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Atenafu N Chaneyalew

from Dayton, OH
Age ~63
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Also known as:
Atenafu Chaneya, Atenafu Alelign, Atenaf N Chaneyale, U W, U N
Related to:
Vernetta Jones, 51Shirley Jones, 77Leon Jones, 92Christine Jones, 86Anthony Jones, 53
Connected to:
Adriel Y Chaney, 49Alfred Chaney, 69Alfred R Chaney, 73Amie Chaney, 40Angeline M Chaney, 82Annette D Chaney, 54Antoine N Chaney, 46Austin D Chaney, 43Billie J Chaney, 48Brendan B Chaney, 33

Atenafu Chaneyalew Phones & Addresses

  • Dayton, OH
  • 4021 Clearstream Way, Englewood, OH 45322
  • Aurora, IL
  • Milwaukee, WI
  • Santa Clara, CA
  • Columbus, OH
  • San Jose, CA
  • Montgomery, OH

Resumes

Resumes

Atenafu Chaneyalew Photo 1

Atenafu Chaneyalew

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Business Records

Name / Title
Company / Classification
Phones & Addresses
Atenafu Chaneyalew
Manager
Cabot Microelectronics
Semiconductors · Mfg Industrial Inorganic Chemicals Commercial Physical Research · Semiconductors and Related Devices · Industrial Inorganic Chemicals, NEC · Polishes and Sanitation Goods · Abrasive Products
870 N Commons Dr, Aurora, IL 60504
500 N Commons Dr, Aurora, IL 60504
PO Box 2026, Aurora, IL 60507
(630) 585-9471, (630) 375-6631, (630) 585-5971, (630) 585-9981
Atenafu Chaneyalew
CHANEYALEW & SAINI, INC
Atenafu Chaneyalew
SAINI-CHANEYALEW CORPORATION

Publications

Us Patents

Mixed-Abrasive Polishing Composition And Method For Using The Same

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US Patent:
20040157535, Aug 12, 2004
Filed:
Feb 11, 2003
Appl. No.:
10/364243
Inventors:
Atenafu Chaneyalew - Aurora IL, US
Tao Sun - Naperville IL, US
Assignee:
Cabot Microelectronics Corporation - Aurora IL
International Classification:
B24B001/00
C09K003/14
US Classification:
451/041000, 051/307000
Abstract:
The invention provides a polishing composition comprising (i) an abrasive comprising (a) about 5 to about 45 wt. % of first abrasive particles having a Mohs' hardness of about 8 or more, (b) about 1 to about 45 wt. % of second abrasive particles having a three-dimensional structure comprising aggregates of smaller primary particles, and (c) about 10 to about 90 wt. % of third abrasive particles comprising silica, and (ii) a liquid carrier. The invention also provides a method of polishing a substrate, which method comprises the steps of (i) providing the above-described polishing composition, (ii) providing a substrate having a surface, and (iii) abrading at least a portion of the substrate surface with the polishing composition to polish the substrate.
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Atenafu N Chaneyalew from Dayton, OH, age ~63 Get Report