John T Vu

6531774, Mar 11, 2003

May 3, 2000

09/563497

Nhon T. Do - Mountain View CA
John Vu - San Jose CA

Advanced Micro Devices, Inc. - Sunnyvale CA

H01L 2334

257727, 324758, 324765, 439 17

A test fixture with an isolation plate grounds all of the solder balls of a ball grid array (BGA) of a chip scale package, except for a selected subset of the solder balls, to perform electrical characterization of the package. The isolation plate includes a recess ground into the plate, and a hole in the recess that permits access to the selected subset of solder balls. The recess provides clearance for a fixed compliant probe to land on the solder balls to be tested through the hole, and a probe contact surface for a ground portion of the probe to securely land.

20130144596, Jun 6, 2013

Jan 11, 2012

13/348542

Bigi Lui - Hayward CA, US
Danica Milosevic Brinton - Oakland CA, US
Eric Matsumura - Fairfield CA, US
John Huan Vu - San Jose CA, US

Zynga Inc. - San Francisco CA

G06F 17/28

704 2, 704E11001

An apparatus and method providing a localization framework capable of localizing dynamic text is disclosed herein. The localization framework is configured to automatically identify and prioritize certain text contained within an application code base to be translated. Such text is pre-processed prior to translation to facilitate accurate and complete translation in a target language.

6384618, May 7, 2002

Mar 15, 2000

09/525475

John W. Pursel - Sunnyvale CA
John Vu - San Jose CA
Nhon T. Do - Mountain View CA

Advanced Micro Devices, Inc. - Sunnyvale CA

G01R 104

324765, 324755

A test fixture with an isolation plate grounds all of the solder balls of a ball grid array (BGA) of a chip scale package, except for a selected subset of the solder balls, to perform electrical characterization of the package. The isolation plate includes at least one hole extending through the isolation plate that exposes the selected subset of the electrical contacts. The hole has a sidewall angled at a non-perpendicular angle from the horizontal plane of the isolation plate. The angle sidewall of the hole provides increased clearance for a fixed compliant probe to land on the solder balls to be tested in an electrical characterization process.

20220257260, Aug 18, 2022

Dec 14, 2021

17/550085

- Aliso Viejo CA, US
Joseph Emery - Riverside CA, US
Hung Tran - Midway City CA, US
John Vu - Santa Ana CA, US
Karishma Desai - Irvine CA, US
Parker Milhous - Santa Ana CA, US

A61B 17/12

Devices and methods for treatment of a patient's vasculature are described. Embodiments may include an implant having multiple mesh layers. A first and second layer of the implant may be formed by folding over a single mesh and the third layer may be formed from a different mesh. The first, second, and third layers may be either a stasis or a structural layer and may be arranged in different orders. Embodiments may also include structures to assist in the expansion of the device. These structures may include an expandable loop or reinforcing finger extensions. Embodiments may also include a corrugation or ridge around a middle section of the implant to assist in deployment.

20160103826, Apr 14, 2016

Dec 18, 2015

14/974768

- San Francisco CA, US
Danica Milosevic Brinton - Oakland CA, US
Eric Matsumura - Fairfield CA, US
John Huan Vu - San Jose CA, US

G06F 17/28
G06F 17/27
G06F 17/24

An apparatus and method providing a localization framework capable of localizing dynamic text is disclosed herein. The localization framework is configured to automatically identify and prioritize certain text contained within an application code base to be translated. Such text is pre-processed prior to translation to facilitate accurate and complete translation in a target language.

20150230338, Aug 13, 2015

Apr 20, 2015

14/691468

- SANTA CLARA CA, US
Jin Zhao - San Jose CA, US
John T. Vu - Hillsboro OR, US

H05K 1/18
H05K 1/03
H05K 1/11
H05K 3/32
H05K 3/42

Embodiments of the present disclosure are directed towards a circuit board having integrated passive devices such as inductors, capacitors, resistors and associated techniques and configurations. In one embodiment, an apparatus includes a circuit board having a first surface and a second surface opposite to the first surface and a passive device integral to the circuit board, the passive device having an input terminal configured to couple with electrical power of a die, an output terminal electrically coupled with the input terminal, and electrical routing features disposed between the first surface and the second surface of the circuit board and coupled with the input terminal and the output terminal to route the electrical power between the input terminal and the output terminal, wherein the input terminal includes a surface configured to receive a solder ball connection of a package assembly including the die. Other embodiments may be described and/or claimed.