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Michael Gursky Phones & Addresses

  • 11305 Reflection Isles Blvd, Fort Myers, FL 33912 (610) 987-9138
  • Shillington, PA
  • 19 Essig Dr, Fleetwood, PA 19522 (610) 987-9138
  • Kutztown, PA
  • Sea Isle City, NJ
  • Millersville, PA
  • Lancaster, PA
  • 19 Essig Dr, Fleetwood, PA 19522 (610) 393-2957

Work

Position: Food Preparation and Serving Related Occupations

Education

Degree: High school graduate or higher

Publications

Us Patents

Method Of Bonding Semiconductor Devices To Carrier Tapes

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US Patent:
42838398, Aug 18, 1981
Filed:
Jul 7, 1980
Appl. No.:
6/166440
Inventors:
Michael T. Gursky - Allentown PA
Assignee:
Western Electric Co., Inc. - New York NY
International Classification:
H01L 2150
US Classification:
29589
Abstract:
A carrier tape (20) is provided for assembling components to make semiconductor devices. The tape (20) is made from soft, copper foil (21) and eliminates a plastic substrate (12) of the prior art. Patterns (27) containing clusters (24) of inner leads (28) and (30) are accurately formed into tape (20) for bonding to chips (52). Patterns (27) also contain precisely located sprocket holes (22) for indexing the tape (20) for chip and lead bonding. Tape (20) is indexed for bonding the free ends (36) of inner leads (28) and (30) to pads (54) of chip (52). Then tape (20) is indexed for bonding fixed ends (34) of leads (28) and (30) to stiff outer leads (86). Leads (28) and (30) in cluster (24) are deformed into a precise bell-like shape called a "bug" with chip (52) riding horizontally on top of the bell. Bugging develops flexural and tensile stresses and bonding causes thermal stresses in leads (28) and (30). Such stresses can shift or twist bug (51); warp the structural margin (26) and holes (22) of tape (20), and they can distort adjacent lead clusters (24) on tape (20).

Carrier Tapes For Semiconductor Devices

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US Patent:
42346665, Nov 18, 1980
Filed:
Jul 26, 1978
Appl. No.:
5/928134
Inventors:
Michael T. Gursky - Allentown PA
Assignee:
Western Electric Company, Inc. - New York NY
International Classification:
H02G 1308
H05K 500
H05K 1500
US Classification:
428573
Abstract:
A carrier tape (20) is provided for assembling components to make semiconductor devices. The tape (20) is made from soft, copper foil (21). Patterns (27) containing clusters (24) of inner leads (28) and (30) are accurately formed into tape (20) for bonding to chips (52). Tape (20) is indexed for bonding the free ends (36) of inner leads (28) and (30) to pads (54) of chip (52). Then tape (20) is indexed for bonding fixed ends (34) of leads (28) and (30) to stiff outer leads (86). Leads (28) and (30) in cluster (24) are deformed into a precise bell-like shape called a "bug" with chip (52) riding horizontally on top of the bell. Bugging develops flexural and tensile stresses and bonding causes thermal stresses in leads (28) and (30). Such stresses can shift or twist bug (51); warp the structural margin (26) and holes (22) of tape (20), and they can distort adjacent lead clusters (24) on tape (20). One or more stress relief sites (39) are provided in leads (28) and (30) to uniformly control such stresses.

Guiding An Advancing Strip

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US Patent:
45585814, Dec 17, 1985
Filed:
Sep 16, 1983
Appl. No.:
6/533029
Inventors:
Ray T. Goulstone - Allentown PA
Michael T. Gursky - Allentown PA
John M. O'Boyle - Bethlehem PA
Assignee:
AT&T Technologies, Inc. - Berkeley Heights NJ
International Classification:
B21C 3702
B21C 4734
B26D 714
US Classification:
72379
Abstract:
A strip (10) of delicate foil is advanced longitudinally along a substantially flat path such as along a platen (104) for printing patterns of lead clusters (12) in photoresist on the foil. A margin (28) of strip (10) is formed into a guiding member such as a standing ridge (98), leaving a residue portion (29) in a desirably flat condition. Ridge (98) has a convenient reference edge (102) and a structural angle is formed by ridge (98) with adjacent foil portions. Such angle is sufficiently strong that advancing strip (10) receives no unacceptable deformation as the reference edge (102) is contacted such as to a reference wall (100) for guidance. Strip (10) is biased so the reference edge (102) maintains contact with guiding apparatus so located that the strip follows the desired path. For example, a flat member (122) is biased downward upon the residue portions (29) of strip (10) and the flat path while a side of member (122) is biased against ridge (98) and the reference wall (100). When portions of strip (10) have been printed, the margin (28) may be returned downward and again made coplanar with the residue portion (29) so strip (10) may be wound upon a reel (62).
Michael R Gursky from Fort Myers, FL, age ~58 Get Report