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Kay Song Phones & Addresses

  • Daly City, CA
  • San Francisco, CA
  • Berkeley, CA

Resumes

Resumes

Kay Song Photo 1

Director, Key Accounts Technology And Business Development

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Location:
San Francisco, CA
Industry:
Semiconductors
Work:
Yield Engineering Systems
Director, Key Accounts Technology and Business Development

Aixtron Se Jun 2014 - Oct 2016
Senior Manager, Business Development and Technology

Applied Materials Jun 2014 - Oct 2016
Global Product Marketing Manager

Aixtron Se Nov 2010 - Jun 2014
Senior Technology Manager and Project Manager

Novellus Systems Oct 1999 - Nov 2010
Process Manager and Technologist
Education:
University of Cailifornia at Davis
Doctorates, Doctor of Philosophy, Philosophy, Chemistry
Skills:
Thin Films
Semiconductors
Cvd
Semiconductor Industry
Materials Science
Pvd
Characterization
Project Management
Plasma Etch
Silicon
Atomic Layer Deposition
Design of Experiments
Customer Marketing
Failure Analysis
R&D
Product Development
Physical Vapor Deposition
Ald
Research and Development
Metrology
Chemical Vapor Deposition
Nanotechnology
Languages:
English
Mandarin
Kay Song Photo 2

Kay Song

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Kay Song Photo 3

Kay Song

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Kay Song Photo 4

Kay Song

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Kay Song Photo 5

Kay Song

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Kay Song Photo 6

Kay Song

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Kay Song Photo 7

Kay Song

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Kay Song Photo 8

Kay Song

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Business Records

Name / Title
Company / Classification
Phones & Addresses
Kay Song
Principal
Global Expansion Network, LLC
Nonclassifiable Establishments

Publications

Us Patents

Method Of Mitigating Substrate Damage During Deposition Processes

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US Patent:
20120083134, Apr 5, 2012
Filed:
Sep 15, 2011
Appl. No.:
13/234020
Inventors:
Hui-Jung WU - Fremont CA, US
Kay SONG - San Jose CA, US
Victor LU - Foster City CA, US
Kie Jin PARK - San Jose CA, US
International Classification:
H01L 21/30
B05C 11/00
US Classification:
438761, 118696, 257E21211
Abstract:
Systems, methods, and apparatus for depositing a protective layer on a wafer substrate are disclosed. In one aspect, a protective layer is deposited over a surface of a wafer substrate using a process configured to produce substantially less damage in the wafer substrate than a first plasma-assisted deposition process. The protective layer is less than about 100 Angstroms thick. A barrier layer is deposited over the protective layer using the first plasma-assisted deposition process.
Kay X Song from Daly City, CA, age ~67 Get Report