Chang K Yi

7195808, Mar 27, 2007

Sep 29, 2003

10/674946

Chang Bok Yi - Fremont CA, US

Seagate Technology, LLC - Scotts Valley CA

G11B 5/66
G11B 5/70

428 665, 4288485, 360135

A system for marking the different sides of a substrate so that the different sides can be identified is disclosed. A substrate holder is used for marking a substrate during the film growth process so that the different sides of the substrate can be distinguished includes a set of fingers having a groove for holding the substrate. The fingers extend over a surface of the substrate for shielding incoming material being deposited onto the surface of the substrate leaving a portion of the surface uncovered. The fingers are positioned asymmetrically. The fingers include a first finger, a second finger, and a third finger, with a distance between said first finger and said second finger is less than the distance between said first finger and said third finger and is less than the distance between said second finger and said third finger.

8573579, Nov 5, 2013

Mar 1, 2010

12/715144

Chang Bok Yi - Fremont CA, US
Tatsuru Tanaka - Campbell CA, US
Chun Wai Joseph Tong - San Jose CA, US
Hongling Liu - Sunnyvale CA, US
Paul S. McLeod - Berkeley CA, US

Seagate Technology LLC - Cupertino CA

B25B 5/16

269254CS, 269 21

Methods and apparatus are provided for static-biasing a pre-metalized non-conductive substrate within a process chamber. A substrate holder that holds a pre-metalized non-conductive substrate is engaged by a lift mechanism that provides movement of the substrate in a first, upward direction to a contact position within the process chamber and in a second direction to a non-contact position. When the substrate holder is moved to the contact position, the substrate electrically engages a conductive spring-loaded compliance mechanism that is mounted in a fixed position within the process chamber. The spring-loaded compliance mechanism is connected to a bias-voltage feed-through for the process chamber that applies a bias voltage to the substrate via the spring-loaded compliance mechanism.

20040250996, Dec 16, 2004

May 21, 2004

10/849848

Chang Yi - Fremont CA, US
Tatsuru Tanaka - Campbell CA, US
Paul McLeod - Berkeley CA, US

SEAGATE TECHNOLOGY LLC

F28F005/00

165/086000, 165/185000

An apparatus and method for cooling a planar workpiece, such as a substrate of a recording disk, in an evacuated environment has a heat exchanging structure with at least two heat sinks having substantially parallel facing surfaces disposed within a vacuum chamber. A drive arrangement is connected to the heat sinks to controllably and dynamically drive the parallel facing surfaces of the heat sinks towards and away from each other.

20050072664, Apr 7, 2005

Oct 2, 2003

10/676105

Charles Brucker - Pleasanton CA, US
Paul McLeod - Berkeley CA, US
Chang Yi - Fremont CA, US

C23C014/32

204192120, 204298070

A method of forming a thin film on a substrate/workpiece by sputtering, comprising steps of: (a) providing an apparatus comprising a vacuum chamber including at least one sputtering source and a gas supply means for injecting a gas containing at least one reactive component into said chamber, the gas supply means comprising a plurality of differently-sized outlet orifices adapted for providing substantially the same flow rate of gas from each orifice; (b) providing a substrate/workpiece having at least one surface for formation of a thin film thereon; (c) generating a sputtered particle flux from the at least one sputtering source; (d) injecting the gas containing the at least one reactive component into the chamber via the gas supply means, such that the same gas flow rate is provided at each orifice; and (e) forming a reactively sputtered thin film on the at least one surface of the substrate/workpiece, the reactively sputtered thin film having a substantially uniform content of the at least one reactive component.

20070158181, Jul 12, 2007

Jan 12, 2006

11/330200

Chang Yi - Fremont CA, US
Tatsuru Tanaka - Campbell CA, US
Thomas Greenberg - Berkeley CA, US
Christopher Neill - San Jose CA, US

C23C 14/00

204192120, 204298010

A method of sputter depositing a substantially circumferentially uniform thin film on a surface of a circular, planar disk-shaped substrate, comprising steps of: (a) providing a cathode sputtering apparatus including: a vacuum chamber; a cathode sputtering source comprising a circularly-shaped sputtering target assembly with a first target having a planar sputtering surface and a circumferentially extending edge; and a circular disk-shaped substrate with a planar surface positioned in spaced opposition to the sputtering surface; and (b) sputter depositing the thin film on the substrate surface while providing the chamber with a substantially uniform flow of at least one process gas around the entirety of the circumferentially extending edge of the sputtering target assembly.

20070158186, Jul 12, 2007

Jan 12, 2006

11/330198

Chang Yi - Fremont CA, US
Tatsuru Tanaka - Campbell CA, US

C23C 14/00

204298010

A cathode sputtering source comprises a heat sink comprising a substantially circularly-shaped planar disk formed of an electrically and thermally conductive material, with a circumferentially extending edge connecting first and second opposing major surfaces, the first major surface including a plurality of radially extending, recessed gas supply channels formed therein and extending from a central recess formed in the first major surface to the circumferentially extending edge; the second major surface including a gas inlet formed adjacent the circumferentially extending edge; a gas flow channel formed in the interior of the disk fluidly connects the gas inlet and central recess; and a substantially circular disk-shaped sputtering target is mounted on the first major surface, whereby gas supplied to the gas inlet is substantially uniformly distributed around the entirety of the circumferentially extending edge of the heat sink. Preferred embodiments include a rotatable magnetron magnet assembly positioned behind the heat sink.

20140050843, Feb 20, 2014

Aug 17, 2012

13/588946

Chang B. YI - FREMONT CA, US
Hongling LIU - Sunnyvale CA, US
Hua YUAN - Fremont CA, US
Tatsuru TANAKA - Campbell CA, US

WD MEDIA, INC. - San Jose CA

G11B 5/851

427132, 118 58, 427127

A disk processing system having a heater chamber and dual single-sided sputter chambers each with a sustaining heater.