Hee J Kim

7990524, Aug 2, 2011

Jun 29, 2007

11/771064

Justin E. Jureller - Chicago IL, US
Hee Y. Kim - Chicago IL, US
Norbert F. Scherer - Winnetka IL, US

The University of Chicago - Chicago IL

G01N 1/00

356 36

A rapid-sampling stochastic scanning multiphoton multifocal microscopy (SS-MMM) fluorescence imaging technique enables multiparticle tracking at rates upwards of 1,000 times greater than conventional single point raster scanning. Stochastic scanning of a diffractive optical element may generate a 10×10 hexagonal array of foci with a white noise driven galvanometer to yield a scan pattern that is random yet space-filling. SS-MMM may create a more uniformly sampled image with fewer spatio-temporal artifacts than obtained by conventional or multibeam raster scanning.

8547280, Oct 1, 2013

Jul 14, 2010

12/836442

Fangchou Yang - Los Angeles CA, US
Hee Kyung Kim - El Segundo CA, US
Clifton Quan - Arcadia CA, US
Alberto F. Viscarra - Torrance CA, US
Robert W. Ladera - Fullerton CA, US

Raytheon Company - Waltham MA

H01Q 1/38

343700MS, 343789, 343898

Provided is a radiator transition assembly for exciting a long slot radiator of an antenna, the transition assembly including a folded flexible circuit substrate including at least two folds forming a long slot radiator, an excitation circuitry configured to generate signals for exciting the long slot radiator, and a microstrip transmission line coupled to the excitation circuitry and positioned along the folded flexible circuit substrate, where the microstrip transmission line extends across an opening of the long slot radiator.

8043464, Oct 25, 2011

Nov 17, 2009

12/620490

Hee Kyung Kim - El Segundo CA, US
Fangchou Yang - Los Angeles CA, US
Alberto F. Viscarra - Torrance CA, US
Clifton Quan - Arcadia CA, US
Derek Pruden - Redondo Beach CA, US

Raytheon Company - Waltham MA

B32B 37/00
B29C 65/00
C09J 5/04
H01Q 13/10

156292, 156182, 156314, 343770

Systems and methods for assembling lightweight RF antenna structures are provided. In one embodiment, the invention relates to a process for forming a lightweight antenna including a process for forming a first feed assembly for the antenna, the process for forming the first feed assembly including providing a flat flexible circuit substrate, providing a formed flexible circuit substrate, applying an adhesive to a plurality of locations on a surface of the flat substrate or the formed substrate, joining the flat substrate and the formed substrate using the adhesive, and heating the joined flat substrate and the formed substrate to bond the substrates.

20130319732, Dec 5, 2013

Apr 18, 2013

13/865730

Hee Kyung Kim - El Segundo CA, US
Fangchou Yang - Los Angeles CA, US
Kevin C. Rolston - Westchester CA, US
Edward Marsh Jackson - Long Beach CA, US

RAYTHEON COMPANY - Waltham MA

H05K 1/02

174254

A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, an interconnect assembly includes a first flat flexible layer having a signal conductor and a ground conductor forming a first microstripline or microstrip transmission line, a second folded flexible layer having a signal conductor and a ground conductor forming a second microstripline or microstrip transmission line, the bottom surface of the second folded flexible layer having ridge portions, a non-conductive adhesive layer disposed between the top surface of the first flat flexible layer and the ridge portions of the second folded flexible layer, a signal through-hole extending through the non-conductive adhesive layer and the first flat flexible layer, and two ground through-holes extending through the non-conductive adhesive layer and the second folded flexible layer, wherein the two ground through-holes are disposed on opposite sides of the signal through-hole.