Jung Soo Lee

D606060, Dec 15, 2009

Dec 22, 2006

29/270443

Jung Yong Lee - Los Angeles CA, US
Matias Duarte - Los Angeles CA, US
Sang Kyun Kim - Sungnam, KR
Jung-Hyun Park - Seoul, KR

Virgin Mobile USA, L.P. - Warren NJ

1403

D14247

D618193, Jun 22, 2010

Dec 22, 2006

29/270444

Jung Yong Lee - Los Angeles CA, US
Matias Duarte - Los Angeles CA, US
Sang Kyun Kim - Sungnam, KR
Jung-Hyun Park - Seoul, KR

Virgin Mobile USA, L.P. - Warren NJ

1403

D14138AD

8049527, Nov 1, 2011

Jul 27, 2010

12/843955

Jung Hee Lee - Woburn MA, US

Skyworks Solutions, Inc. - Woburn MA

G01R 31/02
G01R 31/00

32476201, 3247503

An integrated circuit includes a process sensor, a temperature sensor, and a voltage sensor. The process sensor is configured to sense a process parameter indicative of a semiconductor process by which the integrated circuit is formed and, based upon the sensed process parameter, to provide a characterization of the semiconductor process to the output of the process sensor. The temperature sensor is configured to provide an indication of a temperature of the integrated circuit to an output of the temperature sensor and the voltage sensor is configured to provide an indication of a power supply voltage level of the integrated circuit to an output of the voltage sensor. The output of the process sensor is coupled to at least one of the temperature sensor and the voltage sensor to compensate at least one of the indication of the temperature and the indication of the power supply voltage level.

20050224437, Oct 13, 2005

Apr 9, 2004

10/821762

Jung Lee - Los Angeles CA, US

A47F005/00

211184000

A shelf device for displaying miscellaneous items partitioned in an organized manner. The device comprising a board of a predetermined material having a top surface, bottom surface, a rear end, a front edge, rear edge, and a pair of side edges. A ridge extending upward from along the front edge of the board. A predetermined number of dividers slideably placed on the top surface of the board to move laterally in a side to side manner. Each divider having a front hook member formed on the front end hooking onto the ridge and a rear hook member formed on the rear end of each divider hooking onto the rear end of the board.

20080159160, Jul 3, 2008

Dec 29, 2006

11/618121

DEEPAK DAS - Arlington MA, US
JUNG AH LEE - Pittstown NJ, US

H04Q 7/00

370252

The present invention provides a method of wireless communication. One embodiment of the method includes determining a persistence parameter for at least one packet transmission based upon information indicative of a congestion level.

20100130082, May 27, 2010

Aug 17, 2009

12/542174

Jung Ah Lee - Malden MA, US
Randall M. Hill - Cambridge MA, US
Paula T. Hammond - Newton MA, US
Gregory C. Rutledge - Newton MA, US
Kevin C. Krogman - Santa Clara CA, US

Massachusetts Institute of Technology - Cambridge MA

B32B 5/16
B32B 9/00
D03D 25/00
D04H 13/00
B32B 7/00
B32B 27/28
D01D 5/00

442181, 428702, 428221, 442417, 428323, 428447, 428380

One aspect of the invention relates to a method of preparing metal oxide coated substrates for various potential applications, and the coated substrate formed thereby.

20110197337, Aug 18, 2011

Feb 16, 2010

12/658840

Jung Ki Lee - Whittier CA, US

A41D 19/00
A63B 69/36

21613, 2163, 2167, 473205, 21611

An improved athletic glove which promotes greater accuracy when swinging a golf club or baseball bat by reducing the effective contact area between the athlete's palm and the grip of the club or bat, thereby creating a pivot point which extends the effective swing length for more effective transfer of power to either a golf ball or baseball, the effective contact area of which is reduced by means of a circular pad attached to the palm of the athletic glove at one of two optimum locations.

20120034713, Feb 9, 2012

Oct 18, 2011

13/275721

Jung Hee Lee - Woburn MA, US

SKYWORKS SOLUTIONS, INC. - Woburn MA

H01L 21/66

438 5, 438 17, 257E21529

An integrated circuit includes a process sensor, a temperature sensor, and a voltage sensor. The process sensor is configured to sense a process parameter indicative of a semiconductor process by which the integrated circuit is formed and, based upon the sensed process parameter, to provide a characterization of the semiconductor process to the output of the process sensor. The temperature sensor is configured to provide an indication of a temperature of the integrated circuit to an output of the temperature sensor and the voltage sensor is configured to provide an indication of a power supply voltage level of the integrated circuit to an output of the voltage sensor. The output of the process sensor is coupled to at least one of the temperature sensor and the voltage sensor to compensate at least one of the indication of the temperature and the indication of the power supply voltage level.