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Kai Te Liu

from Mountain View, CA
Age ~56
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Also known as:
Kai C Liu, Kai Lin, Kai Chung
Phone and address:
49 Showers Ct, Mountain View, CA 94040
(650) 949-2862
Related to:
Xiaoyang Y Li, 68Ying Ming Liou, 62Helen Liu, 58Naomi ChungLiu Wei, 55Jonathan K Sun, 47Wenyi Zhao, 56Siyuan LiuJuanita L Liu, 76Ji I Zhu, 54Raul Ramirez Castellanos, 37Wei Liu, 55Rex T Hou, 75Wenying Li, 36Xinyu Xiang, 54Victor M Chavez, 53Jonathan SunLihsuan Liu Hsuan, 48Efrain Castellanos, 59Zhao Z Yang, 71Wai Ming Chong, 48
Connected to:
Adela Liu, 73Alec X Liu, 39Alpha T Liu, 46Amon Y Liu, 58Andrea Y Liu, 46Anqi Liu, 39Arden K Liu, 64Ba S Liu, 62Bailu Liu, 35Ban Liu, 48

Kai Liu Phones & Addresses

  • 49 Showers Ct, Mountain View, CA 94040 (650) 949-2862
  • 52 Paul Ave, Mountain View, CA 94041
  • 210 Easy St, Mountain View, CA 94043 (650) 967-2993
  • 89 Wabash Ave, San Jose, CA 95128 (408) 293-6085
  • Sunnyvale, CA
  • 13280 Berwick St, Saratoga, CA 95070 (408) 866-6819
  • Ithaca, NY
  • Santa Clara, CA

Resumes

Resumes

Kai Liu Photo 1

Kai Liu Egg Harbor Township, NJ

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Work:
Lowe's Department Store

May 2008 to Present
Sales Specialist
Wachovia Bank
Linwood, NJ
Mar 2006 to Feb 2008
Customer Service & Teller
YK United Construction Inc
Fremont, CA
Jun 2004 to Feb 2006
Construction Project Manager Associate
Education:
The Richard Stockton College of New Jersey
Pomona, NJ
2006 to 2009
Bachelor of Science in Business
Cumberland County College
Vineland, NJ
2003 to 2005
Associate in Business Administration
Skills:
Languages: Chinese-Mandarin: spoken, written- fluent, English: spoken, written- fluent

Business Records

Name / Title
Company / Classification
Phones & Addresses
Kai Liu
FRESH RAIN AGRICULTURE TECHNOLOGY LLC
Kai Liu
VISTA GENERAL ENGINEERING LLC
Kai Liu
FEDICARE HEALTH GROUP LLC
Kai Liu
President
FASTRANS SYSTEMS, INC
2732 Kesey Ln, San Jose, CA 95132
Kai Liu
President
UNIQ HOLDING, INC
1870 Saint Andrews Ct, Milpitas, CA 95035
Kai Liu
President
BAYCLEAR INC
2759 Corde Terra Cir, San Jose, CA 95111

Publications

Us Patents

Spatial Signature Analysis

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US Patent:
6718526, Apr 6, 2004
Filed:
Feb 7, 2003
Appl. No.:
10/360433
Inventors:
Peter Eldredge - Scotts Valley CA
Patrick Y. Huet - San Jose CA
Robinson Piramuthu - San Jose CA
Sandeep Bhagwat - Milpitas CA
Kai Chi - San Jose CA
Kai Liu - Santa Clara CA
Martin Plihal - Pleasanton CA
Shaio Roan - Cupertino CA
Maruti Shanbhag - Sunnyvale CA
Assignee:
KLA-Tencor Corporation - Milpitas CA
International Classification:
G06F 1750
US Classification:
716 4, 716 5
Abstract:
A system for determining an assigned classification for a set of physical events on a substrate. Sensors sense the physical events on the substrate and produce event data. A plug in rule module manager receives and manages any number of plug in rule modules. Each plug in rule module has an input, a local filter, an analyzer, and an output. The input receives the event data and confidence values from preceding plug in rule modules. The local filter analyzes the received confidence values from the preceding plug in rule modules and selectively by passes the plug in rule module based at least in part upon the received confidence values from the preceding plug in rule modules. The analyzer analyzes the event data in view of a given classification associated with the plug in rule module, and assigns a confidence value based at least in part upon how well the event data fits the given classification. The output provides the confidence value to subsequent plug in rule modules. A post processor receives the confidence values provided by the plug in rule modules, and makes a final selection of the assigned classification to be associated with the set of physical events from the given classifications based at least in part upon a comparison of the confidence values produced by all plug in rule modules.

Semiconductor Package With Plated Connection

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US Patent:
7394151, Jul 1, 2008
Filed:
Feb 15, 2005
Appl. No.:
11/058913
Inventors:
Leeshawn Luo - Santa Clara CA, US
Kai Liu - Sunnyvale CA, US
Ming Sun - Sunnyvale CA, US
Xiao Tian Zhang - San Jose CA, US
Assignee:
Alpha & Omega Semiconductor Limited - Sunnyvale CA
International Classification:
H01L 23/48
US Classification:
257690, 257693, 257E21511
Abstract:
A semiconductor package and method for making a semiconductor package are disclosed. The semiconductor package has a top surface and a mounting surface and includes a die, a conducting connecting material, a plating material and an insulating material. The die has a processed surface facing towards the mounting surface of the semiconductor package. Exposed metal connections are at the processed surface of the die. The conducting connecting material is disposed on the exposed metal connections. The plating material is in contact with the conducting connecting material. The insulating material is formed around the conducting connecting material, and the plating material extends to the exterior of the insulating material.

Dfn Semiconductor Package Having Reduced Electrical Resistance

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US Patent:
7511361, Mar 31, 2009
Filed:
Jun 10, 2005
Appl. No.:
11/150489
Inventors:
Xiaotian Zhang - San Jose CA, US
Kai Liu - Sunnyvale CA, US
Ming Sun - Sunnyvale CA, US
International Classification:
H01L 23/495
US Classification:
257666, 257787, 257E23031
Abstract:
A DFN semiconductor package is disclosed. The package includes a leadframe having a die bonding pad formed integrally with a drain lead, a source lead bonding area and a gate lead bonding area, the source lead bonding area and the gate lead bonding area being of increased area, a die coupled to the die bonding pad, a die source bonding area coupled to the source lead bonding area and a die gate bonding area coupled to the gate lead bonding area, and an encapsulant at least partially covering the die, drain lead, gate lead bonding area and source lead bonding area.

Semiconductor Package Having Improved Thermal Performance

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US Patent:
7612439, Nov 3, 2009
Filed:
Dec 22, 2005
Appl. No.:
11/316614
Inventors:
Xiaotian Zhang - San Jose CA, US
Argo Chang - Taipei, TW
James Lee - Taipei, TW
Ryan Huang - Taipei, TW
Kai Liu - Sunnyvale CA, US
Ming Sun - Sunnyvale CA, US
Assignee:
Alpha and Omega Semiconductor Limited - Hamilton
International Classification:
H01L 23/495
H01L 23/48
US Classification:
257676, 257E23037, 257E23044, 257E23069, 257E23071, 257E23178, 257666, 257686, 257685, 257724, 257723, 257691, 257698, 257696, 257773, 257341
Abstract:
A composite semiconductor package is disclosed. The package includes a lead frame having first and second die bonding pads, the first and second die bonding pads having a large lateral separation therebetween, a first device bonded to the first die bonding pad, a second device bonded to the second die bonding pad, a plurality of first leads coupled to the first die bonding pad, a plurality of second leads coupled to the second die bonding pad, and an encapsulant covering the lead frame, the first and second devices and at least a portion of the first and second pluralities of leads. The package may be a TSSOP-8 composite package having a common drain MOSFET pair and an IC.

Semiconductor Package Having A Bridged Plate Interconnection

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US Patent:
7622796, Nov 24, 2009
Filed:
Sep 28, 2007
Appl. No.:
11/906136
Inventors:
Lei Shi - Shanghai, CN
Ming Sun - Sunnyvale CA, US
Kai Liu - Mountain View CA, US
Assignee:
Alpha and Omega Semiconductor Limited - Sunnyvale CA
International Classification:
H01L 23/02
US Classification:
257678, 257341, 257401, 257522, 257579, 257587, 257692, 257735, 257E21451, 257E29318
Abstract:
A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, and a semiconductor die coupled to the leadframe, the semiconductor die having a plurality of metalized source contacts. A bridged source plate interconnection has a bridge portion, valley portions disposed on either side of the bridge portion, plane portions disposed on either side of the valley portions and the bridge portion, and a connection portion depending from one of the plane portions, the bridged source plate interconnection connecting the source lead with the plurality of metalized source contacts. The bridge portion is disposed in a plane above the plane of the valley portions while the plane portions are disposed in a plane intermediate the plane of the bridge portion and the plane of the valley portions.

Gold/Silicon Eutectic Die Bonding Method

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US Patent:
7659191, Feb 9, 2010
Filed:
Nov 27, 2006
Appl. No.:
11/605831
Inventors:
Kai Liu - Sunnyvale CA, US
Ming Sun - Sunnyvale CA, US
Assignee:
Alpha and Omega Semiconductor Incorporated - Sunnyvale CA
International Classification:
H01L 21/00
H01L 21/76
H01L 21/30
H01L 21/46
H01L 21/44
US Classification:
438611, 438118, 438406, 438459, 257E21514, 257E21596
Abstract:
A direct gold/silicon eutectic die bonding method is disclosed. The method includes the steps of gold plating a die bonding pad, grinding a wafer to a desired thickness, dicing the wafer after the grinding step, picking a die, and attaching the die to the die bonding pad at a temperature above the gold/silicon eutectic temperature. For thinner wafers, a dicing before grinding process is employed.

Semiconductor Package Having Dimpled Plate Interconnections

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US Patent:
7683464, Mar 23, 2010
Filed:
Apr 30, 2007
Appl. No.:
11/799467
Inventors:
Ming Sun - Sunnyvale CA, US
Lei Shi - Shanghai, CN
Kai Liu - Mountain View CA, US
Assignee:
Alpha and Omega Semiconductor Incorporated - Sunnyvale CA
International Classification:
H01L 23/495
US Classification:
257666, 257692
Abstract:
A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, a semiconductor die coupled to the leadframe, the semiconductor die having a plurality of metalized source areas and a metalized gate area, a patterned source connection having a plurality of dimples formed thereon coupling the source lead to the semiconductor die metalized source areas, a patterned gate connection having a dimple formed thereon coupling the gate lead to the semiconductor die metalized gate area, a semiconductor die drain area coupled to the drain lead, and an encapsulant covering at least a portion of the semiconductor die and drain, source and gate leads.

Compact Co-Packaged Semiconductor Dies With Elevation-Adaptive Interconnection Plates

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US Patent:
7776658, Aug 17, 2010
Filed:
Aug 7, 2008
Appl. No.:
12/188160
Inventors:
Kai Liu - Mountain View CA, US
Ming Sun - Sunnyvale CA, US
Assignee:
Alpha and Omega Semiconductor, Inc. - Sunnyvale CA
International Classification:
H01L 21/50
H01L 21/48
H01L 21/44
H01L 23/495
H01L 23/34
H01L 23/498
US Classification:
438121, 438123, 257676, 257666, 257502, 257723, 257E23037, 257E23043, 257E23061
Abstract:
A semiconductor package is disclosed for packaging two adjacent semiconductor dies atop a circuit substrate. The dies are separated from each other along their longitudinal edges with an inter-die distance. An elevation-adaptive electrical connection connects a top metalized contact of die two to the bottom surface of die one while accommodating for elevation difference between the surfaces. The elevation-adaptive electrical connection includes:Consequently, the semiconductor package reduces the inter-die distance from an otherwise direct transverse circuit routing between the longitudinal edges of the dies.

Amazon

Guoxue Classic Guide: Du Fu poems

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Author

LIU KAI YANG ?LIU XIN SHENG

Binding

Hardcover

Publisher

Unknown

ISBN #

7507833291

EAN Code

9787507833294

ISBN #

3

The Effects of Social Health Insurance Reform on People's Out-of-Pocket Health Expenditure in China: The Mediating Role of the Institutional Arrangement

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This study examines and explains the relationship between social health insurance (SHI) participation and out-of-pocket expenditures (OOP) as well as the mediating role the institutional arrangement of SHI plays in this relationship in China. Embracing a new institutionalist approach, it develops tw...
Author

Kai Liu

Binding

Hardcover

Pages

184

Publisher

Springer

ISBN #

981101776X

EAN Code

9789811017766

ISBN #

8

Inspection and Monitoring Technologies of Transmission Lines with Remote Sensing

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Inspection and Monitoring Technologies of Transmission Lines with Remote Sensing helps readers build a thorough understanding of new technologies and world-class practices developed by the State Grid Corporation of China―the organization responsible for the world’s largest power distribution network...
Author

Yi Hu, Kai Liu

Binding

Hardcover

Pages

300

Publisher

Academic Press

ISBN #

0128126442

EAN Code

9780128126448

ISBN #

5

Social Policy and Change in East Asia

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Social Policy and Change in East Asia is a collection of essays from a group of indigenous East Asian social policy researchers who met bi-annually to discuss social development issues. The book’s focus is the policy responses of respective East Asian government since the 2008 financial tsunami stru...
Binding

Hardcover

Pages

218

Publisher

Lexington Books

ISBN #

0739174568

EAN Code

9780739174562

ISBN #

4

Carl liu design book

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Author

LIU CHUAN KAI BIAN ZHU

Binding

Paperback

Publisher

China Youth Publishing House

ISBN #

7500656912

EAN Code

9787500656913

ISBN #

7

Control profile
Kai Te Liu from Mountain View, CA, age ~56 Get Report