Don Q Le

7885062, Feb 8, 2011

Dec 9, 2005

11/299056

Barry A. Wagner - San Jose CA, US
Don Le - San Jose CA, US
William P. Tsu - San Jose CA, US

NVIDIA Corporation - Santa Clara CA

H05K 5/00

36167949

The present invention pertains to a computer chassis with improved airflow to reduce the occurrence of trapped air pockets and increase heat transfer from components within the chassis. The computer chassis includes a plurality of chambers, wherein each of the chambers is separated by a partition. The partitions are operable to reduce the occurrence of trapped air pockets and increase heat transfer from components of the chassis by causing air to flow through each of the chambers. The computer chassis further includes at least two air vents, wherein each of the chambers is coupled to at least one of the at least two air vents through which air enters the chamber, and wherein each of the chambers is coupled to at least one of the at least two air vents through which air exits the chamber.

7965506, Jun 21, 2011

Aug 22, 2007

11/843324

Zhihai Zack Yu - Petaluma CA, US
Don Le - San Jose CA, US

NVIDIA Corporation - Santa Clara CA

H05K 7/20
F28F 7/00
H01L 23/34

361697, 361703, 361709, 165 803, 174 163, 257717, 257722

A heat sink apparatus and method are provided for allowing air to flow directly to an integrated circuit package thereunder. In use, a heat sink is provided including an upper portion with a plurality of fins, and a lower portion configured for allowing air to flow directly to an integrated circuit package thereunder.

7969733, Jun 28, 2011

Dec 17, 2008

12/336851

Samuel Abbay - San Francisco CA, US
Jeong Hun Kim - Sunnyvale CA, US
Don Le - Santa Clara CA, US

NVIDIA Corporation - Santa Clara CA

H05K 7/20

361695, 361699, 361719, 361721, 174 151, 174 161, 165 803, 165 804, 16510433

A heat transfer system, method, and computer program product are provided for use with multiple circuit board environments. In use, a heat transfer component configured to be situated between a first circuit board and a second circuit board is provided. Such heat transfer component is in thermal communication with a first processor of the first circuit board and a second processor of the second circuit board. Furthermore, the heat transfer component is situated between the first circuit board and the second circuit board.

7359205, Apr 15, 2008

Nov 9, 2005

11/270997

Xiaohua H. Sun - Cupertino CA, US
Don Le - San Jose CA, US

NVIDIA Corporation - Santa Clara CA

H05K 7/20
F28F 7/00

361719, 361694, 361695, 165 802

Embodiments of the present invention recite an electronic device comprising a chassis, a backplane, at least one heat generating component coupled with the backplane, and a fan. In embodiments of the present invention, the chassis comprises at least one air inlet disposed on a side of the chassis and at least one exhaust outlet disposed on the bottom surface of the chassis. The heat generating component is suspended from said backplane when coupled therewith and is disposed above the at least one exhaust outlet. The fan draws cooling air through the at least one air inlet and expels the cooling air through the at least one exhaust outlet.