Kabir J Mirpuri

Phoenix, AZ

Semiconductors

Amkor Technology
Director, Fcpop, Fpfccsp, Fccsp Business Unit
Intel Corporation 2012 - 2016
Staff Ic Packaging Materials Engineer
Intel Corporation 2007 - 2011
Senior Ic Packaging Materials Engineer
Intel Corporation 2005 - 2007
Senior Ic Packaging Failure Analysis Engineer

Thunderbird School of Global Management 2013 - 2015
Master of Business Administration, Masters, International Business Indian Institute of Technology, Madras
Masters, Master of Technology Chatrapati Sahuji Maharaj Kanpur University, Kanpur
Bachelor of Engineering, Bachelors Mcgill University
Doctorates, Doctor of Philosophy, Philosophy

R&D
Assembly
Substrates
Silicon
Packaging
Materials Technology
Product Development
Manufacturing
Process Improvement
Statistical Process Control
Failure Analysis
Failure Modes and Effects Analysis
Fmea
Thin Solid Films
Electroplating
Cvd
Ald
Pvd
Back End of Line
Beol
Design of Experiments
Testing
Project Management
Engineering
Lean Manufacturing
Semiconductors
Semiconductor Device Physics
Microelectronics
Cross Functional Team Leadership
Management
Mentoring
Business Development
Operations
Marketing
Finance
Sales
Supply Chain Management
Supplier Development
Supplier Quality Management
Supplier Risk Management
Failure Mode and Effects Analysis
Research and Development

English
Hindi
Gujarati

Phoenix, AZ

Semiconductors

Intel Corporation
Senior Ic Packaging Failure Analysis Engineer
Intel Corporation
Senior Ic Packaging Materials Engineer
Intel Corporation
Senior Packaging Engineer

Mcgill University
Doctorates, Doctor of Philosophy Indian Institute of Technology
Maharaja Sayajirao University
Bachelor of Engineering, Bachelors

Workforce
Collaterals
Market
Suppliers
Pathfinding
Ic Packaging
Windows
Sales
Computing
Flawless Execution
Processors
Joint Development
Supply Chain Management
Mentoring
Finance
Cost Effective
Introducing
Irr
Legal
Design of Experiments
Segmentation
Point of Sale
Https
Management
Revenue
Design
Si
Continuous Improvement
Long Range
Materials Science
Transactional
Ic
Stand Alone
Auditing
Modems
In Process
Source
Accounting
Samsung
Derive
Intercept
Valuation
Thin Client
Metals
Tests
B2B Marketing
Validation
Asia
Engineering
Reports
Internet of Things
Strategy
Gtm
Balance Sheet
Fortune 100
Strategies
Framing
Testing
Circuit
Policy
Disaster Recovery
Complex Analysis
Solution
Robust
Assembly
Camera
Project Management
Product Development
Quality Control
Transitioning
Process Engineering
Capital
Commercial Real Estate
Cost Reduction
Mechanisms
Value Engineering
Root
P&L
.Net
Power
Commodities
Segments
Cash Flow
Npv
Yahoo
Corporate Finance
Scratch
Retail
Operations Experience
Upstream
Debt
Operating Systems
Applications
Analytical Techniques
Transceivers
Intel
Negotiation
Vast
Customer Needs
Operations
Risk Assessment
Marketing
Social Influence
Indian
Failure Analysis
Gaap
Project
Thunderbird
Flows
Intellectual Property
Linkedin
Pricing
Responsibility
Montreal
Usa
Packaging
Glendale
Meaningful
Mass Production
Roadmap
Obtain
Efficient
Oracle Enterprise Manager
Next Gen
Material Handling
Trust
Metallurgy
Price Setting
Global Management
Atms
Materials
Product Engineering
Compliance
Equities
Chennai
Factory
Project Portfolio Management
Business Continuity
Canada
India
Clutter Control
Cash
Manufacturing
Interviews
Collateral
Market Analysis
Semiconductors
Cost Benefit
Supply Chain
Global Sales
Transform
Nextgen
Apple
High Growth
Databases