Dae Shik Park

6602214, Aug 5, 2003

Oct 19, 1999

09/420408

Thomas J. Heinz - Flintridge CA
Dae Shik Park - Fullerton CA
Rafn Stefansson - San Marino CA

Bio Cybernetics International - Pasadena CA

A61F 500

602 19, 128 991

An orthotic trauma device is provided including an elongated orthosis body adapted to be wrapped around a portion of a body, the orthosis body being formed of a pliant material be easily cut with cloth-cutting scissors; a detachable fastening device provided at distal ends of the elongated orthosis body to releasably secure the distal ends to one another; and means for adjusting the tightness of the orthosis body operatively associated with the detachable fastening device. A pulley system for use in an orthotic device includes a pair of pulley banks arranged in a first and second of the pair of pulley banks detachably connected to a first distal end and a second distal end of the orthosis body respectively, a first bank of which is adapted to be detachably disposed on a first distal end of an elongated orthosis body and a second bank of pulleys adapted to be detachably disposed on a second distal end of the elongated orthosis body; and a cable interconnecting the two pulley banks and running through a pulley on each of the pulley banks in alteration, such that shortening of the cable pulls the pulley banks together and tightens the orthotic device with the aid of a mechanical advantage.

6951547, Oct 4, 2005

Mar 29, 2004

10/810860

Dae Shik Park - Fullerton CA, US
Mark Alan Latham - Riverside CA, US
Willard Allen Miller - Carlsbad CA, US

A61F005/00
A61F005/28

602 19, 1281021, 1281031

A waist support frame for a detachment type waist protecting belt to hold the vertebra region of a vertebra related patient is provided. The frame is comprised of, including but not limited to, two plastic plates. Each of the plates has a window at the center and one guiding nut on the center of the exterior side of the inner-half of the rim. The two plates are connected by two hinges, which are attached to the upper and the lower parts of the plastic plates, to form a saddle like shape that fits the contour of the waist of an individual patient dynamically.

7481233, Jan 27, 2009

Oct 23, 2006

11/585035

Dae Shik Park - Rowland Heights CA, US

A61H 3/021

135 82, 135 69, 135 73, 135 86

A crutch equipped with double shock absorbers is provided. The crutch of the current invention has an air shock absorber vertically combined with a spring shock absorber in one base shaft. A rubber shoe receives bottom of the spring shock absorber. The crutch of the current invention absorbs the shock of stepping ground firstly with the spring shock absorber and then reduces the impact with the air shock absorber. The double shock absorbing mechanism provides a smooth feeling of stepping the ground to a user. The strength of the resilient force of the crutch can be adjusted for each user, based on weight of a user, by medical doctor's characterization.

7905849, Mar 15, 2011

Jan 26, 2009

12/321804

Dae Shik Park - Rowland Heights CA, US

A61F 5/00
A61F 5/37
A61B 19/00
A41F 19/00

602 19, 602 23, 128876, 128869, 2309

A waist support frame for a detachment type waist protecting belt to hold the vertebra region of a vertebra related patient is provided. The frame is comprised of two back rest frames, two Y-shape hinges, two power modules, two pullers, two sets of strings each of them are engaged and connects on one part (upper- or lower-part) of the two power modules, and two set of broad bands. Each power module is equipped with twelve pair of pulling code conveying mini rollers. String arrangement through these twelve pair of rollers enables the inventor to provide a waist support frame that can be used by a user whose one hand is not available without rotating the frame around the user's body with only one hand.

8546849, Oct 1, 2013

Feb 1, 2012

13/364242

Chuan Cheah - Torrance CA, US
Dae Keun Park - Irvine CA, US

International Rectifier Corporation - El Segundo CA

H01L 29/778
H01L 29/20

257195, 257194, 257696, 257E29089, 257E29249, 257 76

Some exemplary embodiments of high voltage cascoded III-nitride semiconductor package utilizing clips on a package support surface have been disclosed. One exemplary embodiment comprises a III-nitride transistor attached to a package support surface and having an anode of a diode stacked over a source of the III-nitride transistor, a first conductive clip coupled to a gate of the III-nitride transistor and the anode of the diode, and a second conductive clip coupled to a drain of the III-nitride transistor. The conductive clips are connected to the package support surface and expose respective flat portions that are surface mountable. In this manner, reduced package footprint, improved surge current capability, and higher performance may be achieved compared to conventional wire bonded packages. Furthermore, since a low cost printed circuit board (PCB) may be utilized for the package support surface, expensive leadless fabrication processes may be avoided for cost effective manufacturing.

20010020144, Sep 6, 2001

Mar 22, 2001

09/813867

Thomas Heinz - Flintridge CA, US
Dae Park - Fullerton CA, US

Bio Cybernetics International

A61F005/00

602/019000

An orthotic device is provided, including an orthosis body adapted to be wrapped around the torso of a wearer of the device, the orthosis body having at least two segments in juxtaposed relationship. Means are provided at free end portions of the at least two segments to releasably secure the free end portions to one another. At least two cables are provided, each cable operatively connected to the at least two segments. At least two sets of pulleys are mounted on the at least two segments with each cable operatively connected to the at least two segments running through a pulley on each of the at least two segments in alteration, shortening of each cable pulling the at least two segments together and tightening the orthotic device with the aid of a mechanical advantage dependent upon the number of pulleys mounted on each of the at least two segments.

20060089875, Apr 27, 2006

Oct 22, 2004

10/970934

Dae Park - Los Angeles CA, US
Chang Jung - Los Angeles CA, US
Bo Lee - Los Angeles CA, US
Brian Chung - Los Angeles CA, US

G06Q 30/00

705014000

An integrated online purchase reward system includes one or more first information processing devices, one or more second information processing devices, a network, and one or more purchase transaction monitoring devices which read in a purchase transaction medium, and print out purchase transaction records on the purchase transaction media as a hard copy. The first information processing devices receive, process, and distribute data, and respond to requests from the second information processing devices. The first information processing device includes database, and the second information processing devices are connected with the purchase transaction monitoring device. The network works on a TCP/IP Protocol environment and connects the first and the second information processing devices. The purchase transaction information including reward or gift is printed on a PET card through line thermal printing. A person with an appropriate authorization can access the first information processing device through internet and retrieve data.

20120280245, Nov 8, 2012

Feb 1, 2012

13/364189

Chuan Cheah - Torrance CA, US
Dae Keun Park - Irvine CA, US

INTERNATIONAL RECTIFIER CORPORATION - El Segundo CA

H01L 29/778
H01L 21/56

257 76, 438123, 257E29246, 257E21502

Some exemplary embodiments of high voltage cascoded III-nitride semiconductor package with a stamped leadframe have been disclosed. One exemplary embodiment comprises a III-nitride transistor having an anode of a diode stacked atop a source of the III-nitride transistor, and a stamped leadframe comprising a first bent lead coupled to a gate of the III-nitride transistor and the anode of the diode, and a second bent lead coupled to a drain of the III-nitride transistor. The bent leads expose respective flat portions that are surface mountable. In this manner, reduced package footprint, improved surge current capability, and higher performance may be achieved compared to conventional wire bonded packages. Furthermore, since multiple packages may be assembled at a time, high integration and cost savings may be achieved compared to conventional methods requiring individual package processing and externally sourced parts.