Jae Y Shin

20190159337, May 23, 2019

Nov 13, 2018

16/189701

- Oakland CA, US
Rajan Kumar - La Jolla CA, US
Ying Shirley Meng - San Diego CA, US
Jae Wook Shin - La Jolla CA, US
Lu Yin - San Diego CA, US

H05K 1/02
H01M 4/66
A61B 5/1477
H01M 4/38
H01M 4/48
H01M 4/62
C08L 53/02
H05K 1/03
H05K 1/11
H05K 1/16
H05K 3/32
H01M 10/24
C08F 297/04

Disclosed are compositions, devices, systems and fabrication methods for stretchable composite materials and stretchable electronics devices. In some aspects, an elastic composite material for a stretchable electronics device includes a first material having a particular electrical, mechanical or optical property; and a multi-block copolymer configured to form a hyperelastic binder that creates contact between the first material and the multi-block copolymer, in which the elastic composite material is structured to stretch at least 500% in at least one direction of the material and to exhibit the particular electrical, mechanical or optical property imparted from the first material. In some aspects, the stretchable electronics device includes a stretchable battery, biofuel cell, sensor, supercapacitor or other device able to be mounted to skin, clothing or other surface of a user or object.

20180146545, May 24, 2018

Nov 21, 2017

15/820284

- Oakland CA, US
Rajan Kumar - La Jolla CA, US
Ying Meng - San Diego CA, US
Jae Wook Shin - La Jolla CA, US
Lu Yin - San Diego CA, US

H05K 1/02
C08F 297/04
H05K 1/11
H05K 1/03
H05K 1/16
H05K 3/32

Disclosed are compositions, devices, systems and fabrication methods for stretchable composite materials and stretchable electronics devices. In some aspects, an elastic composite material for a stretchable electronics device includes a first material having a particular electrical, mechanical or optical property; and a multi-block copolymer configured to form a hyperelastic binder that creates contact between the first material and the multi-block copolymer, in which the elastic composite material is structured to stretch at least 500% in at least one direction of the material and to exhibit the particular electrical, mechanical or optical property imparted from the first material. In some aspects, the stretchable electronics device includes a stretchable battery, biofuel cell, sensor, supercapacitor or other device able to be mounted to skin, clothing or other surface of a user or object.

20150270872, Sep 24, 2015

Sep 11, 2013

14/428318

- San Diego CA, US
Guining Shi - San Diego CA, US
William McFarland - Los Altos CA, US
Yin Huang - Beijing, CN
Gerardo Romo Luevano - San Diego CA, US
Jae Min Shin - San Diego CA, US
Kevin Khanh Dao - San Diego CA, US

H04B 3/50
H04B 3/32
H01B 11/12

A method of MIMO signal transmission on a cable is disclosed. The cable includes at least a first inner conductor, a second inner conductor, and an outer conductive shield. A first data signal is transmitted using the conductive shield and the first inner conductor. A second data signal is transmitted using at least the second inner conductor. The first and second data signals may be transmitted concurrently. For some embodiments, the second data signal may be transmitted using the first and second inner conductors. Thus, the second data signal may be a differential signal. For other embodiments, the first data signal may be transmitted using the conductive shield and the first inner conductor, and the second data signal may be transmitted using the conductive shield and the second inner conductor.

20140254978, Sep 11, 2014

Mar 7, 2013

13/789440

Brian Koch - San Carlos CA, US
Erik Norberg - Santa Barbara CA, US
Alexander W. Fang - Goleta CA, US
Jae Shin - Goleta CA, US
Gregory Alan Fish - Santa Barbara CA, US

H01L 21/822
G02B 6/13

385 14, 438 23

Embodiments of the invention describe photonic integrated circuits (PICs) formed using simultaneous fabrication operations performed on photonic device layers. Each device of a PIC may be made from different optimized materials by growing the materials separately, cutting pieces of the different materials and bonding these pieces to a shared wafer. Embodiments of the invention bond photonic device layers so that shared (i.e., common) processing operations may be utilized to make more than one device simultaneously. Embodiments of the invention allow for simpler, more cost effective fabrication of PICs and improve photonic device performance and reliability.