Eun Y Kim

6857501, Feb 22, 2005

Sep 21, 2000

10/089008

Eun Sok Kim - Torrance CA, US

The United States of America as represented by the Secretary of the Navy - Washington DC

H04R007/00
H04R031/00

181158, 181164, 181167, 381173, 381190, 381191, 381423, 381426, 29594, 216 2, 216 99

A micromachined acoustic transducer comprising a parylene diaphragm piezoelectric transducer. The parylene diaphragm has far lower stiffness than the silicon nitride. The method for fabricating the parylene diaphragm acoustic transducer utilizes a prestructured disphragm layer utilizing silicon nitride which is compatible with high temperature semiconductor process. A silicon nitride layer is patterned and partially removed after forming the parylene diaphragm layer in order to enhance the structural qualities of the parylene diaphragm. The diaphragm may be flat or dome-shaped.

D513093, Dec 20, 2005

Sep 15, 2004

29/213296

Eun Suk Kim - Garden Grove CA, US

2803

D28 59

7332127, Feb 19, 2008

Jul 11, 2002

10/194996

Eun Sok Kim - Torrance CA, US
Jae Wan Kwon - Los Angeles CA, US

University of Southern California - Los Angeles CA

B01L 3/02

422100, 422 63, 422 65

A DNA probe synthesis system may include a target holder for holding a target chip, an ejector array chip, a wash and dry station, and conveyance means for moving the target holder and the chip between the ejector array chip and the wash and dry station. The ejector array chip may include ejectors, reservoirs for containing DNA bases, and microchannels all on the same substrate. The ejectors may be Self Focusing Acoustic Transducers (SFATs).

7481112, Jan 27, 2009

Sep 30, 2005

11/240804

Eun Sok Kim - Rancho Palos Verdes CA, US
Qiang Zou - Alhambra CA, US

University of Southern California - Los Angeles CA

G01P 15/12
G01P 9/04

7351433, 7350412

A MEMS silicon inertial sensor formed of a mass that is supported and constrained to vibrate in only specified ways. The sensors can be separately optimized from the support, to adjust the sensitivity separate from the bandwidth. The sensor can sense three dimensionally, or can only sense in a single plane.

7719170, May 18, 2010

Jan 11, 2008

12/013413

Eun Sok Kim - Rancho Palos Verdes CA, US
Hongyu Yu - Los Angeles CA, US

University of Southern California - Los Angeles CA

H01L 41/08

310335

Techniques, apparatus and systems that use an acoustic transducer with a Fresnel lens to focus an acoustic wave for various applications, including acoustic droplet ejectors.

7824630, Nov 2, 2010

Feb 19, 2008

12/033845

Eun Sok Kim - Torrance CA, US
Jae Wan Kwon - Los Angeles CA, US

University of Southern California - Los Angeles CA

G01N 1/10
B01L 3/02

422180, 422100, 422 63, 422 65

A DNA probe synthesis system may include a target holder for holding a target chip, an ejector array chip, a wash and dry station, and conveyance means for moving the target holder and the chip between the ejector array chip and the wash and dry station. The ejector array chip may include ejectors, reservoirs for containing DNA bases, and microchannels all on the same substrate. The ejectors may be Self Focusing Acoustic Transducers (SFATs).

8216434, Jul 10, 2012

Mar 3, 2008

12/041577

Tzung K. Hsiai - Santa Monica CA, US
Gopikrishnan Soundararajan - Alisa Viejo CA, US
Eun Sok Kim - Rancho Palos Verdes CA, US
Hongyu Yu - Mesa AZ, US
Mahsa Rouhanizadeh - Newport Beach CA, US
Christina Tiantian Lin - Santa Rosa CA, US

University of Southern California - Los Angeles CA

C23C 14/34

20419215, 20419217, 438 50, 438 54, 438694, 438706, 438712, 438724, 438753, 438757, 216 2, 216 58, 216 66, 216 99

A micromachined sensor for measuring vascular parameters, such as fluid shear stress, includes a substrate having a front-side surface, and a backside surface opposite the front-side surface. The sensor includes a diaphragm overlying a cavity etched within the substrate, and a heat sensing element disposed on the front-side surface of the substrate and on top of the cavity and the diaphragm. The heat sensing element is electrically couplable to electrode leads formed on the backside surface of the substrate. The sensor includes an electronic system connected to the backside surface and configured to measure a change in heat convection from the sensing element to surrounding fluid when the sensing element is heated by applying an electric current thereto, and further configured to derive from the change in heat convection vascular parameters such as the shear stress of fluid flowing past the sensing element.

7360422, Apr 22, 2008

Sep 30, 2005

11/241869

Asad Madni - Los Angeles CA, US
Qiang Zou - Los Angeles CA, US
Eun Sok Kim - Rancho Palos Verdes CA, US
Lynn Costlow - Clayton CA, US
Jim Vuong - Northridge CA, US
Roger Wells - Yorba Linda CA, US

University of Southern California - Los Angeles CA

G01P 9/04
G01P 15/12

7350412, 7350416, 7351433

A MEMS silicon inertial sensor formed of a mass that is supported and constrained to vibrate in only specified ways. The sensors can be separately optimized from the support, to adjust the sensitivity separate from the bandwidth. The sensor can sense three dimensionally, or can only sense in a single plane. Vibration cancellation may be provided.