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Hyun Joo Lee

from La Mirada, CA
Age ~60
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Also known as:
Hee Bok Lee, Hyun J Lee, Hyun Zoo Lee, Hyun Z Lee, Hee B Lee, Hyun T Lee
Related to:
Byung Soon Kim, 88Kyung LeeKyung Lee, 67Yong LeeHyung J Lee, 48
Connected to:
A Lee, 45Abi A Lee, 31Abigail LeeAbu B Lee, 66Adela C Lee, 64Adelyn S Lee, 39Adrian J Lee, 36Adriane C Lee, 57Aen H Lee, 44Aeren Lee, 33

Hyun Lee Phones & Addresses

  • La Mirada, CA
  • San Gabriel, CA
  • Monterey Park, CA
  • Los Angeles, CA
  • Arcadia, CA
  • Springfield, VA
  • Alexandria, VA
  • Corona, CA

Professional Records

Real Estate Brokers

Hyun Lee Photo 1

Hyun Lee, La CA

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Specialties:
Buyer's Agent
Listing Agent
Work:
KELLER WILLIAMS BRENTWOOD
11812 San Vicente Blvd, La, CA 90049
(310) 871-9958 (Office), (213) 793-1128 (Cell)
Hyun Lee Photo 2

Hyun Lee, Los Angeles CA Agent

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Work:
Keller Williams
Los Angeles, CA
(213) 793-1128 (Phone)
License #01882174
Client type:
Home Buyers
Home Sellers
Property type:
Single Family Home
Condo/Townhome
Multi-family

License Records

Hyun Duck Lee

License #:
0225066406
Category:
Real Estate Individual

Hyun J Lee

Address:
Los Angeles, CA
License #:
1200003731 - Expired
Category:
Cosmetologist Temporary Permit
Expiration Date:
Oct 25, 1995
Type:
Cosmetologist TP

Hyun Tak Lee

License #:
4001013234
Category:
Real Estate Appraiser License

Hyun Sook Lee

License #:
HDR13568 - Active
Category:
Cosmetology/Barbering
Issued Date:
Nov 1, 1983
Expiration Date:
Sep 30, 2018
Type:
Hairdresser/Cosmetologist

Hyun Jae Lee

License #:
PHL04553 - Active
Category:
Pharmacy
Issued Date:
Oct 21, 2013
Expiration Date:
Jun 30, 2017
Type:
Pharmacist Limited (Intern)

Hyun Sook Lee

License #:
NA08888 - Expired
Category:
Nursing Assistant
Issued Date:
Jul 26, 1991
Expiration Date:
Jun 30, 2010
Type:
Nursing Assistant

Medicine Doctors

Hyun Lee Photo 3

Hyun Lee

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Specialties:
Internal Medicine
Work:
Kaiser Permanente Medical GroupKaiser Walnut Creek Medical Group
1425 S Main St, Walnut Creek, CA 94596
(925) 295-4000 (phone)
Education:
Medical School
Drexel University College of Medicine
Graduated: 2000
Procedures:
Vaccine Administration
Conditions:
Acne
Acute Pharyngitis
Acute Upper Respiratory Tract Infections
Alopecia Areata
Anemia
Languages:
English
Spanish
Vietnamese
Description:
Dr. Lee graduated from the Drexel University College of Medicine in 2000. She works in Walnut Creek, CA and specializes in Internal Medicine. Dr. Lee is affiliated with Kaiser Permanente Walnut Creek Medical Center.
Hyun Lee Photo 4

Hyun A Lee, Huntington Park CA

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Specialties:
Acupuncture
Address:
7208 Pacific Blvd Suite 204, Huntington Park, CA 90255
(323) 588-4941 (Fax)
Languages:
English
Hyun Lee Photo 5

Hyun Suk S. Lee

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Specialties:
Anesthesiology
Work:
Hartford Anesthesiology Associates
80 Seymour St STE JB333, Hartford, CT 06102
(860) 972-2117 (phone), (860) 545-1784 (fax)
Education:
Medical School
University of Texas Medical Branch at Galveston
Graduated: 1991
Languages:
English
Description:
Dr. Lee graduated from the University of Texas Medical Branch at Galveston in 1991. He works in Hartford, CT and specializes in Anesthesiology. Dr. Lee is affiliated with Hartford Hospital and UConn Health Center.
Hyun Lee Photo 6

Hyun J. Lee

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Specialties:
Optometry
Work:
Kaiser Permanente Medical GroupKaiser Permanente Ophthalmology
250 Travelodge Dr, El Cajon, CA 92020
(844) 424-1867 (phone), (619) 441-3223 (fax)
Languages:
English
Spanish
Description:
Dr. Lee works in El Cajon, CA and specializes in Optometry.
Hyun Lee Photo 7

Hyun J. Lee

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Specialties:
General Practice
Work:
Saint Marys Medical Center
1201 Langhorne Newtown Rd, Langhorne, PA 19047
(215) 710-2000 (phone), (215) 710-5861 (fax)
Languages:
English
Description:
Ms. Lee works in Langhorne, PA and specializes in General Practice. Ms. Lee is affiliated with St Mary Medical Center.
Hyun Lee Photo 8

Hyun Kyung Lee

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Specialties:
Dermatology
Family Medicine
Psychiatry
Education:
Korea University (1969)

Lawyers & Attorneys

Hyun Lee Photo 9

Hyun Lee - Lawyer

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Office:
Baumann & Shuldiner
Specialties:
General Practice
Litigation
ISLN:
911397145
Admitted:
1993
University:
University of Illinois, B.A., 1990
Law School:
Capital University, J.D., 1993
Hyun Lee Photo 10

Hyun Shu Lee - Lawyer

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Address:
Hong Sik Jeong
(822) 597-2828 (Office)
Licenses:
New York - Delinquent 2010
Education:
Hanyang Univ(Korea)
The George Washington Univ
Hyun Lee Photo 11

Hyun Jin Lee - Lawyer

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Address:
Hanwha Chemical Corporation
(822) 729-5024 (Office)
Licenses:
New York - Currently registered 2012
Education:
Washington College of Law
Hyun Lee Photo 12

Hyun Lee - Lawyer

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Address:
Kim Chang Lee PC
(234) 538-200x (Office)
Licenses:
New York - Currently registered 2006
Education:
University of Wisconsion(Mli)
Hyun Lee Photo 13

Hyun Jung Lee - Lawyer

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Address:
Legal Counsel, Permanent Court of Arbitration
(703) 024-171x (Office)
Licenses:
New York - Currently registered 2007
Education:
Columbia University School of Law
Hyun Lee Photo 14

Hyun Jin Lee - Lawyer

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Licenses:
Tennessee - Active 2009
Education:
Handong International Law School
Hyun Lee Photo 15

Hyun Chul Lee - Lawyer

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Address:
Kim & Chang
(237) 031-087x (Office)
Licenses:
New York - Currently registered 2002
Education:
Harvard Law School
Degree - LL.M
Hyun Lee Photo 16

Hyun Lee - Lawyer

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Specialties:
Administrative Law
Appeals
Car Accidents
Aviation
Commercial
ISLN:
918257688
Admitted:
2003
University:
University of Richmond, B.S., 1999
Law School:
Benjamin N. Cardozo School of Law, LL.M., 2003; Benjamin N. Cardozo School of Law, J.D., 2003

Public records

Vehicle Records

Hyun Lee

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Address:
940 Tiverton Ave APT 104, Los Angeles, CA 90024
Phone:
(310) 867-3236
VIN:
WMWMF73537TT80800
Make:
MINI
Model:
COOPER
Year:
2007

Resumes

Resumes

Hyun Lee Photo 17

Hyun Lee

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Location:
Orange County, California Area
Industry:
Consumer Electronics
Hyun Lee Photo 18

Product Management At Helio

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Position:
Product Management at Helio
Location:
Greater Los Angeles Area
Industry:
Telecommunications
Work:
Helio
Product Management
Education:
University of California, Los Angeles 2002 - 2007
Hyun Lee Photo 19

Hyun Lee

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Location:
United States
Hyun Lee Photo 20

Hyun Lee

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Location:
United States
Hyun Lee Photo 21

Hyun Lee

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Location:
United States
Hyun Lee Photo 22

Hyun Lee

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Location:
United States
Hyun Lee Photo 23

Hyun Lee

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Location:
United States
Hyun Lee Photo 24

Hyun Lee

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Location:
United States

Business Records

Name / Title
Company / Classification
Phones & Addresses
Hyun Suk Lee
President
Vickie's Fashion, Inc
1136 Santee St, Los Angeles, CA 90015
Hyun Ju Lee
President
Bonnie Service Corporation
Nonclassifiable Establishments
505 Shatto Pl, Los Angeles, CA 90020
12928 Moore St, Artesia, CA 90703
Hyun Jae Lee
President
Iworship Center, Inc
17891 Autry Ct, Chino Hills, CA 91709
Hyun Jung Lee
President
When Mask, Inc
Business Services at Non-Commercial Site
58 Hilltop Cir, Palos Verdes Estates, CA 90275
Hyun Lee
Owner
Sl Vitamin Manufacturing
Trade Contractor
19213 S Figueroa St, Gardena, CA 90248
(310) 715-6510
Hyun S. Lee
President
BLOOM1201 Inc
8750 S Sepulveda Blvd, Los Angeles, CA 90045
Hyun Lee
Owner
Cask & Keg Liquors
Ret Alcoholic Beverages
2585 N Garey Ave, Pomona, CA 91767
(909) 593-8910
Hyun Lee
President
Leez Summit, Inc
3660 Wilshire Blvd, Los Angeles, CA 90010
3815 Hawthorne Blvd, Redondo Beach, CA 90278

Publications

Amazon

Jonathan Edwards as Contemporary: Essays in Honor of Sang Hyun Lee

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Jonathan Edwards as Contemporary honors the contribution made by Sang Hyun Lee to Edwards’ scholarship and Christian and philosophical theology with his interpretation of Jonathan Edwards’ thought. It is divided into three parts: chapters examining Edwards’ philosophy, chapters examining his theolog...
Binding

Hardcover

Pages

272

Publisher

Peter Lang Publishing Inc.

ISBN #

1433110148

EAN Code

9781433110146

ISBN #

5

Edwards in Our Time: Jonathan Edwards and the Shaping of American Religion

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This fine work of intellectual retrieval highlights the abiding importance of Jonathan Edwards, one of the most significant figures in American religious history. Written by ten experts on the subject, these thought-provoking studies illustrate the many ways the influence of Edwards continues to be ...
Binding

Paperback

Pages

208

Publisher

Wm. B. Eerdmans Publishing Company

ISBN #

0802846084

EAN Code

9780802846082

ISBN #

4

From a Liminal Place: An Asian American Theology

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Drawing on decades of teaching and reflection, Princeton theologian Sang Lee probes what it means for Asian Americans to live as the followers of Christ in the "liminal space" between Asia and America and at the periphery of American society. As one moves away from the societal center, either intent...
Author

Sang Hyun Lee

Binding

Paperback

Pages

200

Publisher

Fortress Press

ISBN #

0800696689

EAN Code

9780800696689

ISBN #

1

Armageddon 1

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Every night, one amazing high school student is haunted by nightmares of an evil alien invasion. When his dreams start to come true during the day, things really get weird!
Author

Hyun Se Lee

Binding

Paperback

Pages

192

Publisher

CPM Manhwa

ISBN #

1586649094

EAN Code

9781586649098

ISBN #

2

Isbn (Books And Publications)

Maschinelle Analyse Deutscher Prafixverben Mit PROLOG Unter Morphosemantischem Aspekt

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Author

Hyun Joo Lee

ISBN #

3830000308

Us Patents

Systems And Methods Of Tamper Proof Packaging Of A Semiconductor Device

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US Patent:
8455990, Jun 4, 2013
Filed:
Feb 25, 2010
Appl. No.:
12/713141
Inventors:
Robert W Warren - Newport Beach CA, US
Hyun Jung Lee - Aliso Viejo CA, US
Nic Rossi - Causeway Bay, HK
Assignee:
Conexant Systems, Inc. - Newport Beach CA
International Classification:
H01L 23/58
H01L 21/50
US Classification:
257678, 257679, 257774, 257777, 257E21499, 257E23194, 438118, 438614
Abstract:
A barrier layer can be attached in a semiconductor package to one or more sensitive devices. The barrier layer can be used to obstruct tampering by a malicious agent attempting to access sensitive information on the sensitive device. The barrier layer can cause the sensitive device to become inoperable if physically tampered. Additional other aspects of the protective packaging provide protection against x-ray and thermal probing as well as chemical and electrical tampering attempts.

Semiconductor Packages With Reduced Solder Voiding

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US Patent:
20120119341, May 17, 2012
Filed:
Nov 16, 2010
Appl. No.:
12/927549
Inventors:
Robert W. Warren - Newport Beach CA, US
Hyun Jung Lee - Aliso Viejo CA, US
Nic Rossi - Causeway Bay, HK
Assignee:
CONEXANT SYSTEMS, INC. - Newport Beach CA
International Classification:
H01L 23/495
H01L 21/50
US Classification:
257675, 438122, 257E23051, 257E21499
Abstract:
An example semiconductor package with reduced solder voiding is described, which has a leadframe having an I/O pad and a thermal pad, a fabricated semiconductor die having a bond pad, where the fabricated semiconductor die is attached to a top surface of the thermal pad, and a wire bond connecting the bond pad to the I/O pad, where a bottom surface of the thermal pad has channels.

Copper Stud Bump Wafer Level Package

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US Patent:
20130087915, Apr 11, 2013
Filed:
Oct 10, 2011
Appl. No.:
13/270012
Inventors:
Robert W. Warren - Newport Beach CA, US
Nic Rossi - Radio City, HK
Hyun Jung Lee - Aliso Viejo CA, US
Assignee:
CONEXANT SYSTEMS, INC. - NEWPORT BEACH CA
International Classification:
H01L 23/498
H01L 21/66
H01L 21/56
US Classification:
257738, 438113, 438 15, 257E23069, 257E21502, 257E2153
Abstract:
There is provided a system and method for a copper stud bump wafer level package. There is provided a semiconductor package comprising a semiconductor die having a plurality of bond pads on an top surface thereof, a plurality of metallic stud bumps mechanically and electrically coupled to said plurality of bond pads, and a plurality of solder balls mechanically and electrically coupled to said plurality of metallic stud bumps. Advantageously, the metallic stud bumps may be provided using standard wirebonding equipment, avoiding the conventional wafer level package requirement for photolithography and deposition steps to provide a multi-layer metallic routing structure. As a result, reduced cycle times, lower cost, and reduced complexity may be provided. Alternative fabrication processes utilizing metallic stud bumps may also support multi-die packages with dies from different wafers and packages with die perimeter pads wirebonded to substrates.

Copper Sphere Array Package

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US Patent:
20130256885, Oct 3, 2013
Filed:
Mar 27, 2013
Appl. No.:
13/851906
Inventors:
Hyun J. Lee - Aliso Viejo CA, US
Nic Rossi - Causeway Bay, HK
Assignee:
Conexant Systems, Inc. - Newport Beach CA
International Classification:
H01L 23/00
US Classification:
257738, 438113
Abstract:
Presented is a method for fabricating a semiconductor package, and the associated semiconductor package. The method includes providing a compliant coverlay having a resin film disposed thereon. A plurality of metallic spheres may be placed at predetermined positions in the resin film. A top surface and a bottom surface of the metallic spheres may be flattened. Tamp blocks on opposing sides of the metallic spheres may be used. The resin film may then be cured to permanently set the metallic spheres in the resin film, and the compliant overlay may then be removed. A semiconductor die may then be placed on the plurality of metallic spheres. An encapsulating layer may then be deposited over the semiconductor die, the plurality of metallic spheres, and the resin film. The semiconductor package may then be diced. The method does not include fabricating a metal leadframe for the semiconductor die.

Effective User Modeling With Time-Aware Based Binary Hashing

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US Patent:
20200285960, Sep 10, 2020
Filed:
Feb 20, 2020
Appl. No.:
16/796813
Inventors:
- Suwon Si, KR
Peng Zhou - Irvine CA, US
Yingnan Zhu - Irvine CA, US
Hyun Chul Lee - Mountain View CA, US
International Classification:
G06N 3/08
G06F 16/22
G06N 3/04
Abstract:
In one embodiment, a computer-implemented method includes acquiring sequential user behavior data including one-dimensional data. The user behavior data is associated with a user. The method includes abstracting features from the sequential user behavior data to cover short-term and long-term timeframes. The method includes determining one or more properties of the user based on the features.

Hashing-Based Effective User Modeling

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US Patent:
20200286112, Sep 10, 2020
Filed:
Feb 20, 2020
Appl. No.:
16/796739
Inventors:
- Suwon si, KR
Yingnan Zhu - Irvine CA, US
Xiangyuan Zhao - Irvine CA, US
Hyun Chul Lee - Mountain View CA, US
International Classification:
G06Q 30/02
G06N 20/00
G06F 17/15
Abstract:
In one embodiment, a method includes receiving user behavior data and contextual information associated with the user behavior data, the contextual information including a first data portion associated with a first context type. The method includes generating, from the user behavior data and the contextual information using a hashing algorithm, a first heterogeneous hash code including a first portion representing the user behavior data and a second hash code portion representing the first data portion associated with the first context type. The method includes accessing a second heterogeneous hash code including a third hash code portion representing a second data portion associated with the first context type. The method includes comparing the first heterogeneous hash code with the second heterogeneous hash code including determining similarity between the second hash code portion of the first heterogeneous hash code and the third hash code portion of the second heterogenous hash code.

Semiconductor Package With Corner Pins

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US Patent:
20140091448, Apr 3, 2014
Filed:
Sep 27, 2013
Appl. No.:
14/040429
Inventors:
- Irvine CA, US
Hyun Jane Lee - Aliso Viejo CA, US
Nic Rossi - Causeway Bay, HK
Assignee:
Conexant Systems, Inc. - Irvine CA
International Classification:
H01L 23/495
H01L 21/78
US Classification:
257676, 438113
Abstract:
There are provided semiconductor packages having corner pins and methods for their fabrication. Such a semiconductor package includes a leadframe and a die paddle, the leadframe having first and second edge sides meeting to form a first corner. The semiconductor package also includes edge pins arrayed substantially parallel to the first edge side and edge pins arrayed substantially parallel to the second edge side. In addition, the semiconductor package includes a first corner pin situated at the first corner, the first corner pin being electrically isolated from the die paddle.
Control profile
Hyun Joo Lee from La Mirada, CA, age ~60 Get Report