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Hui Min Wang

from San Francisco, CA
Age ~69

Hui Wang Phones & Addresses

  • 401 Crescent Ave #4313, San Francisco, CA 94110
  • Beaverton, OR
  • Regina, KY
  • Alhambra, CA

Professional Records

License Records

Hui Wang

License #:
0402040599
Category:
Professional Engineer License

Hui Wang

License #:
05633 - Expired
Category:
Accountants
Type:
Certified Public Accountant

Lawyers & Attorneys

Hui Wang Photo 1

Hui Wang - Lawyer

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Address:
Siemens Ltd. China, Legal Department
(213) 889-3165 (Office)
Licenses:
New York - Currently registered 2008
Education:
Case Western Reserve University School of Law
Hui Wang Photo 2

Hui Wang - Lawyer

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Address:
Vertu Asia Pacific
(910) 099-35xx (Office)
Vertu Hong Kong Limited
(910) 099-35xx (Office)
Licenses:
New York - Currently registered 2004
Dist. of Columbia - Inactive 2005
Education:
Northwestern
Hui Wang Photo 3

Hui Wang - Lawyer

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Specialties:
Business Transactions
International Trade
International Law
ISLN:
918412049
Admitted:
2004
University:
Foreign Affairs University, B.A., 1993; Foreign Affairs University, China's Institute of International Law, 1996; Foreign Affairs University, China's Institute of International Law, 1996
Law School:
Northwestern School of Law of Lewis & Clark College, J.D., 2002

Medicine Doctors

Hui Wang Photo 4

Hui P. Wang

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Specialties:
Internal Medicine
Work:
Stonebridge Adult Medicine
3010 Legacy Dr STE 210, Frisco, TX 75034
(214) 618-9715 (phone), (214) 618-9716 (fax)
Education:
Medical School
Nanjing University School of Medicine
Graduated: 1995
Procedures:
Arthrocentesis
Bone Marrow Biopsy
Vaccine Administration
Allergen Immunotherapy
Allergy Testing
Cardiac Stress Test
Continuous EKG
Destruction of Benign/Premalignant Skin Lesions
Electrocardiogram (EKG or ECG)
Pulmonary Function Tests
Wound Care
Conditions:
Acne
Acute Bronchitis
Acute Conjunctivitis
Acute Myocardial Infarction (AMI)
Acute Pancreatitis
Languages:
Chinese
English
Korean
Description:
Dr. Wang graduated from the Nanjing University School of Medicine in 1995. He works in Frisco, TX and specializes in Internal Medicine. Dr. Wang is affiliated with Baylor Medical Center At Carrollton, Baylor Medical Center At Frisco, Baylor Medical Center At McKinney and Texas Health Presbyterian Hospital Denton.
Hui Wang Photo 5

Hui Wang

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Specialties:
Hematology/Oncology
Work:
Providence Medical GroupProvidence Regional Cancer System
2015 Cooks Hl Rd STE 200, Centralia, WA 98531
(360) 330-8939 (phone), (360) 330-8916 (fax)

Providence Medical GroupProvidence Regional Cancer System
4525 3 Ave SE STE 200, Lacey, WA 98503
(360) 754-3934 (phone), (360) 943-8023 (fax)
Education:
Medical School
Shandong Med Univ, Jinan, Shandong, China (242 46 Prior 1 1 71)
Graduated: 1987
Procedures:
Chemotherapy
Conditions:
Acute Bronchitis
Acute Sinusitis
Anxiety Phobic Disorders
Disorders of Lipoid Metabolism
Gastroesophageal Reflux Disease (GERD)
Languages:
English
Description:
Dr. Wang graduated from the Shandong Med Univ, Jinan, Shandong, China (242 46 Prior 1 1 71) in 1987. She works in Lacey, WA and 1 other location and specializes in Hematology/Oncology. Dr. Wang is affiliated with Capital Medical Center, Group Health Cooperative Central, Providence Centralia Hospital and Providence St Peter Hospital.
Hui Wang Photo 6

Hui Wang

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Specialties:
Physical Medicine & Rehabilitation
Work:
Electrodiagnosis & Rehabilitation Associates Of Tacoma
3315 S 23 St STE 200, Tacoma, WA 98405
(253) 272-9994 (phone), (253) 572-0468 (fax)
Education:
Medical School
Shanghai Univ of Trad Chinese Med, Shanghai City, Shanghai, China
Graduated: 1982
Procedures:
Physical Therapy
Languages:
English
Spanish
Description:
Dr. Wang graduated from the Shanghai Univ of Trad Chinese Med, Shanghai City, Shanghai, China in 1982. He works in Tacoma, WA and specializes in Physical Medicine & Rehabilitation. Dr. Wang is affiliated with Tacoma General Hospital.
Hui Wang Photo 7

Hui Wang

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Specialties:
Anesthesiology
Internal Medicine
Cardiology
Education:
Chongqing Medical University (1986)

Resumes

Resumes

Hui Wang Photo 8

Hui Wang Stanford, CA

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Work:
School of Nursing, Purdue University
West Lafayette, IN
Jan 2013 to Oct 2013
Research Associate

Purdue University
West Lafayette, IN
May 2012 to Dec 2012
Research Assistant, Center

SAAB

Nov 2011 to Jun 2012
Student Representative

Purdue University

Jul 2011 to Sep 2011
Data Analyst, Regenstrief Center of Healthcare Engineering

Weeks of Welcome, Purdue University

Aug 2011 to Aug 2011
Registration Volunteer

Summer Service Programs, Purdue University

May 2009 to Jul 2009
Resident Assistant

Education:
Stanford University
Stanford, CA
Sep 2013 to 2000
M.S. in Statistics

Purdue University
West Lafayette, IN
Jan 2009 to Dec 2012
B.S. in Statistics

Skills:
R, SAS, Microsoft Office, C++, Java, Matlab, SQL, Python, and Visual Basic
Hui Wang Photo 9

Hui Wang Menlo Park, CA

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Work:
FibroGen, Inc
South San Francisco, CA
Sep 2006 to Sep 2007
Scientist

Johnson & Johnson Inc. (Scios)
Fremont, CA
Mar 2005 to Aug 2006
Associate Scientist

CamKII

Jan 2001 to Feb 2005
Research Associate

Education:
University of Texas at San Antonio, Institute of Biotechnilogy
San, Himachal Pradesh
1992 to 1995
Ph.D. Candidate in Biomedicine

Chinese Academy of Sciences, Institution of human genetics
MS in human genetics

Beijing University
BS in Cell Biology

Skills:
DNA/RNA/mRNA/protein preparation from paraffin specimens and animal tissue, gene subcloning and sequencing, Southern, Northern, western blots, primer design and PCR/RT-PCR, digital PCR ,Taqman assay and Sanger sequencing, immunoprecipitation, zymography, luciferase assays, and ELISA. Cell subculture and maintenance, hematological cells culture and handling, DNA transfection and adenovirus infection of cultured cells and tissues, FACS, IHC, FISH, cell viability and cytotoxicity assays, human chromosome karyotyping, light and florescent microscopy, and high content imaging.
Hui Wang Photo 10

Hui Wang Stanford, CA

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Work:
ACXIOM CORPORATION
Redwood City, CA
Jul 2014 to Dec 2014
Data Analyst Intern, Data Science Team

PURDUE UNIVERSITY
West Lafayette, IN
Jan 2013 to Oct 2013
Research Associate, School of Nursing

PURDUE UNIVERSITY
West Lafayette, IN
Jul 2011 to Sep 2011
Data Analyst, Regenstrief Center of Healthcare Engineering

Education:
Stanford University
Stanford, CA
2013 to 2015
Master of Science in Statistics

Purdue University
West Lafayette, IN
2009 to 2012
Bachelor of Science in Statistics

Skills:
Proficient with R, SQL, Python, C++, Java, SAS, Matlab, Excel
Hui Wang Photo 11

Hui Wang Stanford, CA

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Work:
Stanford School of Medicine

Jul 2010 to Present
Senior Data Scientist (Biostatistics and Informatics)

University of California
Berkeley, CA
May 2008 to Jun 2010
Postdoctoral Fellow

Perlegen Sciences, Inc
Mountain View, CA
Sep 2006 to Apr 2008
Statistical Analyst

University of California
Los Angeles, CA
Jan 2003 to Dec 2006
Graduate Student Researcher

Merck & Co. Inc
Seattle, WA
Jul 2004 to Jan 2006
Consulting Biostatistician, Rosetta Inpharmatics

University of California
Riverside, CA
Sep 2000 to Dec 2002
Graduate Student Researcher

Education:
University of California
Los Angeles, CA
Jan 2003 to Jun 2006
Ph.D. in Statistics

Fudan University Shanghai
Jun 1996 to Jul 2000
B.S. in Genetics

Skills:
R, SAS, C++, Perl, SQL, Unix, Mac, Windows, regression, machine learning, data mining, ability to handle large data

Business Records

Name / Title
Company / Classification
Phones & Addresses
Hui Wang
Negotiator Psc/san Francisco Region 9
California Department of Health Care Services
Administration of Public Health Programs
2151 Berkeley Way, Berkeley, CA 94704
Hui Wang
President
Mc Star, Inc
32417 Westport Ct, Union City, CA 94587
Hui Wang
President
GMG INVESTMENTS INTERNATIONAL, INC
32401 Del Rey Ct, Union City, CA 94587
Hui Wang
Principal
An Elegant Spirit
Nonclassifiable Establishments
337 S Fremont St, San Mateo, CA 94401
Hui Min Wang
ASIA PLAZA PHARMACY LLC
Hui Renee Wang
RENEE WANG CPA, LLC
Hui Wang
NEW CENTURY RENTALS, LLC
Hui Wang
HUI WANG, INC
Hui Wang
Negotiator Psc/san Francisco Region 9
California Department of Health Care Services
Administration of Public Health Programs
2151 Berkeley Way, Berkeley, CA 94704

Publications

Amazon

Landscapes Clear and Radiant: The Art of Wang Hui (1632-1717) (Metropolitan Museum of Art)

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Wang Hui, the most celebrated painter of late-17th-century China, played a key role both in reinvigorating past traditions of landscape painting and in establishing the stylistic foundations for the imperially sponsored art of the Qing court. An artist of protean talent and immense ambition, Wang de...

Binding

Hardcover

Pages

248

Publisher

Metropolitan Museum of Art

ISBN #

0300141440

EAN Code

9780300141443

ISBN #

15

China's New Order: Society, Politics, and Economy in Transition

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As the world is drawn together with increasing force, our long-standing isolation from--and baffling ignorance of--China is ever more perilous. This book offers a powerful analysis of China and the transformations it has undertaken since 1989. Wang Hui is unique in China's intellectual world for h...

Author

Hui Wang

Binding

Hardcover

Pages

256

Publisher

Harvard University Press

ISBN #

0674009320

EAN Code

9780674009325

ISBN #

11

Civil Liability for Marine Oil Pollution Damage: A Comparative and Economic Study of the International, US and Chinese Compensation Regime (Energy and ... Series Supranational and Comparative Aspects)

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This remarkable book (the first in-depth examination of the civil liability regime for marine oil pollution damage from a law and economics perspective) examines the efficiency and effectiveness of the regime, with particular attention to whether it is in fact designed in the public interest or mere...

Author

Wang Hui

Binding

Hardcover

Pages

430

Publisher

Kluwer Law International

ISBN #

904113672X

EAN Code

9789041136725

ISBN #

9

The Book of Changes - A Series of Hundreds of Ancient Chinese Classics - Chinese Classics Collection (Chinese Edition)

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"Chinese classic masterpieces are the essences of traditional Chinese culture and the crystal of Chinese people's wisdom for five thousand years and the endless spiritual source. They are also the present of traditional Chinese values, standing for the spiritual forces and characters of Chinese peop...

Author

Wang Hui

Binding

Paperback

Pages

299

Publisher

Yunnan People's Publishing House

ISBN #

7222079637

EAN Code

9787222079632

ISBN #

8

China's New Order: Society, Politics, and Economy in Transition

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As the world is drawn together with increasing force, our long-standing isolation from--and baffling ignorance of--China is ever more perilous. This book offers a powerful analysis of China and the transformations it has undertaken since 1989. Wang Hui is unique in China's intellectual world for ...

Author

Hui Wang

Binding

Paperback

Pages

256

Publisher

Harvard University Press

ISBN #

0674021118

EAN Code

9780674021112

ISBN #

3

Learning Drawing Chrysanthemum in a Moment (Chinese Edition)

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Author

Wang Hui Tao

Binding

Paperback

Pages

199

Publisher

Hubei Fine Arts Publishing House

ISBN #

7539444347

EAN Code

9787539444345

ISBN #

12

Bonded Joints and Repairs to Composite Airframe Structures

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Bonded Joints and Repairs to Composite Airframe Structures is a single-source reference on the state-of-the-art in this rapidly growing area. It provides a thorough analysis of both internal and external joints and repairs, as well as discussions on damage tolerance, non-destructive inspection, sel...

Author

Chun Hui Wang, Cong N. Duong

Binding

Hardcover

Pages

306

Publisher

Academic Press

ISBN #

0124171532

EAN Code

9780124171534

ISBN #

14

Wang Jianwei: Time Temple

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The Robert H.N. Ho Family Foundation Chinese Art Initiative at the Guggenheim Museum, launched in early 2013, strives to advance the achievements of contemporary Chinese artists by commissioning major pieces that will be exhibited in the museum and enter its permanent collection. Selected for the fi...

Author

Thomas Berghuis, Gao Shiming, Wang Hui

Binding

Hardcover

Pages

128

Publisher

Guggenheim Museum

ISBN #

0892075163

EAN Code

9780892075164

ISBN #

10

Us Patents

Plating Apparatus And Method

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US Patent:
6391166, May 21, 2002
Filed:
Jan 15, 1999
Appl. No.:
09/232864
Inventors:
Hui Wang - Fremont CA
Assignee:
ACM Research, Inc. - Fremont CA
International Classification:
C25D 1700
US Classification:
204224R, 204198, 204199, 2042287, 204272, 2042751, 204276, 205133, 205136
Abstract:
An apparatus for plating a conductive film directly on a substrate with a barrier layer on top includes anode rod ( ) placed in tube ( ), and anode rings ( ), and ( ) placed between cylindrical walls ( ) and ( ), ( ) and ( ), respectively. Anodes ( ), ( ), and ( ) are powered by power supplies ( ), ( ), and ( ), respectively. Electrolyte ( ) is pumped by pump ( ) to pass through filter ( ) and reach inlets of liquid mass flow controllers (LMFCs) ( ), ( ), and ( ). Then LMFCs ( ), ( ) and ( ) deliver electrolyte at a set flow rate to sub-plating baths containing anodes ( ), ( ) and ( ), respectively. After flowing through the gap between wafer ( ) and the top of the cylindrical walls ( ), ( ), ( ), ( ) and ( ), electrolyte flows back to tank ( ) through spaces between cylindrical walls ( ) and ( ), ( ) and ( ), and ( ) and ( ), respectively. A pressure leak valve ( ) is placed between the outlet of pump ( ) and electrolyte tank ( ) to leak electrolyte back to tank ( ) when LMFCs ( ), ( ), ( ) are closed. A wafer ( ) held by wafer chuck ( ) is connected to power supplies ( ), ( ) and ( ).

Methods And Apparatus For Electropolishing Metal Interconnections On Semiconductor Devices

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US Patent:
6395152, May 28, 2002
Filed:
Jul 2, 1999
Appl. No.:
09/346699
Inventors:
Hui Wang - Fremont CA
Assignee:
ACM Research, Inc. - Fremont CA
International Classification:
C25D 1700
US Classification:
204224M, 204237, 204239, 204269
Abstract:
An electropolishing apparatus for polishing a metal layer formed on a wafer ( ) includes an electrolyte ( ), a polishing receptacle ( ), a wafer chuck ( ), a fluid inlet ( ), and at least one cathode ( ). The wafer chuck ( ) holds and positions the wafer ( ) within the polishing receptacle ( ). The electrolyte ( ) is delivered through the fluid inlet ( ) into the polishing receptacle ( ). The cathode ( ) then applies an electropolishing current to the electrolyte to electropolish the wafer ( ). In accordance with one aspect of the present invention, discrete portions of the wafer ( ) can be electropolished to enhance the uniformity of the electropolished wafer.

Method For Electropolishing Metal On Semiconductor Devices

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US Patent:
6440295, Aug 27, 2002
Filed:
Feb 4, 2000
Appl. No.:
09/497894
Inventors:
Hui Wang - Fremont CA
Assignee:
ACM Research, Inc. - Fremont CA
International Classification:
C25F 316
US Classification:
205640, 205645, 205656, 205668, 205682
Abstract:
An electropolishing apparatus for polishing a metal layer formed on a wafer ( ) includes an electrolyte ( ), a polishing receptacle ( ), a wafer chuck ( ), a fluid inlet ( ), and at least one cathode ( ). The wafer chuck ( ) holds and positions the wafer ( ) within the polishing receptacle ( ). The electrolyte ( ) is delivered through the fluid inlet ( ) into the polishing receptacle ( ). The cathode ( ) then applies an electropolishing current to the electrolyte to electropolish the wafer ( ). In accordance with one aspect of the present invention, discrete portions of the wafer ( ) can be electropolished to enhance the uniformity of the electropolished wafer.

Methods And Apparatus For End-Point Detection

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US Patent:
6447668, Sep 10, 2002
Filed:
May 12, 2000
Appl. No.:
09/570566
Inventors:
Hui Wang - Fremont CA
Assignee:
ACM Research, Inc. - Fremont CA
International Classification:
C25F 330
US Classification:
205645, 205651, 205670, 205672, 204224 M, 2042287
Abstract:
An apparatus for detecting the end-point of an electropolishing process of a metal layer formed on a wafer includes an end-point detector. The end-point detector is disposed adjacent the nozzle used to electropolish the wafer. In one embodiment, the end-point detector is configured to measure the optical reflectivity of the portion of the wafer being electropolished.

Methods And Apparatus For Holding And Positioning Semiconductor Workpieces During Electropolishing And/Or Electroplating Of The Workplaces

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US Patent:
6495007, Dec 17, 2002
Filed:
Mar 7, 2001
Appl. No.:
09/800990
Inventors:
Hui Wang - Fremont CA
Assignee:
ACM Research, Inc. - Fremont CA
International Classification:
B23H 304
US Classification:
20429701, 20429705, 20429709, 2042971, 20429714, 2042861, 2042883
Abstract:
A wafer chuck for holding a wafer during electropolishing and/or electroplating of the wafer includes a top section, a bottom section, and a spring member. In accordance with one aspect of the present invention, the top section and the bottom section are configured to receive the wafer for processing. The spring member is disposed on the bottom section and configured to apply an electric charge to the wafer. In accordance with another aspect of the present invention, the spring member contacts a portion of the outer perimeter of the wafer. In one alternative configuration of the present invention, the wafer chuck further includes a seal member to seal the spring member from the electrolyte solution used in the electropolishing and/or electroplating process.

Precursors For Making Low Dielectric Constant Materials With Improved Thermal Stability

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US Patent:
6534616, Mar 18, 2003
Filed:
Apr 17, 2001
Appl. No.:
09/836815
Inventors:
Chung J. Lee - Fremont CA
Hui Wang - Fremont CA
Giovanni Antonio Foggiato - Morgan Hill CA
Assignee:
Quester Technology, Inc. - Fremont CA
International Classification:
C08G 7724
US Classification:
528 42, 528 31, 528 43, 528397, 528401, 25218211, 438780
Abstract:
Fluorinated chemical precursors, methods of manufacture, polymer thin films with low dielectric constants, and integrated circuits comprising primarily of sp CâF and some hyperconjugated sp CâF bonds are disclosed in this invention. Precursors are disclosed for creating fluorinated silanes and siloxanes, and fluorinated hydrocarbon polymers. Thermal transport polymerization (TP), chemical vapor deposition (CVD), plasma enhanced CVD (PECVD), high density PECVD (HDPCVD), photon assisted CVD (PACVD), and plasma-photon assisted (PPE) CVD and PPETP of these chemicals provides thin films with low dielectric constants and high thermal stabilities for use in the manufacture of integrated circuits.

Electropolishing Metal Layers On Wafers Having Trenches Or Vias With Dummy Structures

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US Patent:
6638863, Oct 28, 2003
Filed:
Mar 27, 2002
Appl. No.:
10/108614
Inventors:
Hui Wang - Fremont CA
Peihaur Yih - Newark CA
Assignee:
ACM Research, Inc. - Fremont CA
International Classification:
H01L 21302
US Classification:
438690, 438626
Abstract:
In electropolishing a metal layer on a semiconductor wafer, a dielectric layer is formed on the semiconductor wafer. The dielectric layer is formed with a recessed area and a non-recessed area. A plurality of dummy structures are formed within the recessed areas where the dummy structures are inactive areas configured to increase the planarity of a metal layer subsequently formed on the dielectric layer. A metal layer is then formed to fill the recessed area and cover the non-recessed area and the plurality of dummy structures. The metal layer is then electropolished to expose the non-recessed area.

Low Dielectric Constant Materials Prepared From Photon Or Plasma Assisted Chemical Vapor Deposition And Transport Polymerization Of Selected Compounds

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US Patent:
6663973, Dec 16, 2003
Filed:
Dec 20, 1999
Appl. No.:
09/468378
Inventors:
Chung J. Lee - Fremont CA
Hui Wang - Fremont CA
Giovanni Antonio Foggiato - Morgan Hill CA
Assignee:
Canon, USA, Inc. - Lake Success NY
International Classification:
B32B 904
US Classification:
428447, 427489, 427515, 428450
Abstract:
Intermetal dielectric (IMD) and interlevel dielectric (ILD) that have dielectric constants (K) ranging from 2. 0 to 2. 6 are prepared from plasma or photon assisted CVD (PACVD) or transport polymerization (TP). The low K dielectric (LKD) materials are prepared from PACVD or TP of some selected siloxanes and F-containing aromatic compounds. The thin films combine barrier and adhesion layer functions with low dielectric constant functions, thus eliminating the necessity for separate adhesion and barrier layers, and layers of low dielectric constant. The LKD materials disclosed in this invention are particularly useful for 0. 18 m ICs, or when copper is used as conductor in future ICs.
Hui Min Wang from San Francisco, CA, age ~69 Get Report