Krishna Parat - Palo Alto CA, US Kiran Pangal - San Jose CA, US Allen Lu - San Mateo CA, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 2176
US Classification:
438424
Abstract:
A method and apparatus for forming shallow and deep isolation trenches in a substrate so that the shallow and deep isolation trenches are aligned without mis-registration. The method includes forming a plurality of shallow trenches, covering a portion of the plurality of shallow trenches, then etching the uncovered shallow trenches to create deeper trenches.
Dual Trench Isolation Using Single Critical Lithographic Patterning
Krishna Parat - Palo Alto CA, US Kiran Pangal - San Jose CA, US Allen Lu - San Mateo CA, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L029/76
US Classification:
257374, 438427, 438241, 438424
Abstract:
A method and apparatus for forming shallow and deep isolation trenches in a substrate so that the shallow and deep isolation trenches are aligned without mis-registration. The method includes forming a plurality of shallow trenches, covering a portion of the plurality of shallow trenches, then etching the uncovered shallow trenches to create deeper trenches.