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Ralph Stenerson Phones & Addresses

  • 5081 Raintree Ct, Doylestown, PA 18902 (267) 994-4764
  • Newtown, PA
  • Levittown, PA
  • Yardley, PA
  • 5081 Raintree Ct, Doylestown, PA 18902 (215) 860-1469

Resumes

Resumes

Ralph Stenerson Photo 1

Ralph Stenerson

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Location:
Doylestown, PA
Industry:
Telecommunications
Work:
Nokia Bell Labs Jan 1972 - Jun 2002
Retired
Education:
Eastern Oklahoma State College
Vaughn College of Aeronautics and Technology
Skills:
Wireless
Cross Functional Team Leadership
Product Management
Program Management
Telecommunications
Unix
Process Improvement
Sales
Voip
Customer Service
Ball Grid Array Repair
Surface Mount Assembly
Assembly Fixture Design
Tool Designer Assembly Jigs and Fixtures
Methods Engineering
Ralph Stenerson Photo 2

Ralph Stenerson

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Publications

Us Patents

Method And Apparatus For Detecting A Solder Bridge In A Ball Grid Array

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US Patent:
60438762, Mar 28, 2000
Filed:
Oct 8, 1998
Appl. No.:
9/168638
Inventors:
Albert Holliday - Langhorne PA
Ralph E. Stenerson - Newtown PA
Assignee:
Lucent Technologies, Inc. - Murray Hill NJ
International Classification:
G01B 1114
US Classification:
3562371
Abstract:
An apparatus is used to inspect an assembled circuit board having a device assembled to the circuit board by a ball grid array (BGA). The BGA includes a plurality of rows of solder connections. The apparatus has a source of light, which may be a laser. A first deflector is positioned to direct the light into a first side of the BGA, between two adjacent rows of solder connections in the BGA. A second deflector directs any light emitted from a second side of the BGA opposite the first side onto a target. The deflectors may be prisms, mirrors, or optical fibers. The target may be a viewing surface (such as a wall or screen) or a light detector, such as a camera, frame grabber, or photoelectric device. The absence of light on the target while the light is directed into the first side of the BGA indicates the presence of a solder bridge in the BGA. The light source, deflectors and detector may be moved at a constant rate along the length of the BGA, to provide a pattern of alternating light and dark illumination levels.

Heat Sink And Attachment Process For Electronic Components

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US Patent:
59177004, Jun 29, 1999
Filed:
Sep 16, 1997
Appl. No.:
8/932815
Inventors:
Donald L. Clemens - The Colony TX
Theophilus Ifeanyi Ejim - Ringoes NJ
Kon Mang Lin - Pennington NJ
Ralph E. Stenerson - Newtown PA
Assignee:
Lucent Technologies Inc - Murray Hill NJ
Thermalloy Inc. - Dallas TX
International Classification:
H05K 720
US Classification:
361704
Abstract:
A clip assembly and method of attachment for a heat sink having a pin-fin array employing thermally conducting tape to secure the heat sink to a heat dissipating BGA component together with at least one clip assembly which is secured to the underside of the component at its edges.
Ralph E Stenerson from Doylestown, PA Get Report