Resumes
Resumes
Biao Wu Phones & Addresses
-
Santa Clara, CA
-
San Jose, CA
-
Cupertino, CA
-
Davis, CA
-
Milpitas, CA
-
Austin, TX
-
New Orleans, LA
Business Records
Name / Title
Company / Classification
Phones & Addresses
President, President
MOLEFARMING LABORATORY USA
Nonclassifiable Establishments
Nonclassifiable Establishments
2928 W Laguna Ct, Elk Grove, CA 95758
Actech LLC
Engineering Consultant · Technology Service
Engineering Consultant · Technology Service
38832 Argonaut Way, Fremont, CA 94536
President, President, Secretary, Treasurer
GS INTERNATIONAL BIOTECH HOLDINGS, INC
2928 W Laguna Ct, Elk Grove, CA 95758
723 S Casino Ctr Blvd, Las Vegas, NV 89101
723 S Casino Ctr Blvd, Las Vegas, NV 89101
Publications
Us Patents
Rinsing Processes And Equipment
View pageUS Patent:
7364625, Apr 29, 2008
Filed:
May 20, 2002
Appl. No.:
10/152077
Inventors:
Kurt K. Christenson - Minnetonka MN, US
Steven L. Nelson - Minnetonka MN, US
James R. Oikari - New Brighton MN, US
Jeff F. Olson - Burnsville MN, US
Biao Wu - Milpitas CA, US
Steven L. Nelson - Minnetonka MN, US
James R. Oikari - New Brighton MN, US
Jeff F. Olson - Burnsville MN, US
Biao Wu - Milpitas CA, US
Assignee:
FSI International, Inc. - Chaska MN
International Classification:
B08B 3/02
US Classification:
134 2, 134 3, 134 19, 134 21, 134 26, 134 28, 134 30, 134 31, 134 32, 134 33, 134 34, 134 35, 134 36, 134 37, 134 41, 134 42, 134902
Abstract:
Described are methods of rinsing and processing devices such as semiconductor wafers wherein the device is rinsed with using a surface tension reducing agent; the method may include a subsequent drying step which preferably incorporates the use of a surface tension reducing agent during at least partial drying; and the method may be performed using automated rinsing equipment; also described are automated rinsing apparatuses useful with the method.
Integrated Process For Etching And Cleaning Oxide Surfaces During The Manufacture Of Microelectronic Devices
View pageUS Patent:
20030087532, May 8, 2003
Filed:
Nov 1, 2001
Appl. No.:
10/001933
Inventors:
Biao Wu - Cupertino CA, US
Erik Olson - Shakopee MN, US
Ramkumar Krishnaswamy - San Jose CA, US
Eugene Smith - Apple Valley MN, US
Erik Olson - Shakopee MN, US
Ramkumar Krishnaswamy - San Jose CA, US
Eugene Smith - Apple Valley MN, US
International Classification:
H01L021/311
H01L021/302
H01L021/461
H01L021/302
H01L021/461
US Classification:
438/745000
Abstract:
The present invention provides integrated systems and methods for carrying out manufacturing steps relating to etching, photoresist stripping and optionally, particle removal. More specifically, the present invention provides integrated systems and methods which may be utilized to etch oxide with subsequent removal of photoresist using BOE solutions that are desirably blended on-line. Advantageously, systems and methods embodying features of the present invention include a single process chamber so that cycle time and individual step processing time are reduced, further resulting in increased productivity of the systems and methods.
Methods And Apparatuses For Deuterium Recovery
View pageUS Patent:
20160035600, Feb 4, 2016
Filed:
Jul 31, 2014
Appl. No.:
14/448745
Inventors:
- Seoul, KR
Biao Wu - Cupertino CA, US
Biao Wu - Cupertino CA, US
International Classification:
H01L 21/67
C01B 4/00
B01D 53/02
B03C 3/36
B01D 46/00
B01D 46/44
C01B 4/00
B01D 53/02
B03C 3/36
B01D 46/00
B01D 46/44
Abstract:
Novel methods, systems, and apparatuses for reclaiming annealing gases from a high pressure annealing processing system are disclosed. According to an embodiment, the exhaust gasses from the high pressure annealing processing system are directed into a gas reclaiming system only when a precious gas, e.g., deuterium is used. The annealing gas is the separated from other gasses used in the high pressure annealing processing system and is then pressurized, filtered, and purified prior to transferring the gas to a bulk storage distribution unit. In one embodiment, the reclaimed gas is then again provided to the high pressure annealing processing system to anneal the wafers.