Inventors:
Jack A. Schroeder - Scottsdale AZ
Ernel R. Winkler - Mesa AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01L 2302
H01L 2312
H01L 3902
Abstract:
An improved VLSI device package and an improved method for contacting VLSI devices, in which the occurrences of wire bond shorts and lead voltage drops are substantially reduced, are obtained by providing multiple lead levels in the package, with the N. sub. 2 leads on the upper lead level grouped into N. sub. 3 bunches separated by N. sub. 4 spaces, where each of the N. sub. 4 spaces aligns with a bonding target on a corresponding one of the N. sub. 1 leads on the lower level leads of the package, and where N. sub. 1