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Jeffrey Alan Gregus

from Frisco, TX
Age ~57
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Also known as:
Jeffrey A Gregus, Jeffrey M Gregus, Jeff A Gregus, Jeffery A Gregus, Joseph Gregus
Phone and address:
3277 Blue Oak Dr, Frisco, TX 75034
(469) 287-1483
Related to:
Amanda T Gregus, 34
Connected to:
Bryan J Gregus, 36Martin Gregus, 96Micah B Gregus, 35Jason M Greguska, 50Richard A Greguski, 76Shirley F Gregware, 78Heather Grehan, 58Kerry Grehan, 77Kristin L Grehawick, 53Megan E Grehl, 37

Jeffrey Gregus Phones & Addresses

  • 3277 Blue Oak Dr, Frisco, TX 75034 (469) 287-1483
  • 2424 15Th St, Bethlehem, PA 18020 (610) 758-9492
  • Freemansburg, PA
  • Annandale, NJ
  • Lititz, PA
  • Denton, TX
  • 3277 Blue Oak Dr, Frisco, TX 75033 (972) 567-8211

Work

Position: Service Occupations

Education

Degree: High school graduate or higher

Interests

career opportunities, job inquiries, exp...

Industries

Wireless

Public records

Vehicle Records

Jeffrey Gregus

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Address:
3277 Blue Oak Dr, Frisco, TX 75033
Phone:
(469) 287-1483
VIN:
1GNFC13057R182570
Make:
CHEVROLET
Model:
TAHOE
Year:
2007

Resumes

Resumes

Jeffrey Gregus Photo 1

Director Of Operations At Sychip

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Location:
Dallas/Fort Worth Area
Industry:
Wireless
Experience:
SyChip (Public Company; 10,001 or more employees; Wireless industry): Director of Operations,  (January 2000-Present) Senior Operations/Engineering professional with 18 years of experience in R&D, project management, new product development and launch (cradle to grave), outso...

Publications

Us Patents

Flip Chip Metallization

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US Patent:
6597069, Jul 22, 2003
Filed:
Sep 14, 2000
Appl. No.:
09/661741
Inventors:
Yinon Degani - Highland Park NJ
Jeffrey Alan Gregus - Bethlehem PA
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
H01L 2350
US Classification:
257778, 257643, 257673, 257741, 257753, 257780, 257781
Abstract:
The specification describes techniques for applying under bump metallization (UBM) for solder bump interconnections on IC chips with Al bonding sites. The UBM of the invention comprises a copper layer applied directly to the aluminum bonding sites. Reliable bonds are obtained if the Al surface is a nascent surface. Such a surface can be provided by back sputtering an aluminum bonding site, or by a freshly sputtered aluminum layer. The copper layer is deposited on the nascent aluminum surface in e. g. a cluster tool without breaking vacuum. The UBM can be patterned using subtractive techniques.

Method For Coating Heterogeneous Substrates With Homogeneous Layers

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US Patent:
59766379, Nov 2, 1999
Filed:
Nov 6, 1996
Appl. No.:
8/746184
Inventors:
Richard Alan Gottscho - Maplewood NJ
Jeffrey Alan Gregus - Bethlehem PA
Po-Yen Lu - Mendham NJ
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
H05H 120
US Classification:
427573
Abstract:
The present invention is predicated on applicants' discovery that inhomogeneity in films deposited on heated heterogeneous substrates can be substantially reduced by patterning the large area metal structures. Specifically, metal structures having areas in excess of about 2 mm. sup. 2 are patterned so that the metal is within 1 mm of a metal edge. Thus, for example, a normally solid chromium bonding pad on a glass substrate is conveniently made as a patterned, open grid of 1 mm chromium lines. With such patterning, a subsequently deposited layer of silicon nitride has enhanced homogeneity over a large area, including enhanced uniformity of etching rate.

Flip Chip Metallization

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US Patent:
61301418, Oct 10, 2000
Filed:
Oct 14, 1998
Appl. No.:
9/172467
Inventors:
Yinon Degani - Highland Park NJ
Jeffrey Alan Gregus - Bethlehem PA
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
H01L 2130
H01L 2146
US Classification:
438455
Abstract:
The specification describes techniques for applying under bump metallization (UBM) for solder bump interconnections on IC chips with Al bonding sites. The UBM of the invention comprises a copper layer applied directly to the aluminum bonding sites. Reliable bonds are obtained if the Al surface is a nascent surface. Such a surface can be provided by back sputtering an aluminum bonding site, or by a freshly sputtered aluminum layer. The copper layer is deposited on the nascent aluminum surface in e. g. a cluster tool without breaking vacuum. The UBM can be patterned using subtractive techniques.
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Jeffrey Alan Gregus from Frisco, TX, age ~57 Get Report