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Duy N Le

from Concord, CA
Age ~39
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Related to:
Khanh Van LeV L TuanDavid Le, 39John Longworth, 77Quang T Le, 64Linda Le, 40
Connected to:
Ai Le, 52Alphonse A Le, 51Amie Le, 46Angela M Le, 48Angeline H Le, 45Anhvu X Le, 56Annette M Le, 88Anson H Le, 39Antoine Le, 43Ar Le, 37

Duy Le Phones & Addresses

  • Concord, CA
  • San Leandro, CA
  • 1227 144Th Ave, San Leandro, CA 94578 (510) 351-5472

Professional Records

Medicine Doctors

Duy Le Photo 1

Duy Le

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Specialties:
Neurology
Duy Le Photo 2

Duy Hoang Le, Milpitas CA

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Specialties:
Chiropractor
Address:
995 Montague Expy, Milpitas, CA 95035

License Records

Duy Danh Le

License #:
2710030806
Category:
Tradesman

Duy Khang Le Nguyen

License #:
0225083794
Category:
Real Estate Individual

Publications

Us Patents

Optimized Weld Strength For Dissimilar Materials

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US Patent:
20200332400, Oct 22, 2020
Filed:
Aug 6, 2019
Appl. No.:
16/533374
Inventors:
- Cupertino CA, US
Abhijeet Misra - Sunnyvale CA, US
Lei Gao - Shanghai, CN
Matthew D. Walker - Los Gatos CA, US
Logan Ames - Palo Alto CA, US
Duy P. Le - Los Angeles CA, US
Vince Yan - San Francisco CA, US
International Classification:
C22C 38/16
B23K 26/21
B23K 26/06
Abstract:
An electronic device can include a component including a first material joined to a component including a second, different material. The first material can include steel and copper, while the second material can include aluminum. The first material can be joined to the second material by a pulsed laser welding process that forms an interface region having a ratio of an interface region length to a lateral length greater than about

Earphones

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US Patent:
20200314518, Oct 1, 2020
Filed:
Sep 9, 2019
Appl. No.:
16/564804
Inventors:
- Cupertino CA, US
Eugene A. Whang - San Francisco CA, US
Robert A. Boyd - Los Angeles CA, US
Duy P. Le - Los Angeles CA, US
Yi-Fang D. Tsai - Mountain View CA, US
David J. Feathers - San Jose CA, US
Shota Aoyagi - San Francisco CA, US
Sean S. Corbin - San Jose CA, US
Assignee:
Apple Inc. - Cupertino CA
International Classification:
H04R 1/10
Abstract:
An earpiece is described that includes a driver housing that encloses an audio driver. The driver housing is oriented so that a first end of the driver housing can be supported by a concha bowl of a user's ear and a second end opposite the first end can tilt outside of the user's ear so that the ear need not accommodate an entirety of the driver housing. The driver housing is held in place by an ear clip that engages an exterior portion of the user's ear and attaches to the driver housing by way of a bridge element that can enclose other electronic components such as a battery, antenna, processor and the like.

Vacuum Impregnation Seal In An Electronic Device

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US Patent:
20200026108, Jan 23, 2020
Filed:
Jul 20, 2018
Appl. No.:
16/041591
Inventors:
- Cupertino CA, US
Logan M. AMES - Palo Alto CA, US
HaiLong WANG - Shanghai, CN
Ricky C. LEE - Arcadia CA, US
Duy P. LE - Los Angeles CA, US
International Classification:
G02F 1/1341
G02F 1/1339
Abstract:
An electronic device is disclosed. The electronic device may include an enclosure that includes a metal band and a wall. The electronic device may further include a filler compound positioned in an opening of the metal band, where a split between two sidewall components defines the opening. The filler compound provides an RF communication path through the enclosure. In order to reduce or prevent liquid ingress into the enclosure, the electronic device may include a sealing compound that infused into the opening between the filler compound and the sidewall components, thereby providing a seal. The infusion process including placing the metal band (with the filler compound) in a chamber, providing a vacuum to remove air between the metal band and the filler compound, and subsequently providing a positive pressure to force the sealing compound between the metal band and the filler compound. The sealing compound may include an adhesive.

Coupling Structures For Electronic Device Housings

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US Patent:
20190036201, Jan 31, 2019
Filed:
Sep 29, 2018
Appl. No.:
16/147703
Inventors:
- Cupertino CA, US
Michael B. Wittenberg - Sunnyvale CA, US
Shane Bustle - Cupertino CA, US
Duy P. Le - Cupertino CA, US
International Classification:
H01Q 1/24
H04M 1/02
G06F 1/16
B29C 45/14
B29C 37/00
B29L 31/34
Abstract:
A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

Laser Bleach Marking Of An Anodized Surface

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US Patent:
20180065402, Mar 8, 2018
Filed:
Jun 22, 2017
Appl. No.:
15/630594
Inventors:
- Cupertino CA, US
Duy P. Le - Santa Clara CA, US
Burak Metin - Cupertino CA, US
Junjie Xu - Cupertino CA, US
Ming Li - Cupertino CA, US
International Classification:
B44C 1/22
B23K 26/362
B23K 26/40
C25D 11/24
H04B 1/3888
Abstract:
A deep black housing for a handheld electronic device is disclosed having one or more high resolution, bleached markings. The bleached markings are significantly lighter than the housing and exhibit a smooth appearance. Methods for preparing a housing having the finish and markings are also disclosed, including housings for use in mobile phones.

Coupling Structures For Electronic Device Housings

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US Patent:
20170069956, Mar 9, 2017
Filed:
Aug 10, 2016
Appl. No.:
15/233891
Inventors:
- Cupertino CA, US
Michael B. Wittenberg - Cupertino CA, US
Shane Bustle - Cupertino CA, US
Duy P. Le - Cupertino CA, US
International Classification:
H01Q 1/24
H05K 5/02
B29C 65/70
Abstract:
A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

Housing Features Including Logo Features Of An Electronic Device

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US Patent:
20160066454, Mar 3, 2016
Filed:
Feb 25, 2015
Appl. No.:
14/631626
Inventors:
- Cupertino CA, US
Michael Benjamin Wittenberg - Sunnyvale CA, US
Sawyer I. Cohen - Sunnyvale CA, US
Benjamin Shane Bustle - Cupertino CA, US
Duy P. Le - San Francisco CA, US
International Classification:
H05K 5/02
G06F 1/16
G09F 23/00
Abstract:
An enclosure having an indicium (e.g., logo) and a method for securing an indicium to an enclosure is disclosed. The enclosure includes an aperture extending through an interior portion and an exterior portion of the enclosure. The aperture may include concentric portions. For example, the aperture may include a first opening formed on an interior portion and a second opening smaller than the first opening formed on the exterior portion. The indicium may include a flange member such that the indicium may extend through the first opening but not the second opening. Also, in some embodiments, a plate is adhesively secured to the indicium and the enclosure; however, the indicium is not directly adhesively secured to the enclosure. This may prevent adhesively from protruding from an interface region between the indicium and the enclosure.

Unique Part Identifiers

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US Patent:
20140086474, Mar 27, 2014
Filed:
Sep 27, 2012
Appl. No.:
13/629561
Inventors:
- Cupertino CA, US
Duy P. LE - San Francisco CA, US
Assignee:
APPLE INC. - Cupertino CA
International Classification:
G06K 9/62
US Classification:
382141
Abstract:
A method of providing a unique identifier for a manufactured part includes defining a boundary area on at least one surface of the manufactured part, recording surface properties within a portion of the boundary area, interpreting the recorded surface properties with a pattern recognition algorithm to create the unique identifier, and storing the unique identifier in a database.
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Duy N Le from Concord, CA, age ~39 Get Report