Kwang B Kim

6531918, Mar 11, 2003

Nov 10, 1998

09/189642

Richard D. Posner - Woodland Hills CA
Charles R. Gentzler - Thousand Oaks CA
Kwang Kim - Northridge CA
Do B. Shin - Laguna Hills CA

Powerwave Technologies, Inc. - Santa Ana CA

H03F 126

330151, 330149

The invention relates to a low cost feed forward RF power amplifier arrangement for amplifying an RF input signal using a main power amplifier operating as a class A/B amplifier. The method and apparatus modify the input signal to the main amplifier to compensate for the distortion added by the main power amplifier. The circuit provides for injecting a delayed version of the input signal, through a fixed gain-phase circuity, at a point whereby the resulting signal is amplified by the error amplifier of the second loop. A digitally controlled processor iteratively modifies various phase and gain controls to adjust the output of the amplifier. Different gain and phase control lines are iteratively updated at different rates.

61475556, Nov 14, 2000

Oct 19, 1998

9/174715

Richard D. Posner - Woodland Hills CA
Kwang Kim - Northridge CA
Stefan Klein - Lake Forest CA
Wayne Roberts - Tustin CA
Gregory French - Foothill Ranch CA

Powerwave Technologies, Inc. - Irvine CA

H03F 126
H03F 136
H03G 516

330149

A method and apparatus reduce the out-of-band frequency components of an RF amplified signal, preferably a CDMA signal, which has a carrier frequency which is not known in advance. The apparatus and method feature locating the frequency of the incoming signal by examining an RF output signal having both in-band frequency components and out-of-band frequency components. Typically the output signal is generated using a high-power, Class A/B amplifier. Once the frequency of the carrier has been determined, the out-of-band components are used to generate control signals which, in, for example, a feedback or feedforward circuitry, reduce the energy of the out-of-band signals and thereby provide a more linear amplifier transfer function.

D3481085, Jun 21, 1994

Sep 25, 1992

7/951697

Kil W. Kim - Los Angeles CA
Kwang H. Kim - Los Angeles CA

D24212

20220308189, Sep 29, 2022

Aug 3, 2021

17/393394

- Suwon-si, KR
Chunji Wang - Los Angeles CA, US
Kwang Oh KIM - Cerritos CA, US
Hongyu WANG - San Gabriel CA, US

G01S 7/4865
G04F 10/00
G01S 17/10
G01S 7/4914

A direct time-of-flight (DTOF) LiDAR system includes a sensor array, a first gated time-to digital converter (TDC) circuit and second TDC circuit. The sensor array includes pixels arranged to detect a first disparity location on the sensor array of a reflection signal received from a first object at a first range with respect to a second disparity location on the sensor array of a reflection signal received from a second object at a second range that is greater than the first range. The first TDC circuit generates first timestamp information relating to detection of the first reflection signal in which the first gated TDC circuit is gated based on the first disparity location. The second gated TDC circuit generates second timestamp information relating to detection of the second reflection signal in which the second gated TDC circuit is gated based on the second disparity location.

20220201235, Jun 23, 2022

Dec 22, 2020

17/131342

- Suwon-si, KR
Lilong Shi - Pasadena CA, US
Kwang Oh Kim - Cerritos CA, US

H04N 5/376
H04N 5/3745
H04N 5/378

A pixel for an image sensor includes a photon sensor, a memory, and an accumulator. The photon sensor element portion outputs a signal to an accumulator, which then may add value stored in memory together and may transfer the result to the memory of another pixel. The pixel may be analog or digital and may be used in a pixel array for compressed sensing imaging. During imaging, a pseudo-random mask may also be used. The data collected during imaging may be used in compressed sensing and may be sent to an offline storage to be processed.

20230016984, Jan 19, 2023

Sep 21, 2022

17/950083

- Suwon-si, KR
Kwang Oh KIM - Cerritos CA, US

H04N 5/33
H01L 27/146

A pixel for an image sensor includes a microbolometer sensor portion, a visible image sensor portion and an output path. The microbolometer sensor portion outputs a signal corresponding to an infrared (IR) image sensed by the microbolometer sensor portion. The visible image sensor portion outputs a signal corresponding to a visible image sensed by the visible image sensor portion. The output path is shared by the microbolometer and the visible image sensor portions, and is controlled to selectively output the signal corresponding to the IR image or the signal corresponding to the visible image. The output path may be further shared with a visible image sensor portion of an additional pixel, in which case the output path may be controlled to selectively to also output the signal corresponding to a visible image of the additional pixel.

20230005170, Jan 5, 2023

Sep 12, 2022

17/943068

- Suwon-si, KR
Kwang Oh Kim - Cerritos CA, US
Lilong Shi - Pasadena CA, US

G06T 7/521

A camera system. In some embodiments, the camera system includes a first laser, a camera, and a processing circuit connected to the first laser and to the camera. The first laser may be steerable, and the camera may include a pixel including a photodetector and a pixel circuit, the pixel circuit including a first time-measuring circuit.

20210392252, Dec 16, 2021

Jul 31, 2020

16/945787

- Suwon-si, KR
Kwang Oh KIM - Cerritos CA, US

H04N 5/225
H04N 5/232

A camera system includes two or more sensor arrays and an optical path. The sensor arrays are on the same sensor chip. Each sensor array includes the same field of view (FOV) as each other sensor array. The optical path includes a main lens and a metalens that are shared by each sensor array, and a microlens associated with each sensor array. The metalens splits incident light into different spectrums of light and directs each respective spectrum to a corresponding sensor array. The different spectrums of light include at least two of visible light, near infrared light, shortwave infrared and longwave infrared, and at least one sensor array includes single-photon avalanche diodes. The image processor that provides image processing, object recognition and object tracking and/or image fusion functionality may be on the same sensor chip as the sensor arrays.