jaeseck Lee - Beaverton OR, US
Sarah Brosnan - St. Charles IL, US
International Classification:
B24B 37/24
Abstract:
A chemical-mechanical polishing pad comprising a thermosetting polyurethane polishing layer includes an isocyanate-terminated urethane prepolymer, a polyamine curative, and a cyclohexanedimethanol curative. The polyamine curative and the cyclohexanedimethanol curative are in a molar ratio of polyamine curative to cyclohexanedimethanol curative in a range from about 20:1 to about 1:1.

Chemical Mechanical Planarization Pads Via Vat-Based Production

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US Patent:
20200353586, Nov 12, 2020
Filed:
May 7, 2020
Appl. No.:
16/868965
Inventors:
- Aurora IL, US
Lin FU - Rancho Palos Verdes CA, US
William Michael SPITZIG - Lake Oswego OR, US
Chen-Chih TSAI - Naperville IL, US
Ping HUANG - Beaverton OR, US
Justin STEWART - Aurora IL, US
Carlos BARROS - West Chicago IL, US
International Classification:
B24B 37/24
B24B 37/26
B24B 37/22
Abstract:
A chemical mechanical polishing (CMP) pad includes a polishing portion formed using a vat-based additive manufacturing process. The polishing portion includes a polymer material with a first elastic modulus. In some embodiments the polishing portion is disposed on the backing portion. The backing portion may have a second elastic modulus. The second elastic modulus may be less than the first elastic modulus.
Lin Suchu Fu from Laguna Niguel, CA, age ~73 Get Report