Brian A Gorman

6871126, Mar 22, 2005

Apr 30, 2003

10/427155

Brian A. Gorman - Burton MI, US
Sacha E. Barnes - Grand Blanc MI, US
John T. Wichlacz - Davison MI, US

Donnelly Corporation - Holland MI

G06F007/00

701 36, 165202

A variable blower controller for controlling the blower speed of a climate control system of a vehicle includes a microprocessor which is operable to variably control the blower speed of a blower motor of the climate control system. The variable blower controller provides for smart power management of the blower to avoid high-power dissipative modes when system temperatures are above “safe” levels. The smart power management objective is met by keeping the field effect transistor junction temperature away from design limits or threshold levels where possible. The microprocessor utilizes software and may use a combination of inputs to calculate these levels.

7065435, Jun 20, 2006

Mar 18, 2005

11/084273

Brian A Gorman - Burton MI, US
Sacha E Barnes - Grand Blanc MI, US
John T Wichlacz - Davison MI, US

Donnelly Corporation - Holland MI

G06F 7/00

701 36, 701 1, 318471, 236 493, 307 101

A control system for controlling the climate of a vehicle includes a control element, a temperature sensor, a motor and a microprocessor. The microprocessor may receive a temperature signal indicative of the temperature at the control element and may receive at least one further input. The at least one further input may comprise an input signal indicative of a high side voltage of the motor, a low side voltage of the motor, and/or an electrical current applied to the motor. The control system controls the motor via an output of the microprocessor. The control system may control the motor in response to the temperature signal and the at least one further input. The control system may reduce occurrence of high-power dissipative modes in response to a detection of a temperature above a threshold level via intelligent power management.

8319605, Nov 27, 2012

May 31, 2010

12/790898

Hasib Hassan - Belleville MI, US
John Lu - Grand Blanc MI, US
Brian A. Gorman - Burton MI, US
Alex Porat - Thornhill, CA

Magna Electronics, Inc. - Holland MI

B60R 25/00

340 572, 340 571, 340 532, 340 533, 340 102, 340 105, 340 1331, 34042613, 340447

A remote vehicle control system having a base transceiver mounted in a vehicle and a mobile key fob. The base transceiver utilizes an omni-directional antenna to communicate wirelessly with the key fob via the IEEE 802. 15. 4 communication protocol. Additional antennas are mounted to the vehicle and are also tuned to communicate over the IEEE 802. 15. 4 bandwidth. The additional antennas have radiation patterns extending outwardly to various sides of the vehicle (e. g. , driver, passenger and rear sides). The system provides remote control functions and enables passive keyless entry functions such as unlocking doors or trunk latches by detecting the presence of the key fob proximate to one or more sides of the vehicle based on the ability of the key fob to communicate over IEEE 802. 15. 4 via the additional antennas.

20120262340, Oct 18, 2012

Apr 11, 2012

13/443998

Hasib Hassan - Belleville MI, US
Dale R. Benton - Davison MI, US
John Lu - Grand Blanc MI, US
Brian A. Gorman - Burton MI, US

MAGNA ELECTRONICS INC. - Holly MI

G01S 3/02

342458

A ranging system includes a time of flight subsystem including circuitry incorporated in a mobile node and a base station for generating a TOF signal between the mobile node and the base station, measuring the time taken for transmission of the TOF signal, and generating a TOF distance signal based on the measured time. An accelerometer, mounted in the mobile node, generates an accelerometer signal. A distance filter generates the distance estimate. The filter is configured to (i) initialize the value of a distance estimate signal based on the TOF distance signal, (ii) detect a human step based on variances in the accelerometer signal, and (iii) change the value of the distance estimate signal by a predetermined quantum only upon detection of the human step, the change being positive or negative depending on a direction of the TOF distance signal relative to the distance estimate signal.

20220355745, Nov 10, 2022

Jul 18, 2022

17/813050

- Auburn Hills MI, US
Brian A. Gorman - Burton MI, US
Brian F. Smith - Macomb MI, US
Steven G. Gebauer - Oxford MI, US

B60R 11/04
H05K 7/20
B60R 1/00
H04N 7/18
H04N 5/225

A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imaging array sensor, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. Image data captured by the imaging array sensor is conveyed via a flexible cable to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion of the camera housing.

20200198550, Jun 25, 2020

Mar 2, 2020

16/806100

- Auburn Hills MI, US
Brian A. Gorman - Burton MI, US
Brian F. Smith - Macomb MI, US
Steven G. Gebauer - Oxford MI, US

B60R 11/04
H05K 7/20
B60R 1/00
H04N 7/18
H04N 5/225

A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imager, an imager PCB and a lens barrel. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. The lower side of the main PCB faces a lower housing portion and the upper side of the main PCB faces an upper housing portion. A flexible cable electrically connects electronic circuitry disposed at the imager PCB with electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with the lower housing portion to enhance heat transfer from the electronic component to the lower housing portion.

20190184911, Jun 20, 2019

Feb 25, 2019

16/283920

- Auburn Hills MI, US
Brian A. Gorman - Burton MI, US
Brian F. Smith - Macomb MI, US
Steven G. Gebauer - Oxford MI, US

B60R 11/04
H04N 5/225
H05K 7/20
H04N 7/18
B60R 1/00

A camera module for a vehicular vision system includes a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imager and an imager PCB. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. The lower side of the main PCB faces a lower housing portion and the upper side of the main PCB faces an upper housing portion. The imager assembly includes a flexible cable that connects electronic circuitry disposed at the imager PCB with electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with the lower housing portion. The thermal element includes a thermally conductive resilient material.

20180170279, Jun 21, 2018

Feb 19, 2018

15/899131

- Auburn Hills MI, US
Brian A. Gorman - Burton MI, US
Brian F. Smith - Macomb MI, US
Steven G. Gebauer - Oxford MI, US

B60R 11/04
H05K 7/20
B60R 1/00
H04N 5/225
H04N 7/18

A camera module for a vehicular vision system includes a housing that houses at least (i) an imager assembly and (ii) electronic circuitry disposed at at least two printed circuit boards (PCBs). One of the electronic components of the electronic circuitry disposed at a first PCB includes an imager. A second PCB has electronic components of the electronic circuitry disposed at an upper side and at a lower side of the second PCB. The lower side of the second PCB opposes a lower housing portion and the upper side of the second PCB opposes an upper housing portion. The imager assembly includes a flexible cable that connects electronic components disposed at the first PCB with electronic components disposed at the second PCB. An electronic component is in thermal conductivity with a thermal element, which is in thermal conductivity with the housing.