Jun Biao Lu

6628707, Sep 30, 2003

May 4, 2001

09/849687

Manouchehr S. Rafie - Sunnyvale CA
Jun Lu - San Jose CA
Dengwei Fu - Cupertino CA
Tushar Shah - Milpitas CA

Radiant Networks PLC - Little Chesterford

H03H 740

375233, 375350, 708304, 708305, 708323

A method for an adaptive equalization apparatus in a multiple-link hopping radio system includes hopping among a plurality of radio links to receive variable-length bursts of radio signals on the plurality of radio links and equalizing amplitude and phase variations of a slow channel for each radio link from a received burst on the radio link. Further, the method includes storing the estimated tap coefficients pertinent to each radio link and using the tap weights of the current burst of the radio link to reliably pre-compensate the channel amplitude and phase distortion of a next received burst on the radio link.

7079574, Jul 18, 2006

Jan 17, 2001

09/764202

Manouchehr S. Rafie - Sunnyvale CA, US
Tushar Shah - Milpitas CA, US
Jun Lu - San Jose CA, US

Radiant Networks PLC - Essex

H03H 7/30

375232, 375222, 375350, 375148, 375233, 375349, 375341, 375230, 370330, 370329, 708442, 708304, 340 17

A method for a carrier phase recovery apparatus in a multiple-link hopping radio system includes hopping among a plurality of radio links to receive bursts of radio signals on the plurality of radio links and determining channel information for each radio link from a received burst on the radio link. Further, the method includes storing the determined channel information and using the determined channel information for the radio link to reliably recover the carrier phase of a next received burst on the radio link.

7680180, Mar 16, 2010

Jun 21, 2006

11/425602

Yuwei Zhang - Pleasanton CA, US
Kevin Hwang - Cupertino CA, US
Jun Lu - San Jose CA, US
Shue-Lee Chang - San Jose CA, US

H03H 7/30
H03H 7/40
H03K 5/159

375233, 375329, 375341, 375350

A decision feedback equalizer is configured to equalize an input signal to generate a recovered output signal. Linear feed-forward filter circuitry is configured to provide a linearly filtered output signal based on the input signal. Composite trellis decoder circuitry configured to process a combined signal that is based on a combination of at least the linearly feed-forward filtered output signal and on output of linear or non-linear feedback filter circuitry, in accordance with state metrics generated by processing a composite trellis diagram relative to the combined signal, to provide a trellis-decoded output signal as input to the linear or non-linear feedback filter circuitry. The composite trellis decoder circuitry is further configured to provide a particular phase output of the combined signal, based on the state metrics, as the decoded output signal.

7884696, Feb 8, 2011

Jan 25, 2008

12/011489

François Hébert - San Mateo CA, US
Tao Feng - Santa Clara CA, US
Xiaotian Zhang - San Jose CA, US
Jun Lu - San Jose CA, US

Alpha and Omega Semiconductor Incorporated - Sunnyvale CA

H01F 5/00

336200

A lead frame-based discrete power inductor is disclosed. The power inductor includes top and bottom lead frames, the leads of which form a coil around a single closed-loop magnetic core. The coil includes interconnections between inner and outer contact sections of the top and bottom lead frames, the magnetic core being sandwiched between the top and bottom lead frames. Ones of the leads of the top and bottom lead frames have a generally non-linear, stepped configuration such that the leads of the top lead frame couple adjacent leads of the bottom lead frame about the magnetic core to form the coil.

7948346, May 24, 2011

Jun 30, 2008

12/165423

Francois Hébert - San Mateo CA, US
Tao Feng - Santa Clara CA, US
Jun Lu - San Jose CA, US

Alpha & Omega Semiconductor, Ltd - Hamilton

H01F 5/00

336200

An inductor may include a planar ferrite core. A first group of one or more grooves is formed in a first side of the ferrite core. A second group of two or more grooves is formed in a second side of the ferrite core. The grooves in the first and second groups are oriented such that each groove in the first group overlaps with two corresponding grooves in the second group. A first plurality of vias communicates through the ferrite core between the first and second sides of the ferrite core. Each via is located where a groove in the first group overlaps with a groove in the second group. A conductive material is disposed in the first and second groups of grooves and in the vias to form an inductor coil.

7971340, Jul 5, 2011

Jan 14, 2011

13/007551

François Hébert - San Mateo CA, US
Tao Feng - Santa Clara CA, US
Jun Lu - San Jose CA, US

Alpha & Omega Semiconductor, Ltd - Hamilton

H01F 7/02

296021

An inductor may include a planar ferrite core. A first group of one or more grooves is formed in a first side of the ferrite core. A second group of two or more grooves is formed in a second side of the ferrite core. The grooves in the first and second groups are oriented such that each groove in the first group overlaps with two corresponding grooves in the second group. A first plurality of vias communicates through the ferrite core between the first and second sides of the ferrite core. Each via is located where a groove in the first group overlaps with a groove in the second group. A conductive material is disposed in the first and second groups of grooves and in the vias to form an inductor coil.

8058961, Nov 15, 2011

Feb 4, 2011

13/021347

François Hébert - San Mateo CA, US
Tao Feng - Santa Clara CA, US
Xiaotian Zhang - San Jose CA, US
Jun Lu - San Jose CA, US

Alpha and Omega Semiconductor Incorporated - Sunnyvale CA

H01F 5/00

336200

A lead frame-based discrete power inductor is disclosed. The power inductor includes top and bottom lead frames, the leads of which form a coil around a single closed-loop magnetic core. The coil includes interconnections between inner and outer contact sections of the top and bottom lead frames, the magnetic core being sandwiched between the top and bottom lead frames. Ones of the leads of the top and bottom lead frames have a generally non-linear, stepped configuration such that the leads of the top lead frame couple adjacent leads of the bottom lead frame about the magnetic core to form the coil.

8154108, Apr 10, 2012

Mar 29, 2010

12/749505

Kai Liu - Mountain View CA, US
Lei Shi - Shanghai, CN
Jun Lu - San Jose CA, US
Anup Bhalla - Santa Clara CA, US

Alpha and Omega Semiconductor Incorporated - Sunnyvale CA

H01L 23/495
H01L 23/48

257666, 257676, 257784, 257723, 257E23042, 257E23031

A dual-leadframe multi-chip package comprises a first leadframe with a first die pad, and a second leadframe with a second die pad; a first chip mounted on the first die pad functioning as a high-side MOSFET and second chip mounted on the second die pad functioning as a low-side MOSFET. The package may further comprises a bypass capacitor configured as a third chip mounted on the first die pad or integrated with the first chip. The package may further comprise a three-dimensional connecting plate formed as an integrated structure as the second die pad for electrically connecting a top contact area of the first chip to a bottom contact area of the second chip. A top connecting plate connects a top contact area of the second chip and a top contact area of the third chip to an outer pin of the first leadframe.